Patent classifications
B22F2009/046
METHOD FOR MANUFACTURING A LEAD-FREE OR LOW LEAD CONTENT BRASS BILLET AND BILLET THUS OBTAINED
A method for obtaining a lead-free or low lead content brass billet subjects a mixture of lead-free or low lead content brass chips and graphite powder to extrusion, either direct or inverted. The method obtains lead-free or low lead content brass billets.
Technology and process for 3D printing using swarf particles
Disclosed is a technology being implemented in an apparatus for depositing multiple layers of a stream of swarf particles. The stream of swarf particles is generated by interfacing a cutting abrasive wheel on a workpiece. The generated stream of swarf particles may be directed towards a cavity of a die. Multiple layers of stream of swarf particles further results in a 3D printed object that takes the shape of the cavity of the die. The apparatus may also be used to coat substrates. Substrates may include but not limited to metal surfaces, polymers, and ceramics.
Technology and process for 3D printing using swarf particles
Disclosed is a technology being implemented in an apparatus for depositing multiple layers of a stream of swarf particles. The stream of swarf particles is generated by interfacing a cutting abrasive wheel on a workpiece. The generated stream of swarf particles may be directed towards a cavity of a die. Multiple layers of stream of swarf particles further results in a 3D printed object that takes the shape of the cavity of the die. The apparatus may also be used to coat substrates. Substrates may include but not limited to metal surfaces, polymers, and ceramics.
BUILD MATERIAL FORMATION
A device for forming spherical particles may include a receiving chamber having a heating portion and a cooling portion. Wire segments may travel in a free fall through the receiving chamber. While falling through the heating portion, wire segments may be heated to form spherical particles in response to exposure to microwave electromagnetic radiation. While falling through the cooling portion, formed spherical particles cool.
METHOD FOR COLLECTING IRON-BASED POWDER AND METHOD FOR MANUFACTURING SINTERED BODY
A method for collecting an iron-based powder includes the steps of; preparing a raw material powder containing a first metal powder containing 90% by mass or more of iron; forming a green compact by subjecting the raw material powder to uniaxial pressing using a die; machining the green compact; and collecting a second metal powder having an average particle diameter of 50 μm or more and 500 μm or less from machining chips generated in the step of machining.
METHOD FOR COLLECTING IRON-BASED POWDER AND METHOD FOR MANUFACTURING SINTERED BODY
A method for collecting an iron-based powder includes the steps of; preparing a raw material powder containing a first metal powder containing 90% by mass or more of iron; forming a green compact by subjecting the raw material powder to uniaxial pressing using a die; machining the green compact; and collecting a second metal powder having an average particle diameter of 50 μm or more and 500 μm or less from machining chips generated in the step of machining.
METHOD FOR PRODUCING TIAL INTERMETALLIC COMPOUND POWDER AND TIAL INTERMETALLIC COMPOUND POWDER
Provided is a method for producing a TiAl intermetallic compound powder in which it is possible to reduce the number of internal pores. Also provided is a TiAl intermetallic compound powder in which internal pores have been reduced in number. This method for producing a TiAl intermetallic compound powder comprises passing a cutting chips of a TiAl intermetallic compound through a thermal plasma flame and performing a spheroidizing treatment. This TiAl intermetallic compound powder of which a cross section has a porosity of 0-0.4 area %. The TiAl intermetallic compound powder described above is suitable as a raw material powder for use in fabricating a molded article by various powder metallurgy methods and/or layer molding methods.
METHOD FOR PRODUCING TIAL INTERMETALLIC COMPOUND POWDER AND TIAL INTERMETALLIC COMPOUND POWDER
Provided is a method for producing a TiAl intermetallic compound powder in which it is possible to reduce the number of internal pores. Also provided is a TiAl intermetallic compound powder in which internal pores have been reduced in number. This method for producing a TiAl intermetallic compound powder comprises passing a cutting chips of a TiAl intermetallic compound through a thermal plasma flame and performing a spheroidizing treatment. This TiAl intermetallic compound powder of which a cross section has a porosity of 0-0.4 area %. The TiAl intermetallic compound powder described above is suitable as a raw material powder for use in fabricating a molded article by various powder metallurgy methods and/or layer molding methods.
System and Method for Manufacturing Powders from Ductile Materials
A powder production method includes providing at least one elongated member including a ductile material; providing a rotating or vibrating cutter configured to repeatedly cut an end of the at least one elongated member to produce particles; and advancing the at least one elongated member or the cutter towards the other of the at least one elongated member or the cutter to cut the particles from the at least one elongated member to produce a powder comprising a plurality of the particles. The particles produced by the method can have a diameter ranging from about 10 μm to about 200 μm.
System and Method for Manufacturing Powders from Ductile Materials
A powder production method includes providing at least one elongated member including a ductile material; providing a rotating or vibrating cutter configured to repeatedly cut an end of the at least one elongated member to produce particles; and advancing the at least one elongated member or the cutter towards the other of the at least one elongated member or the cutter to cut the particles from the at least one elongated member to produce a powder comprising a plurality of the particles. The particles produced by the method can have a diameter ranging from about 10 μm to about 200 μm.