A substrate processing apparatus includes an imaging device configured to image a first substrate held by a holder; a modifying device configured to form a modification layer by radiating laser light to an inside of the first substrate held by the holder along a boundary between a peripheral portion of the first substrate as a removing target and a central portion thereof; a first moving device configured to move the holder and the imaging device relatively; and a controller configured to control the holder, the imaging device, the modifying device, and the first moving device. The controller controls the holder, the imaging device and the first moving device to perform the focus adjustment of the imaging device and/or the imaging by the imaging device while moving the holder and the imaging device relatively.

A spectral interference height detecting apparatus includes a chuck table for holding a workpiece thereon and a height detecting unit for detecting the height of an upper surface of the workpiece held on the chuck table. The height detecting unit includes a light source for emitting light in a predetermined wavelength band into a first optical path, a condenser disposed in the first optical path for converging light onto the workpiece held on the chuck table, a beam splitter disposed between the light source and the condenser for splitting the light in the first optical path into a second optical path, a mirror disposed in the second optical path to form a basic optical path length, for reflecting light into the second optical path and returning light through the beam splitter to the first optical path.

The application is related to a laser transfer apparatus and a method performed by the laser transfer apparatus. The laser transfer apparatus may include: a laser oscillator configured to perform irradiation with a laser beam; a first stage movably disposed below the laser oscillator; a second stage movably disposed below the first stage; a flatness measurement sensor; and a controller. The controller may be configured to control, once a transfer substrate on which a plurality of light emitting diodes (LEDs) are arranged is loaded on the first stage, and a target substrate is loaded on the second stage, the flatness measurement sensor to measure flatness of each of the transfer substrate and the target substrate, and adjust a height of at least one of the first stage or the second stage based on the flatness.

Provided is a workpiece edge position detection device with which it is possible to accurately detect the position of a workpiece edge even under conditions in which an inclined portion is present on the workpiece. A workpiece edge position detection device includes: a control unit that controls the position of a machining head, on which a gap sensor is mounted, such that a spacing with respect to the workpiece as detected by the gap sensor remains fixed while the machining head is scanned along the surface of the workpiece; and a workpiece edge detection unit that, during execution by the control unit of the control for keeping the gap fixed, detects the position of an end section of the workpiece on the basis of the coordinate position of the machining head when the amount of variation in the spacing between the gap sensor and the workpiece has reached or exceeded a prescribed threshold value.

A machining head is provided for a laser machining system configured to machine a workpiece using a laser beam. The machining head includes a housing having an opening for emitting the laser beam from the machining head; at least one reflective reference at the housing; and a measuring device configured to direct an optical measurement beam towards the opening and the at least one reflective reference. The measuring device is further configured to determine a distance (d1) between the end portion and the workpiece on the basis of a first reflection (A) of the optical measurement beam from the at least one reflective reference and a second reflection (B) of the optical measurement beam from the workpiece.

In a laser processing apparatus, a height of a focusing lens in a processing unit can be changed according to a change in height of an upper surface of a wafer, thereby changing a vertical position of a focal point of a laser beam inside the wafer. Accordingly, the laser beam can be applied to the wafer as feeding the wafer in a condition where the focal point is set at a vertical position spaced a fixed distance from the lower surface of the wafer. As a result, a modified layer can be formed inside the wafer at a uniform height from the lower surface of the wafer.

Apparatus for laser induced ablation spectroscopy (LIBS) is disclosed. An apparatus can have a computer, a pulsed laser and a lightguide fiber bundle that is subdivided into branches. One branch can convey a first portion of the light to a first optical spectrometer and a different branch can convey a second portion of the light to another optical spectrometer. The first spectrometer can be relatively wideband to analyze a relative wide spectral segment and the other spectrometer can be high dispersion to measure minor concentrations. The apparatus can further comprise an unbranched lightguide fiber bundle to provide more light to a low sensitivity spectrometer. The apparatus can include an inductively coupled plasma mass spectrometer ICP-MS and a computer instructions operable to provide normalized LIBS/ICP-MS composition analyses.

A laser processing apparatus includes a support portion, a first laser processing head, a second laser processing head, a first vertical movement mechanism, a second vertical movement mechanism, a first horizontal movement mechanism, a second horizontal movement mechanism, and a controller configured to control rotation of the support portion, emission of a first and a second laser lights from the first and the second laser processing heads, and movement of a first and a second focusing points.

A processing head for a laser processing device adapted for processing a workpiece using laser radiation has: adjustable focusing optics to focus laser radiation in a focal spot having an adjustable distance from the processing head; an optical coherence tomograph to measure a distance between the processing head and the workpiece by measuring an optical interference between measuring light reflected by the workpiece and measuring light not reflected by the workpiece; a path length modulator that can change, synchronously with and dependent on a change of the focal spot distance from the processing head, an optical path length in an optical path along which measuring light propagates; a scanning device, which deflects the laser radiation in different directions; and a control device, which i) controls a focal length of the focusing optics in such a way that the focal spot is situated at a desired location on the workpiece, ii) receives, from the coherence tomograph, information representing the distance between the processing head and the workpiece, and iii) uses information received from the coherence tomograph for a continuous correction of a positioning of the focal spot on the workpiece.

A galvano scanner unit vibrates a laser beam when sheet metal is cut by irradiation of the sheet metal with the laser beam while a machining head is relatively moved with respect to the sheet metal. A focusing lens drive section moves a focal point of the laser beam with which the sheet metal is irradiated in an orthogonal direction orthogonal to a surface of the sheet metal. A focal position control section controls the focusing lens drive section to locate the focal point of the laser beam in a predetermined position in the orthogonal direction. A galvano control section controls the galvano scanner unit to change an amplitude with which the laser beam is vibrated, according to a position of the focal point in the orthogonal direction.