Reference light receiver (300) receives reference light (RL) reflected by second reflecting surface (200b) of folding mirror (200). Partial light receiver (600) receives a part of laser light (LB) reflected by partial reflection mirror (500). Controller (14) detects an abnormality in an inclination angle of first reflecting surface (200a) of folding mirror (200) with respect to an optical path of laser light (LB) incident on first reflecting surface (200a) of folding mirror (200) based on an output of reference light receiver (300), and detects an abnormality in a spot of laser light (LB) on an irradiated object based on an output of partial light receiver (600).

An optical device for detecting the drift of a light beam of a laser machining system includes a beam splitter for obtaining a first light beam along a first optical path and a second light beam along a second optical path. The optical device further includes a focal module positioned at least partially along the first optical path to obtain a focused light beam that is directed towards a first light beam matrix detection means positioned in a focusing plane associated with the focal module. The optical device also includes an afocal module positioned at least partially along the second optical path to obtain a collimated light beam that is directed towards a second light beam matrix detection means.

A method for aligning multiple optical components in an optical system including placing a sphere at a first position that is at a center of curvature of a first optical component, and aligning a focus of a first reference signal with the sphere at the first position. Then, moving the sphere along an axis of optical symmetry to a second position that is at a center of curvature of a second optical component, and aligning a focus of a second reference signal with the sphere at the second position. The first optical component is aligned with the first reference signal and fixing the first optical component, and the second optical component is aligned with the second reference signal and fixing the second optical component.

A laser machining system for machining a workpiece uses a laser beam, preferably for cutting or welding a workpiece using a laser beam. The laser machining system includes a machining head with a housing having an opening for emitting the laser beam from the machining head, a measuring device configured to direct an optical measurement beam through the opening, and an optical unit for aligning the laser beam and the optical measurement beam, the optical unit being settable to adjust the laser beam and the optical measurement beam perpendicular to the optical axis of the machining head in the region of the opening. The measuring device is further configured to determine a setting of the optical unit corresponding to the central alignment of the laser beam on the basis of measurement values based on reflections of the optical measurement beam for different settings of the optical unit.

An additive manufacturing system includes one or more processors configured to determine one or more geometrical characteristics of each of multiple segments of a build part at a candidate position of the build part relative to an additive manufacturing instrument. The one or more geometrical characteristics include an angle of incidence between a beam line extending from an electromagnetic energy source of the additive manufacturing instrument and a surface normal of a respective skin of the corresponding segment proximate to the beam line. The one or more processors are configured to determine, based on one or more geometrical characteristics of the segments at the candidate position, one or more locations of support material to be formed adjacent the build part during a build process of the build part.

A pulsed laser apparatus for milling a sample is described. The apparatus includes a pulsed laser, a scan head for scanning a beam from the pulsed laser across the sample and an F-theta lens for focusing the scanned beam onto the sample. The apparatus may also include a liquid bath for milling the sample under the liquid, such as water. Methods of pulsed laser milling are also described.

In a method for severing a solid body, a defined contour is stored in a control unit configured to detect contour breaches and to avoid contour breaches. A high-energy beam is moved along a contour on a surface of the solid body, with the surface of the solid body facing the high-energy beam, to produce with the high-energy beam a cutting gap. The contour on the surface is compared with the defined contour stored in the control unit, and avoidance of the contour breach is automatically deactivated when the contour on the surface of the solid body matches the defined contour and a contour breach is detected. Otherwise, the contour is omitted. Advantageously, the high-energy beam travels along the contour with an averaged line movement.

The present invention relates to a method for generating control data for the secondary machining of a solid body (1), in particular wafer, which is modified by means of laser beams (10). The interior of said solid body (1) has multiple modifications (12), said modifications (12) having been produced by means of laser beams (10). The method comprises the following steps: defining a criterion of analysis for analyzing the modifications (12) produced in the interior of the solid body (1); defining a threshold value with respect to the criterion of analysis, an analytical value on one side of the threshold value triggering a secondary machining registration; analyzing the wafer by means of an analytical unit (4), said analytical unit (4) analyzing the modifications (12) with respect to the criterion of analysis and outputting analytical values regarding the analyzed modifications, said analytical values lying above or below the threshold value; outputting location data with respect to the analyzed modifications, said location data containing information regarding in which region(s) of the solid body (1) the analytical value lie above or below the threshold value; and generating control data for controlling a laser treatment device (11) for the secondary machining of the solid body (1), said control data comprising at least the location data of the modifications (12) registered for secondary machining.

Some embodiments may include a galvanometric laser system, comprising: a laser device to generate a laser beam; an X-Y scan head module to position the laser beam on a work piece, the X-Y scan head module including a laser ingress to receive the laser beam and a laser egress to output the laser beam; a support platen located below the laser egress; an in-machine imaging system integrated with the galvanometric laser, wherein a camera of the in-machine imaging system is arranged to view a surface of an object located on the support platen using one or more optical components of the X-Y scan head module to generate assessment data associated with a calibration of the X-Y scan head module by imaging the surface of the object, wherein a calibration fiducial is located on the surface of the object.

A laser crystallizing apparatus may include a laser light source, an optical system, and an optical module. The laser light source may generate a laser beam. The optical system may convert the laser beam into a line laser beam. The optical module may disperse energy of the line laser beam in a first direction for generating a dispersed line laser beam. The first direction may be perpendicular to a lengthwise direction of the optical module.