The present disclosure relates to a full-automatic deep access ball bonding head device includes: a Z-axis base; a Z-axis sliding stage, which is connected to the Z-axis base in a sliding manner along Z-axis; an EFO mechanism; and a bonding mechanism, which is fixed on the Z-axis sliding stage. The EFO mechanism includes an EFO sliding block, an EFO wand, and a compressed spring. The EFO sliding block is located on the side of the Z-axis sliding stage and connected to the Z-axis base in a sliding manner. The compressed spring is connected between the upper end of the Z-axis sliding stage and the upper end of the EFO sliding block, and the EFO wand is connected to the lower end of the EFO sliding block.

A wire clamping system for fully automatic wire bonding machine comprises a base, a wire clamping support, a wire clamping assembly, a driving mechanism and an elastic assembly. The wire clamping assembly can move relative to the capillary, so that when the wire clamping system completes the second bond, the metal wire at the end of the capillary may directly extend out of the capillary by the independent movement of the wire clamping assembly and a length thereof can be effectively controlled, in order to form a metal ball in the next first bond. Furthermore, when the wire clamping system completes the second bond, the wire clamping assembly is in a clamping state, which avoids wires flying, even though the second bond is not firmly connected or the machine vibrates.

A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.

To provide a wire bonding apparatus, which is insusceptible to a bonding state at a second bonding point due to a wire cut error or the like, or to members such as a capillary and a wire, and is capable of automatically protruding the wire from a leading end of the capillary, provided is a wire bonding apparatus including: a capillary (6) having a through hole through which a wire (40) is to be inserted; a holding unit, which is provided above the capillary (6), and is configured to hold the wire (40) inserted through the capillary (6); and a vibrating unit configured to vertically vibrate the capillary (6). Under a state in which the holding unit holds the wire (40), the vibrating unit vertically vibrates the capillary (6) so that the wire (40) is protruded from the leading end of the capillary.

According to a first aspect of the present invention, there is provided a bond apparatus for bonding a wire to a bonding surface, comprising: a bond head body movably retained by a mounting portion; a first actuator; and a second actuator, wherein the bond head body has a tool portion configured to receive a bonding tool for receiving and bonding the wire and an actuator portion coupled with the first actuator and the second actuator, the first actuator and the second actuator being operative to act on the actuator portion for moving the bond head body with respect to the mounting portion to move the bonding tool with respect to the bonding surface.

An ultrasonic tool including a first end face and a second end face opposite the first end face. A tool lateral surface connects the first and second end face. The ultrasonic tool is elongate in a longitudinal direction of the tool, wherein at least the first end face is designed as a connection contact surface that is arranged for pressing the ultrasonic tool against a connection component, wherein the ultrasonic tool has an end region having the connection contact surface, which end region extends from the connection contact surface in the longitudinal direction of the tool over 15 mm, but at most one third of a length of the ultrasonic tool, toward the opposite end face, and wherein a pocket-shaped and/or blind-hole-like recess having a recess lateral surface and having a recess floor facing the connection contact surface is formed at the tool lateral surface in the end region.

A method for automatically threading wire in a wire bonding apparatus includes the steps of extending a wire tail of a wire from a wire spool, locating the wire tail in a wire locating device and positioning the wire tail at a straightening location of the wire locating device. The wire tail is straightened at the straightening location with a wire manipulating device and then conveyed to a threading location. With a wire threading device, the straightened wire tail is received at the threading location and is threaded through a capillary of the wire bonding apparatus.

Provided are a three-dimensional shaped object production device and method capable of producing a predetermined three-dimensional shaped object by forming a ball at a leading end of a conductive wire through use of the conductive wire based on scanned data or designed data and aligning and stacking the balls. The three-dimensional shaped object production device includes: a plate (40), on which a three-dimensional shaped object is placeable; a ball forming section configured to form a ball (13) by applying high voltage between a leading end of a conductive wire (4) paid out from a leading end of a capillary (12) and a spark rod (19) and melting the leading end of the wire by discharge energy; a positioning device configured to position the plate and the ball forming section by moving the plate and the ball forming section relative to each other; and a bonding section configured to bond the ball formed at the leading end of the capillary to another ball (14) that has already been stacked on the plate, the forming of the ball by the ball forming section, the relative moving of the plate and the ball forming section by the positioning device, and the bonding of the ball formed at the leading end of the capillary to the another ball by the bonding section is repeated, to thereby produce a three-dimensional shaped object having a desired shape.

A method for automatically threading wire in a wire bonding apparatus includes the steps of extending a wire tail of a wire from a wire spool, locating the wire tail in a wire locating device and positioning the wire tail at a straightening location of the wire locating device. The wire tail is straightened at the straightening location with a wire manipulating device and then conveyed to a threading location. With a wire threading device, the straightened wire tail is received at the threading location and is threaded through a capillary of the wire bonding apparatus.

A cleaning material, device, and method for predictably cleaning the capillary tube for a wire bonding machine in which the cleaning pad has a predetermined configuration appropriate for the particular wire bonding machine and a substrate having a defined functionalized surface topology and geometry which can be introduced into the wire bonding machine during the normal wire bonding operations. The cleaning material has a predetermined topography with a plurality of functional 3-dimensional (3D) microstructures that provide performance characteristics which are not possible with a non-functionalized and flat surface.