Accurate processing is performed. A laser processing apparatus includes a light irradiator that irradiates a processing target object with a laser beam based on a processing model, a measurer that measures a distance from the light irradiator to the processing target object based on reflected light of the laser beam from the processing target object, and a processing controller that performs processing control based on the measured distance.

This laser irradiation mechanism includes a control unit which has a function allowing the focal point of a laser beam to describe a circle, performs control such that the focal point describes a spiral, and performs control such that the central axis of the spiral moves along a curved surface.

Systems and methods for dicing a sample by a Bessel beam matrix are disclosed. The method for dicing a sample by a Bessel beam matrix may comprise generating a Bessel beam matrix including multiple Bessel beams arranged in a matrix form, according to a predetermined dicing layout of the sample; controlling a focus position of each Bessel beam in the generated Bessel beam matrix; and focusing simultaneously the Bessel beams of the Bessel beam matrix at the respective controlled focus positions within the sample for dicing.

A laser processing apparatus includes a laser light output section, a laser light scanning section, a distance measurement light emitting section which emits distance measurement light, a pair of light receiving elements which receives the distance measurement light emitted from the distance measurement light emitting section and reflected by the workpiece, optical axes of the pair of light receiving elements being arranged inside the housing so as to sandwich an optical axis of the distance measurement light emitting section, a distance measuring section which measures a distance to the surface of the workpiece, and a light receiving lens which is arranged such that each of the optical axes of the pair of light receiving elements passes through the light receiving lens, and condenses the distance measurement light that has been reflected by the workpiece on respective light receiving surfaces of the pair of light receiving elements.

A laser processing apparatus includes a laser light output section, a first scanner and a second scanner, a distance measurement light emitting section, a reference member which is arranged at a position which is the other end of a correction optical path formed with the distance measurement light emitting section as one end of the correction optical path and is arranged such that an optical path length of the correction optical path is a predetermined reference distance, a distance measurement light receiving section which receives distance measurement light reflected by the workpiece or the reference member, a distance measuring section which measures a distance to the workpiece or the reference member, and a distance correcting section which compares a measurement result of the distance to the reference member with the reference distance stored in advance to correct the measurement result obtained by the distance measuring section.

A method for controlled machining of a workpiece includes focusing a laser light beam on a target point of the workpiece to generate a laser focus point. An optical distance measuring device gathers measuring data to determine a distance between the target point and a laser target optics. The workpiece is positioned in relation to the laser focus point based on the distance measuring data gathered. The distance measuring device is a confocal optical distance measuring device having a measuring light source for generating a measuring light and having a variable-focal-length measuring lens system. The focal length of the variable-focal-length measuring lens system is varied over time to gather distance measuring data at different focal length values of the variable-focal-length measuring lens system. A device for controlled machining includes a laser light source, a laser target optics, a distance measuring device, a positioning device, and an evaluation and control unit.

A system uses a femtosecond laser beam to polish a surface of an optical element to optical smoothness. The system includes a fixture, a laser system, and a controller. The fixture holds the optical element. The laser system generates the femtosecond laser beam. The femtosecond laser beam includes converging laser pulses with a pulse duration less than 900 femtoseconds. The controller controls relative positioning of the surface of the optical element and the femtosecond laser beam so that a waist of the femtosecond laser beam is outside the optical element and 0.5-2.0 Rayleigh ranges away from the surface of the optical element. Also, an intensity of the femtosecond laser beam at the surface of the optical element is sufficient to ablate the surface.

Laser cutting a dieboard using a laser cutting system, including: setting a width of material to be removed from the dieboard using the laser cutting system; capturing an image of the width of the material removed by the laser cutting system using at least one image capture unit; measuring the captured width of the material captured on the image using the at least one image capture unit; and comparing the measured width of the material to the set width of the material, and moving a laser head of the laser cutting system up and down to adjust a focal length of the laser cutting system and moving the laser head of the laser cutting system sideways to adjust a speed of the laser head, until the measured width and the set width are substantially similar.

A method for the optoinjection of exogenous material in a recipient biological cell is disclosed and comprises: placing a biological cell on a planar surface of a substrate, transmitting a sub-ns pulsed laser beam through a variable convergence/divergence collimator; focusing the laser beam in a focal spot positioned along an axial direction substantially perpendicular to the substrate; moving the focal spot towards the cell along the axial direction by continuously varying the electric control signal from a first amplitude value a second amplitude value the second amplitude value of the control signal is selected such that the second axial position is positioned inside the cell.

This disclosure describes laser machining head cutting gas nozzles that include an inner nozzle having a nozzle opening configured to form a core gas flow, an outer nozzle having an annular gap surrounding the nozzle opening and configured to form an annular gas flow, and a sleeve in the annular gap, wherein the sleeve is arranged to be axially displaceable between a rearward position and a forward position, wherein the sleeve projects beyond the inner nozzle at least when in the forward position, and wherein the sleeve widens a cross-sectional area of the outer nozzle to a variable degree as the sleeve is displaced from the rearward to the forward position. Methods of using a cutting gas nozzle are also described.