In one embodiment, a method of drilling a feature in a substrate includes directing a pulsed laser beam focal line into the substrate at a plurality of locations, the laser beam focal line generating an induced absorption within the substrate such that the laser beam focal line produces a perforation extending through a thickness of the substrate at the plurality of locations to form a perforation contour. The method further includes directing a focused ablation laser beam into the substrate and ablating at least a portion of the substrate along an ablation track that is offset from the perforation contour by a perforation-ablation offset .sub.nP-Ablation to remove substrate material within a shape defined by the perforation contour to form the feature. The perforation-ablation offset .sub.nP-Ablation is such that the feature has a chipping with chips having a size of less than 50 m.

A laser machine able to effectively satisfy cutting quality required on one side of a cutting spot of a workpiece. The laser machine comprising a machining head configured to emit a laser beam and an assist gas coaxially and non-coaxially; and a data table in which data of a machining condition for cutting a workpiece using the machining head, and a shift amount, by which a center axis of the assist gas is to be shifted from an optical axis of the laser beam in order to make cutting quality on both sides of a cutting line to be different during cutting the workpiece, are stored in associated with each other.

An adapter for coupling a laser treatment device to an object for treatment. The adapter has an input side, which may be fixed relative to the laser treatment device, by a locking mechanism and which may be fixed to the object, for alignment of the object relative to the laser treatment device. A scanned laser beam is introduced on the input side, from the laser treatment device, along a beam path to the object with a reference structure. The reference structure lies on the beam path of the adapter and may be optically detected by means of the laser beam scanned over the region.

A scanner head for laser material processing with a laser beam includes focusing optics, and a beam position system that influences a position of the laser beam and is upstream of the focusing optics in a direction of propagation of the laser beam. The beam position system includes at least two controllable movable optical elements by means of which an angle of incidence of the laser beam on a processing surface of a workpiece is adjustable. A processing location of the laser beam on the processing surface is also movable in two dimensions. A beam position sensor is downstream of the beam position system and is configured to detect an actual position of the laser beam or at least four independent position parameters of the laser beam.

Disclosed are systems and methods to plan a path to form a part using an additive manufacturing system. The additive manufacturing system may include one or more additive manufacturing tools. The additive manufacturing tools may include arc welding tools and non-arc welding tools. The system may also manufacture the part based on the planned path.

A workpiece processing machine that includes: a beam emission head for providing a beam for processing the workpiece, an optical interferometer for splitting, redirecting, and detecting the beam, an adjustment element for changing a second portion of a power of the beam redirected from a retroreflector to a detector, and a control unit for actuating the adjustment element to control a ratio between a first power portion of the beam redirected from the workpiece to the detector and the second power portion of the beam redirected from the retroreflector to the detector to a target ratio.

The present invention relates to a sensor device for determining alignment/misalignment of a laser beam relative to a gas nozzle of a laser machining head which comprises a sensor housing provided with mounting means adapted to mount the housing to a laser machining head, a camera device comprising a camera, the camera device is provided in the sensor housing, so that the camera faces the tip of the gas nozzle when the sensor housing is mounted to the laser machining head for visualizing an orifice of the gas nozzle and a pilot laser simultaneously, and output means for outputting image signals obtained by the camera.

A substrate has a first surface with at least one division line formed thereon and a second surface opposite the first surface. The substrate is processed by applying a pulsed laser beam from the side of the first surface. The substrate is transparent to the pulsed laser beam. The pulsed laser beam is applied at least in a plurality of positions along the at least one division line, a focal point of the pulsed laser beam located at a distance from the first surface in the direction from the first surface towards the second surface, so as to form a plurality of modified regions inside the substrate. Each modified region is entirely within the bulk of the substrate, without any openings open to the first surface or the second surface. Substrate material is removed along the at least one division line where the modified regions are present.

A method for controlled machining of a workpiece includes focusing a laser light beam on a target point of the workpiece to generate a laser focus point. An optical distance measuring device gathers measuring data to determine a distance between the target point and a laser target optics. The workpiece is positioned in relation to the laser focus point based on the distance measuring data gathered. The distance measuring device is a confocal optical distance measuring device having a measuring light source for generating a measuring light and having a variable-focal-length measuring lens system. The focal length of the variable-focal-length measuring lens system is varied over time to gather distance measuring data at different focal length values of the variable-focal-length measuring lens system. A device for controlled machining includes a laser light source, a laser target optics, a distance measuring device, a positioning device, and an evaluation and control unit.

A laser crystallizing apparatus may include a laser light source, an optical system, and an optical module. The laser light source may generate a laser beam. The optical system may convert the laser beam into a line laser beam. The optical module may disperse energy of the line laser beam in a first direction for generating a dispersed line laser beam. The first direction may be perpendicular to a lengthwise direction of the optical module.