A chuck for a machine tool having a rotation spindle with a main axis of rotation. The chuck comprises a base plate, a first rotatable plate eccentrically mounted on the base plate, a second rotatable plate eccentrically mounted on the first rotatable plate, balancing means for aligning a principal axis of inertia of the chuck with the main axis of rotation and a holding mechanism. The chuck is provided with an actuating mechanism for angularly displacing the first rotatable plate around a first rotation axis over a first angle of rotation and/or the second rotatable plate around a second rotation axis over a second angle of rotation such that the position of the object with respect to the main axis of rotation can be altered.

A temporary part is mounted onto the chuck of the diamond turning machine. A diamond turning tip of the diamond turning machine is used to form a reference surface on the temporary part, registering a baseline for a motion control system of the diamond turning machine. While the temporary part remains mounted to the diamond turning machine, a workpiece is mounted onto the temporary part, and the diamond tip is controlled relative to the reference surface to diamond turn a surface profile on the workpiece. Because the baseline established by the reference surface compensates for positional variations from mounting parts directly onto the chuck of the diamond turning machine, the length of the workpiece can be shaped to a designated length with a high degree of accuracy.

A method includes placing a first wafer onto a surface of a first wafer chuck, the first wafer chuck including multiple first profile control zones separated by one or more shared flexible membranes. The method also includes setting a first profile of the surface of the first wafer chuck. Setting a first profile of the surface of the first wafer chuck includes adjusting a first volume of a first profile control zone of the multiple first profile control zones. Setting a first profile of the surface of the first wafer chuck also includes adjusting a second volume of a second profile control zone of the multiple first profile control zones, the first volume of the first profile control zone being adjusted independently from the second volume of the second profile control zone, and the second adjustable volume encircling the first adjustable volume.

Methods for making ophthalmic lenses are generally discussed herein with particular discussions extended to plastic injection molded ophthalmic lens molds that are machined or lens buttons located on the injection molds that are machined. The machine process can include setting a lens axis of the ophthalmic lens and machining a ballast that is aligned to a major axis of a toric zone.

A vacuum chuck adapted for mounting on a lower turret assembly. The lower turret assembly is part a sealant liner applicator. The sealant liner applicator includes an upper turret assembly and a sealant gun, under computer control. The sealant gun is used for applying a sealant around a periphery of an inside of a can or jar lid. The vacuum chuck includes in one embodiment an impeller, with spiral vanes, for creating vacuum air. The impeller is mounted on top of an involute. A top portion of the impeller is adapted for receiving the can lid and held thereon using the vacuum air produced when the impeller and the involute are spun at high speeds, in a range of 1000 to 4000 rpm, on a lower turret assembly.

A wafer carrier comprises a first foil, a second foil, and a chamber between the first and the second foil. The first foil has a perforation and is used for carrying the wafer. The first and the second foil are connected to each other so as to form the chamber. The chamber is configured to be evacuated to form a vacuum in the chamber, the vacuum causes an underpressure at the perforation, the underpressure forms a carrying force to the wafer to be carried.

A collet (230) for holding a contact lens mold half (240) during machining of a surface of the mold half (240) comprises a disc (235) having a face and defining: a central structure (250a), at the centre of the face, for receiving a head portion (240a) of the mold half (240), and an elongate recess (250b), in the face, for receiving a tail portion (240b) of the mold half (240), the elongate recess (250b) extending from the central structure (250a) along a radius of the disc (235).

The wafer chuck apparatus has a chuck body that includes an interior and a top surface. A plurality of micro-channel regions is formed in the top surface. Each micro-channel region is defined by an array of micro-channel sections that are in pneumatic communication with each other. The micro-channel regions are pneumatically isolated from each other. One or more vacuum manifold regions are defined in the chuck body interior and are in pneumatic communication with corresponding micro-channel regions through respective vacuum holes. The configuration of the micro-channel regions makes the wafer chuck apparatus particularly useful in chucking wafers that have a substantial amount of warp.

Grinding, lapping and polishing basically work by making scratches in the body being ground, lapped or polished. The scratches typically are linear. The scratches gives rise to a directionality component of friction: the friction coefficient is less in the direction along the scratch than in a direction orthogonal, or across, the scratch. In a wafer handling/chucking situation, one wants the wafer to settle on the chuck, which involves the outer regions of the wafer moving radially with respect to the chuck. One can reduce friction in the radial direction by giving the lapping scratches a preferred orientation, namely, radial. This can be achieved by making the final passes of the lapping tool move predominantly in radial directions.

A chucking apparatus for a workpiece with honeycomb structure includes a table that can be supplied with vacuum and a clamping plate which can be placed on the table and which accommodates the workpiece in the region of an already profiled surface determined by the face ends of the honeycombs, whose receiving surface, which corresponds to the profiled surface of the workpiece, is provided with suction openings to the table. In order to provide advantageous chucking conditions, the clamping plate has an open-cell structure.