Patent classifications
B23K26/048
LASER ABLATION SPECTROMETRY APPARATUS
Apparatus for laser induced ablation spectroscopy (LIBS) is disclosed. An apparatus can have a computer, a pulsed laser and a lightguide fiber bundle that is subdivided into branches. One branch can convey a first portion of the light to a first optical spectrometer and a different branch can convey a second portion of the light to another optical spectrometer. The first spectrometer can be relatively wideband to analyze a relative wide spectral segment and the other spectrometer can be high dispersion to measure minor concentrations. The apparatus can further comprise an unbranched lightguide fiber bundle to provide more light to a low sensitivity spectrometer. The apparatus can include an inductively coupled plasma mass spectrometer ICP-MS and a computer instructions operable to provide normalized LIBS/ICP-MS composition analyses.
Laser containment structure for a laser printhead
A laser printhead assembly for a laser printhead is disclosed herein. The laser printhead assembly may include a laser containment door; and a laser containment housing that is configured to form a sealed enclosure with a label support of a rewriteable label. The sealed enclosure may be configured to include the rewriteable label and the laser printhead. The laser containment door, in a laser-enabled position, may be configured to permit the laser printhead, via a light beam, to modify the rewriteable label and the laser containment door, in a laser-disabled position, may be configured to prevent a light beam from escaping the laser containment housing.
LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
The laser processing apparatus according to this disclosure includes a laser oscillator to generate laser light, a processing table to place a workpiece thereon, the workpiece having a protective sheet on a surface thereof, the protective sheet including a laser light absorbing layer, a laser head to process the workpiece with the laser light, and a control unit to adjust a position of the laser head so that a focal position of the laser light is brought to a position away from the surface of the workpiece toward the laser head, and to control power of the laser light so that marking is provided by causing the laser light absorbing layer to absorb the laser light and thus transforming the inside of the protective sheet.
Method for detecting the operating condition of an optical element arranged along a propagation path of a laser beam of a machine for processing a material, system for carrying out said method and laser processing machine provided with said system
A method and system for detecting an operating condition of an optical element along a propagation path of a power laser beam in a laser processing machine head are based on a first signal of a back-propagating optical radiation at the wavelength of the laser beam; a second signal of a back-propagating optical radiation having a wavelength in the near infrared; a third signal of an optical radiation emitted by the optical element in the infrared in proximity to its surface; a fourth signal which is a function of the time-of-flight of an acoustic wave launched through the volume of the optical element.
INITIAL DISTANCE APPROACH FOR LASER PROCESSING
In an example method, a laser processing head is moved from an entrance region over a workpiece to a starting position above the workpiece. During this time, a distance control system is used to control the distance between the laser processing head and the workpiece based on measurements obtained from one or more distance sensors. Further, the laser processing head is moved from the starting position to a position beyond an edge of the workpiece. During this time, the distance control system is disengaged. When the laser processing head reaches the position beyond an edge of the workpiece, laser emission is initiated, and the laser processing head is moved back towards the starting position. Upon reaching the starting position, the distance control system is reengaged. The laser processing head is subsequently moved along a pre-determined path to cut the workpiece.
PROCESSING APPARATUS
A processing apparatus includes: a beam irradiation apparatus that is configured to irradiate an object with an energy beam; and a beam deflection apparatus that is configured to change a propagating direction of the energy beam toward the beam irradiation apparatus, wherein when the energy beam propagating toward the beam irradiation apparatus from the beam deflection apparatus propagates in a first direction, the beam irradiation apparatus emits the energy beam in a second direction, and when the energy beam propagating toward the beam irradiation apparatus from the beam deflection apparatus propagates in a third direction that is different from the first direction, the beam irradiation apparatus emits the energy beam in a fourth direction that is different from the second direction.
APPARATUS AND METHOD FOR REMOVING AT LEAST ONE PORTION OF AT LEAST ONE COATING SYSTEM PRESENT IN A MULTI-GLAZED WINDOW MOUNTED ON A STATIONARY OR MOBILE OBJECT
An apparatus for removing at least one portion of at least one coating system present in a multi-glazed window that includes at least two glass panels alternatively separated by at least one interlayer and forming multiple interfaces. The apparatus includes a decoating device with a laser source that generates a laser beam having a specific direction. The decoating device further includes an orientation means configured to control the direction of the laser beam.
APPARATUS AND METHOD FOR REMOVING AT LEAST ONE PORTION OF AT LEAST ONE COATING SYSTEM PRESENT IN A MULTI-GLAZED WINDOW MOUNTED ON A STATIONARY OR MOBILE OBJECT
An improved apparatus for removing at least one portion of at least one coating system present in a multi-glazed window including at least two glass panels alternatively separated by at least one interlayer and forming multiple interfaces; the apparatus includes a decoating device including a laser source that generates a laser beam having a specific direction and two motors configured to displace the decoating device along a plane P, defined by a longitudinal axis X and a transversal axis Y, the decoating device further includes an orientation means to control the direction of the laser beam.
LASER MARKING HEAD AND LASER MARKING MACHINE
A laser marking head and a laser marking machine are disclosed. The laser marking head includes: a laser generator, the laser generator being configured to emit laser; a first guide rail; a first sliding device, the first sliding device being sleeved on and being capable of sliding on the first guide rail; a first reflector, the first reflector being positioned on the first sliding device; a second guide rail, the second guide rail being fixed on the first sliding device and being perpendicular to the first guide rail; a second sliding device, the second sliding device being sleeved on and being capable of sliding on the second guide rail; and a second reflector, the second reflector being positioned on the second sliding device.
DOUBLE-SIDED MACHINING LASER MACHINE TOOL
A double-sided machining laser machine tool is provided for machining a workpiece having opposite first and second machining surfaces. The machine tool includes a laser machining apparatus and a mechanical arm. The laser machining apparatus includes a laser source, a light guiding-and-focusing lens assembly, a three-axis moving stage, an optical inspection device, and a control device. The control device drives the three-axis moving stage moving the workpiece to a machining horizontal coordinate and a machining altitude according to a current horizontal coordinate and a current altitude of the work piece. The control device drives the laser source and the light guiding-and-focusing lens assembly focusing the laser light to the first machining surface. The mechanical arm is controlled by the control device. When the machining of the first machining surface is finished, the mechanical arm flips over the workpiece to allow the laser machining apparatus to machine the second machining surface.