A method of manufacturing a display apparatus includes: forming a plurality of displays including a light-emitting diode on a surface of a first mother substrate; preparing a second mother substrate; forming a first sealed area on a surface of at least one of the first mother substrate or the second mother substrate, wherein the first sealed area surrounds each of the plurality of displays and includes a frit; firstly bonding the first mother substrate to the second mother substrate by melting the frit in the first sealed area by radiating a first laser beam; and secondly bonding the first mother substrate to the second mother substrate by forming a second sealed area in which the frit and the first mother substrate, and/or the frit and the second mother substrate, are melted and mixed with each other by radiating a second laser beam partially in the first sealed area.

A method for fusion welding of one or more steel sheets (1, 2) made of press-hardened steel, preferably manganese-boron steel is disclosed. At least one of the steel sheets has a metallic coating (4) which contains aluminum, and the fusion welding is performed while filler material (11) is being fed into the molten bath (9). In order to improve the hardenability of the weld seam (14), irrespective of whether the steel sheets to be welded together are steel sheets of the same or different material grades and/or steel sheets of different sheet thicknesses, a single laser focal spot (16) with different energy distribution is generated on the molten bath by means of one or more optical elements such that the laser focal spot (16) has a smaller laser focal spot area (16.1) and a larger laser focal spot area (16.2).

A processing system is a processing system that processes an object by processing light, and is provided with: an inspection apparatus that performs an extraneous substance inspection in an inspection target area on a surface of the object; and an irradiation apparatus that irradiates the inspection target area with the processing light.

Provided are a systems and methods for manufacturing objects by solid freeform fabrication, especially titanium and titanium alloy objects, wherein the deposition rate is increased by using two separate heat sources, one heat source for heating the deposition area on the base material and one heat source for heating and melting a metallic material, such as a metal wire or a powdered metallic material.

A semiconductor fabrication apparatus includes a source chamber being operable to generate charged particles; and a processing chamber integrated with the source chamber and configured to receive the charged particles from the source chamber. The processing chamber includes a wafer stage being operable to secure and move a wafer, and a laser-charged particles interaction module that further includes a laser source to generate a first laser beam; a beam splitter configured to split the first laser beam into a second laser beam and a third laser beam; and a mirror configured to reflect the third laser beam such that the third laser beam is redirected to intersect with the second laser beam to form a laser interference pattern at a path of the charged particles, and wherein the laser interference pattern modulates the charged particles by in a micron-zone mode for processing the wafer using the modulated charged particles.

A laser processing apparatus has a laser beam applying unit for applying a laser beam to a workpiece held on a chuck table. The laser beam applying unit includes an elliptical spot forming member for changing the spot shape of a pulsed laser beam into an elliptical shape and making the major axis of the elliptical beam spot parallel to a feeding direction, a diffractive optical element for branching the pulsed laser beam having the elliptical beam spot obtained by the elliptical spot forming member, into a plurality of pulsed laser beams each having an elliptical beam spot whose major axis extends in the feeding direction, and a condensing lens for condensing each of the pulsed laser beams branched by the diffractive optical element to the workpiece in such a manner that the major axes of the elliptical beam spots of the pulsed laser beams branched are partially overlapped.

An optical connector includes: an enclosure having a light propagation space; a glass block disposed at an end of the enclosure; an output beam fiber that: extends from an exterior of the enclosure through the light propagation space and connects to the glass block, and includes: a beam core that propagates an output laser beam; and a cladding disposed around the beam core; and an optical feedback fiber that: extends from an interior of the light propagation space to an exterior of the enclosure, and includes a feedback core to which light propagating within the light propagation space couples.

The present disclosure relates to systems and methods for performing large area laser powder bed fusion (LBPF) to form a plurality of layers of a 3D part in a layer-by-layer fashion using meltable powder particles. In one implementation the system makes use of a first light source, which may be a diode laser subsystem, for generating a first light pulse of a first duration. The first light is used to preheat a substrate underneath a new layer of powder particles, wherein the substrate is formed from a previously fused quantity of the powder particles. A second light source, which may be a pulse laser, generates a second light pulse subsequent to the first light pulse. The second light pulse has a second duration shorter than the first duration by a factor of at least about 10, and fully melts the new layer of powder particles in addition to the substrate, to achieve a smooth printed layer. The wavelength of the first light pulse also differs from a wavelength of the second light pulse.

Provided is a laser reflow apparatus for reflowing electronic components on a substrate disposed on a stage, the apparatus including: a laser emission unit comprised of a plurality of laser modules for emitting a laser beam having a flat top output profile in at least one section of the substrate on which the electronic components are disposed; a camera unit comprising at least one camera module for capturing a reflowing process of the electronic components performed by the laser beam; and a laser output control unit configured to generate a control signal for independently controlling the respective laser modules of the laser emission unit based on a signal output from the camera unit and apply the control signal to the laser emission unit.

A laser processing apparatus includes a process laser light source, a first optical system, a pulse laser light source, a second optical system, and an optical detection portion. The process laser light source generates a process laser beam having a continuous energy density during a certain period of time. The first optical system directs the process laser beam to a surface of a workpiece. The pulse laser light source generates a pulse laser beam having an energy density with a peak value that is higher than the energy density of the process laser beam. The second optical system directs the pulse laser beam to a process portion of the workpiece. The optical detection portion detects plasma light produced at the process portion of the workpiece.