A method of calibrating a focal point of a laser apparatus inscribed in a parallelepiped rectangle R defined by a longitudinal axis, X, a vertical axis, Y defining a plane P and a lateral axis, Z. The method uses a laser apparatus for treating a window that includes a mounting means to mount a decoating apparatus on the window mounted in situ.

The invention relates to a method for laser welding a first component to a second component, comprising: placing the first component on the second component; applying a welding mask comprising a flat contact surface to the first component to press the first component onto the second component, the welding mask comprising a through-passage for a laser beam, defining a welding area on the first component, the contact surface at least partially surrounding said passage; emitting a laser beam by a head into the passage of the welding mask, to form a weld bead joining the first component to the second component in the welding area; wherein the welding mask is rigid and rigidly joined to the laser head and the focal length of the laser is constant, the constant focal length being ensured by the rigid mask.

A three-dimensional laser machine includes a machine head, a controller for positioning the machine head and controlling an orientation of a nozzle, and a sensor for detecting a distance between a workpiece and the nozzle. The controller is capable of performing a profile control of correcting the position of the machine head based on the detected distance. When the machine head has reached a predetermined position part way through an approach process of moving the machine head from an approach start position to a machining start position while controlling the pose of the nozzle, the controller performs the profile control to move the machine head to the machining start position.

Provided are a laser machining device and a laser machining method capable of stably operating an autofocus function without causing an unfavorable state such as an overshoot etc. A laser machining device and a laser machining method of the present invention performs a normal AF (autofocus) control when a scan position of the machining laser light and the detecting laser light is located in a work central portion, and performs a slow-tracking AF (autofocus) control with a trackability to a displacement of a main surface of a work reduced to be lower than a trackability of the normal AF control when the scan position of the machining laser light and the detecting laser light is located in a work end portion.

The application is related to a laser transfer apparatus and a method performed by the laser transfer apparatus. The laser transfer apparatus may include: a laser oscillator configured to perform irradiation with a laser beam; a first stage movably disposed below the laser oscillator; a second stage movably disposed below the first stage; a flatness measurement sensor; and a controller. The controller may be configured to control, once a transfer substrate on which a plurality of light emitting diodes (LEDs) are arranged is loaded on the first stage, and a target substrate is loaded on the second stage, the flatness measurement sensor to measure flatness of each of the transfer substrate and the target substrate, and adjust a height of at least one of the first stage or the second stage based on the flatness.

A laser processing apparatus includes a branching unit configured to branch a laser beam to a first optical path and a second optical path, a condenser configured to condense the branched laser beams on a processing face of a workpiece, an output power measuring unit configured to measure the output power of the laser beam emitted from a laser beam generation unit and having passed through the condenser, and a blocking member positioning mechanism disposed between the condenser and the output power measuring unit and capable of positioning a blocking member between a first laser beam blocking position at which the blocking member blocks only the laser beam of the first optical path from between the branched laser beams and a retracted position at which the blocking member blocks none of the laser beams.

A laser processing apparatus includes a laser light output section, a laser light scanning section, a distance measurement light emitting section which emits distance measurement light, a pair of light receiving elements which receives the distance measurement light emitted from the distance measurement light emitting section and reflected by the workpiece, optical axes of the pair of light receiving elements being arranged inside the housing so as to sandwich an optical axis of the distance measurement light emitting section, a distance measuring section which measures a distance to the surface of the workpiece, and a light receiving lens which is arranged such that each of the optical axes of the pair of light receiving elements passes through the light receiving lens, and condenses the distance measurement light that has been reflected by the workpiece on respective light receiving surfaces of the pair of light receiving elements.

Provided is a method for refining magnetic domains of grain-oriented electrical steel plates including: a steel plate supporting roll position adjusting step of controlling a vertical direction position of the steel plate while supporting the steel plate; a laser radiating step of melting the steel plate by radiating a laser beam to form grooves on the surface of the steel plate; and a setting and maintaining step of setting and maintaining an internal operation environment of a laser room in which the laser radiation is performed, so as to increase magnetic domain refinement efficiency and improve workability by optimizing equipment and processes, thereby increasing the processing capacity.

A plurality of values measured are relatively compared to determine an optical axis deviation direction in which an optical axis of a measurement beam S deviates from a laser beam L. In performing laser welding in the optical axis deviation direction, an irradiation position of the measurement beam S is changed so that the irradiation position of the measurement beam S is moved to a rear side of the center of the optical axis of the laser beam L in the welding direction.

The invention relates to a method for engraving, marking and/or labelling a workpiece using a laser plotter, as well as a laser plotter in which at least one beam source in the form of a laser is provided in a housing of the laser plotter, into which the item to be machined is inserted. The workpiece is placed on a processing table, and a laser beam emitted by the beam source is sent via deflecting elements to at least one focusing unit, from which the laser beam is deflected in the direction of the workpiece and is focused for the processing. The control, in particular the position control of the laser beam to the workpiece, takes place via a software running on a control unit, so that the workpiece is processed line by line by movement of a sliding carriage. Preferably on an external component, in particular a computer or a control unit, a graphic and/or a text is created, which is transmitted to the control unit of the laser plotter, which performs a conversion of the transmitted data, in particular the graphic and/or the text, for controlling the individual elements of the laser plotter. A laser pointer of the laser is positioned on or in the area of the workpiece after insertion of the workpiece into the working area, whereupon after activation of the machining process or a focusing process preferably a position correction is performed. Subsequently, a distance measurement to a surface of the workpiece is performed, and the data acquired are transferred to the control unit, which then calculates a position of the working table for the optimum focal point of the laser, taking into account predetermined parameters, in particular the replaceable laser lens used, and subsequently the processing table is shifted.