The present invention relates to a process for cutting and separating interior contours in thin substrates of transparent materials, in particular glass. The method involves the utilization of an ultra-short pulse laser to form perforation or holes in the strengthened (e.g., ion exchanged) glass substrate, that may be followed by use of another, focused, laser beam to promote full separation about the perforated line.

A laser machining apparatus capable of extending the life time of a guide laser is provided. A laser machining apparatus 1 includes a cutting head 2 that irradiates a machining laser light to a machining target W, a guide laser 5 that irradiates a visible guide light to the machining target W, and a power supply 6 that supplies electric power to the guide laser 5. The laser machining apparatus 1 further includes a controller 7 that performs control so that, before the machining laser light is irradiated from the cutting head 2 to the machining target W and laser cutting starts, electric power is supplied from the power supply 6 to the guide laser 5, and the guide light is irradiated from the guide laser 5 to the machining target W according to an output position of the machining laser light output from the cutting head 2 so that the output position of the machining laser light is ascertained. The controller 7 has a laser output setting unit 4 capable of adjusting an output of the guide light of the guide laser 5 within a range where the visibility of the guide light is secured when the guide light is output from the guide laser 5.

Laser processing machines, such as laser cutting machine (LM), including a work table receiving workpiece (W), and work arm (1) with a laser cutting head (2). Laser cutting head (2) includes nozzle receiving device (7) and nozzle (D). Via nozzle (D) laser beam (11) may be directed onto work piece (W). Machine (LM) includes main drives moving work arm (1) and/or the laser cutting head (2) on X-Y-Z axes to process work piece (W), as well as an alignment unit to adjust laser beam (11). An adjusting station (3) includes receiving unit (31) fixing nozzle (D) and/or the nozzle receiving device (7) during centering of nozzle (D). The alignment unit has head element (5B) in laser cutting head (2). Head element (5B) receives nozzle (D) and/or the nozzle receiving device (7) and is slidable in X-Y directions, via the main drives. Head element (5B) may be fixed in a selected position, within the laser cutting head (2), via clamping device (12) releasable during nozzle centering at adjusting station (3).

A method of producing a microstructured component includes a multiplicity of micro-functional elements on a substrate that carries an array of pixel-forming micro-light-emitting diodes on an electrical supply structure, including laser processing in at least one method stage in a laser processing station under control of a control unit, the method stage including positioning a workpiece to be processed in a processing position of the laser processing station by a workpiece movement system in reaction to movement signals of the control unit, the method including: observing the workpiece in a camera-based manner by a camera system, the observing including capturing at least one portion of the workpiece lying in the object field of a camera and also generating an image representing the portion; evaluating the image by image processing to ascertain position data representing an actual position of at least one structural element of the workpiece in the object field.

A system includes a plurality of sensors at distinct and separate locations, each of the distinct and separate locations being equidistant from a region that is configured to pass light that propagates along a beam path, the sensors being configured to sense radiation from an optical element positioned to interact with light that propagates on the beam path; and a controller including one or more electronic processors and a computer-readable medium, the computer-readable medium including instructions that, when executed, cause the one or more electronic processors to receive an output from each of the sensors, the output of each sensor including an indication of an intensity of the radiation detected by the sensor, and analyze the received output to determine a position of the light that propagates along the beam path.

An optical apparatus includes a rotatable reflecting member including a first reflecting surface and a second reflecting surface, an optical system including a plurality of reflecting surfaces and configured to sequentially reflect light having been reflected at the first reflecting surface at the plurality of reflecting surfaces to make the light incident on the second reflecting surface, a driving part configured to change an angle of the reflecting member, a control unit configured to control the driving part to change a path of light emitted from the reflecting member after being reflected at the second reflecting surface, and a light incident portion configured to recognize a position of the light having been reflected at the first reflecting surface.

Provided are a method and a device for adjusting an optical axis of laser light, capable of accurately grasping change in the state of the laser light and maintaining the quality of laser processing. The method for adjusting an optical axis of laser light includes: a step of detecting a position of laser light by position sensitive detectors arranged at two or more detection positions on an optical path of the laser light that is output from a laser light source toward a workpiece; and a step of adjusting, based on the detected position of the laser light, at least one of a position and an angle of optical elements arranged at two or more positions on the optical path of the laser light, to adjust an optical axis of the laser light.

A laser welder alignment system includes a laser welder, a camera associated with the laser welder configured to capture images of a loaded product within the laser welder, and a controller in communicative association with the laser welder and the camera. The controller receives visualization data from the camera and, based on the visualization data, forms and sends positioning instructions to the laser welder instructing the laser welder so as to position the loaded product at a proper weld start. The laser welder alignment system also verifies proper positioning of the loaded product within the laser welder, and verifies proper rotation of the loaded component by determining whether the rotating product has a wobble that exceeds a pre-defined wobble tolerance.

The invention refers to an apparatus for laser material processing having a beam deflecting unit (16) for deflecting the laser beam, a parallel-offsetting unit (14) including at least three reflecting mirrors (26, 28, 30), wherein one reflecting mirror (26) of the at least three reflecting mirrors for the parallel-offset of the laser beam is rotatable, and a focusing device (18) for focusing the laser beam on a workpiece (20) to be processed.

An optical scanning device includes: a light projector configured to radiate light while causing the light to make angular movement at a constant speed; and a light reflector configured to reflect the light radiated from the light projector to guide the light to an intended irradiated point on a predetermined scanning line. The light reflector includes a plurality of reflecting portions and reflects, at least twice, the light radiated from the light projector to guide the light to the intended irradiated point. The reflecting portions each include a plurality of reflecting surfaces. A length of an optical path from the light projector to the irradiated point is substantially constant for all of irradiated points on the scanning line, and a scanning speed, on the scanning line, of the light radiated from the light projector is substantially constant.