A method for cutting workpieces of different thicknesses includes providing at least one unprocessed laser beam, selectively forming a processing laser beam from the at least one unprocessed laser beam in accordance with a thickness of the workpiece, and cutting the workpiece with the processing laser beam. Forming the processing laser beam includes selectively coupling one or more unprocessed laser beams into one or more of a plurality of parallel, non-concentric fibers of a compound fiber, the plurality of fibers of the compound fiber having different cross-sectional shapes. A laser beam characteristic of the processing laser beam exiting the compound fiber differs depending upon which fibers of the compound fiber receive the at least one unprocessed laser beam, the laser beam characteristic of the processing laser beam differing depending on the thickness.

An additive manufacturing apparatus includes a platform, a dispenser configured to deliver a plurality of successive layers of feed material onto the platform, at least one light source configured to generate a first light beam and a second light beam, a polygon mirror scanner, an actuator, and a galvo mirror scanner. The polygon mirror scanner is configured to receive the first light beam and reflect the first light beam towards the platform. Rotation of the first polygon mirror causes the light beam to move in a first direction along a path on a layer of feed material on the platform. The actuator is configured to cause the path to move along a second direction at a non-zero angle relative to the first direction. The galvo mirror scanner system is configured to receive the second light beam and reflect the second light beam toward the platform.

Methods of separating a glass web include exposing a separation path on the glass web to a laser beam that produces thermal stress along the separation path without damaging the glass web. The methods further include redirecting a portion of the laser beam to create a defect on the separation path while the separation path is under thermal stress produced during the exposing the separation path on the glass web to the laser beam, whereupon the glass web separates along the separation path in response to creating the defect. Apparatus are further provided for separating a glass web with at least one laser beam generator that produces a laser beam to heat a separation path and a mirror configured to reflect an end portion of the laser beam to create a defect at a location of the separation path on the glass web.

A plurality of values measured are relatively compared to determine an optical axis deviation direction in which an optical axis of a measurement beam S deviates from a laser beam L. In performing laser welding in the optical axis deviation direction, an irradiation position of the measurement beam S is changed so that the irradiation position of the measurement beam S is moved to a rear side of the center of the optical axis of the laser beam L in the welding direction.

A laser processing apparatus includes first and second laser oscillators that emit first and second laser lights (LB1), (LB2) having wavelengths different from each other, an optical fiber that guides first and second laser lights (LB1), (LB2), and laser head (50) configured to condense first and second laser lights (LB1), (LB2), respectively, at predetermined positions of a workpiece. Laser head (50) includes optical path difference generation unit (70) provided inside second housing (51). Optical path difference generation unit (70) is configured to make an optical path length of first laser light (LB1) inside second housing (51) longer than an optical path length of second laser light (LB2).

A layer on a substrate is laser annealed by pulses in a plurality of laser beams formed into a uniform line beam. The laser beams are partitioned into a first set of beams and a second set of beams. The second set of beams is incident onto the layer from a smaller range of angles than all of the beams combined. Pulses in the beams are synchronized such that pulses in the first set of beams are incident on the layer before pulses in the second set of beams. Pulses in the first set of beams melt the layer and pulses in the second set of beams sustain melting.

A busbar includes: a plurality of members that are platy; and a welding area in which two of the members are welded, the welding area being linear and extending in a first direction, the welding area being provided approximately between both ends of at least one of the two members in the first direction.

The disclosure relates to methods and systems for deep welding a workpiece, a surface of the workpiece being irradiated by a first laser beam and a second laser beam. In a workpiece surface plane (OE) a first beam width B1 of the first laser beam is larger than a second beam width B2 of the second laser beam and in at least the workpiece surface plane (OE) the second laser beam lies inside the first laser beam. The intensity of the first laser beam alone is sufficient to produce a keyhole in the workpiece. The keyhole produced in the workpiece has a width KB in the workpiece surface plane (OE), KB substantially equaling B1, and B2≤0.75*KB. The methods and systems provide good seam quality, high penetration depth, and high welding speed.

A method of manufacturing a window and a window manufactured by the same are provided. A method of manufacturing a window includes laser cutting a base glass into a preliminary window using first laser light, irradiating, with second laser light, a point spaced apart from an edge of the preliminary window at a first distance, and providing a window including a flat portion and an edge portion by wet etching the preliminary window irradiated with the second laser light. A method of manufacturing a window having a chamfer shape at the edge portion is facilitated.

Devices and methods for cutting an opening from a workpiece. The apparatus comprises a first emitter and a second emitter, a power of a first laser emitted by the first emitter being smaller than a power of a second laser emitted by the second emitter. The apparatus further comprises a laser head, an image sensor, and a processing unit. The laser head is coupled to the first and second emitters and adapted to move adjacent to a first side of a workpiece and direct the first and second lasers onto the first side. The image sensor is configured to receive the first laser to form an image of the first laser. The processing unit is configured to determine a difference between a profile of the image of the first laser and a predetermined profile of an opening to be cut from the workpiece.