A laser engraving device includes a carrier substrate, a position detecting module, and a laser engraving module. The carrier substrate is used to carry at least one wafer, and the at least one wafer has a first engraving area formed thereon. The position detecting module includes a first transmitting component and a first receiving component. The laser engraving module includes a first laser generator to provide a first laser light source. The position detecting module can provide a first position signal of the first engraving area by matching the first transmitting component and the first receiving component. Therefore, the light from the first laser light source generated by the first laser generator can be precisely projected onto the first engraving area of the at least one wafer according to the first position signal so as to form a first predetermined pattern on the first engraving area.

A system for path command generation includes an industrial machine, an interface accessible via a remote device, and a server communicably coupled to the industrial machine and the remote device via a network. The server includes processing circuitry configured to calculate an optimum path command, simulate the optimum path command based on the calculation of the optimum path command, calculate a cycle time and error of the path command, determine if the path command is acceptable, and transmit path command data to the industrial machine in response to the acceptable path command being selected.

A system for path command generation includes an industrial machine, an interface accessible via a remote device, and a server communicably coupled to the industrial machine and the remote device via a network. The server includes processing circuitry configured to calculate an optimum path command, simulate the optimum path command based on the calculation of the optimum path command, calculate a cycle time and error of the path command, determine if the path command is acceptable, and transmit path command data to the industrial machine in response to the acceptable path command being selected.

A laser machining method includes obtaining a movement direction in which a head that variably makes a shape of a radiation locus using a laser is being moved by a robot that causes the head to move along a machining line, and adjusting the radiation locus made by the head to keep a constant relative angle between the movement direction obtained by the obtaining and a representative angle of the shape of the radiation locus.

The invention refers to an apparatus for laser material processing having a beam deflecting unit (16) for deflecting the laser beam, a parallel-offsetting unit (14) including at least three reflecting mirrors (26, 28, 30), wherein one reflecting mirror (26) of the at least three reflecting mirrors for the parallel-offset of the laser beam is rotatable, and a focusing device (18) for focusing the laser beam on a workpiece (20) to be processed.

A laser machining device includes a laser light source, a spatial light modulator which includes a display unit, an objective lens, an image-transfer optical system, a camera and a controller. The controller executes first display processing and second display processing. According to first display processing, when the camera captures the image, the display unit displays a first phase pattern for adjusting a condensing position of laser light condensed by the objective lens to a first condensing position. According to second display processing, when the camera captures the image, the display unit displays a second phase pattern for adjusting the condensing position of the laser light condensed by the objective lens to a second condensing position different from the first condensing position in an irradiation direction of the laser light.

Disclosed herein is a laser apparatus including: a laser oscillator configured to generate a laser beam; a plurality of mirror mount assemblies each arranged in one of predetermined reference transmission steps, each of the mirror mount assemblies including: a mount-side reflective mirror configured to reflect and transmit the laser beam; and an aligner configured to change alignment of the mount-side reflective mirror to adjust a machining optical path through which the laser beam transmitted by the mount-side reflective mirror travels; a laser nozzle assembly including a laser nozzle configured to radiate the laser beam transmitted from the mirror mount assembly located in the last step of the reference transmission steps onto an object to be processed; a database configured to store big data constructed to include optical path adjustment data indicating a pattern of selective adjustment of the machining optical path by the mount-side reflective mirror linked with the aligner according to a driving method of the aligner; and a controller configured to correct, when distortion occurs in the machining optical path, the distortion of the machining optical path by selectively driving the aligner provided in each of at least one mirror mount assembly among the mirror mount assemblies based on the big data using a driving method according to a pattern of the distortion of the machining optical path.

A method for adjusting swinging of a galvanometer is provided in implementations of the disclosure. The method includes the following operations. Guide a processing laser to a laser processing surface via a first galvanometer, and establish a first correspondence between a reference coordinate system of the laser processing surface and coordinate-ranges of swinging angles of the first galvanometer. Perform region division on the laser processing surface in the reference coordinate system to obtain P calibrating selected-regions of the laser processing surface. Determine coordinate of a swinging angle of the first galvanometer corresponding to one of target points in Q calibrating selected-regions in the P calibrating selected-regions according to the first correspondence, to obtain coordinates of Q swinging angles of the first galvanometer. Establish a second correspondence between the reference coordinate system of the laser processing surface and coordinate-ranges of swinging angles of a second galvanometer.

A cutting apparatus includes a cutting unit configured to cut a workpiece held on a chuck table, and a groove detecting unit including a CCD imaging element photographing the workpiece held on the chuck table. The groove detecting unit photographs, by the CCD imaging element, a laser-processed groove and a cut groove illuminated by an oblique illumination set such that a light amount of light in a direction parallel with an extending direction of the laser-processed groove as viewed in plan is higher than a light amount of light in a direction orthogonal to the extending direction of the laser-processed groove.

A laser alignment system is used to align an output fiber with a fiber laser, for example, when coupling a feeding fiber to a process fiber using a beam coupler or switch. The alignment system includes a laser alignment apparatus that is coupled at a first end to the output fiber and at a second end to a beam dump/power meter. The alignment apparatus defines a light passage and a light capture chamber along the light passage. When light is not aligned into the core of the output fiber, at least a portion of the light passing out of the output fiber will be captured by the light capture chamber and detected by a photodetector in optical communication with the light capture chamber. By monitoring the readings of the photodetector, the output fiber may be properly aligned with the laser light from the fiber laser.