Systems and techniques for processing materials using wavelength beam combining for high-power operation in concert with interferometry to detect the depth or height of features as they are created.

A method of laser processing a material to form a separated part. The method includes focusing a pulsed laser beam into a laser beam focal line, viewed along the beam propagation direction, directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a hole or fault line along the laser beam focal line within the material, and directing a defocused carbon dioxide (CO.sub.2) laser from a distal edge of the material over the plurality of holes to a proximal edge of the material.

A semiconductor laser oscillator includes a diode unit configured from a plurality of banks, in which one bank is configured from a plurality of laser diodes connected in series. The diode unit includes a wavelength locking mechanism for locking to a plurality of wavelengths. The semiconductor laser oscillator includes a controller configured to control input currents to the laser diodes of each of the plurality of banks individually in correspondence to a characteristic of a wavelength locking efficiency, and to control an output of the diode unit as a whole to a required output.

Systems and techniques for processing materials using wavelength beam combining for high-power operation in concert with interferometry to detect the depth or height of features as they are created.

A system for and a method of processing a transparent material, such as glass, using an adjustable laser beam line focus are disclosed. The system for processing a transparent material includes a laser source operable to emit a pulsed laser beam, and an optical assembly (6) disposed within an optical path of the pulsed laser beam. The optical assembly (6) is configured to transform the pulsed laser beam into a laser beam focal line having an adjustable length and an adjustable diameter. At least a portion of the laser beam focal line is operable to be positioned within a bulk of the transparent material such that the laser beam focal line produces a material modification along the laser beam focal line. Method of laser processing a transparent material by adjusting at least one of the length of the laser beam focal line and the diameter of the laser beam focal line is also disclosed.

In a fiber laser system (1) for outputting a laser beam obtained by combining a plurality of laser beams outputted by driving the respective fiber laser unit (2a, 2b, 2c), a control section (7) controls a plurality of current sources (6a, 6b, 6c) so that there are time intervals of a certain time between peaks which appear in a case where respective powers of the laser beams rise.

A method of laser processing a material to form a separated part. The method includes focusing a pulsed laser beam into a laser beam focal line, viewed along the beam propagation direction, directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a hole or fault line along the laser beam focal line within the material, and directing a defocused carbon dioxide (CO.sub.2) laser from a distal edge of the material over the plurality of holes to a proximal edge of the material.

The present application describes a system for cutting a substrate (102) that is transparent within a predetermined range of wavelengths in the electromagnetic spectrum and will include an edge when extracted from a sheet of substrate (102). The system generally includes a laser (104) capable of emitting light along a light path and of a predetermined wavelength that is within the range of wavelengths in which the substrate (102) is transparent; an optical device (106) positioned in the light path of the laser; and an interface block (108) composed of a material that is transparent over at least a portion of the predetermined range of wavelengths in the electromagnetic spectrum in which the substrate (102) is also transparent, wherein said interface block (108) is positioned in said light path and between the substrate (102) and said optical element (108).

Disclosed is a UV-visible laser system having ultrashort pulses with high power and/or high energy. The laser system includes at least one non-linear optical crystal (1) adapted for receiving two distinct ultrashort laser pulses (31, 32) in the visible or infrared domain emitted respectively by two distinct laser pulse sources (11, 12) and a temporal synchronisation unit (41, 42) adapted so that the two ultrashort laser pulses (31, 32) are superimposed in time and space in the non-linear optical crystal (1) with any phase shift, and generate, by sum frequency, an ultrashort laser pulse (131) having an optical frequency equal to the sum of the respective optical frequencies of the two distinct laser pulses (31, 32).

A laser device has a plurality of semiconductor lasers, a driving device that supplies a driving electric current to the semiconductor laser, a trigger generation circuit that sends a trigger signal to the driving device in order to output the driving electric current, and a wave-combining device that wave-combines laser light emitted from the semiconductor lasers at the combined-wave end, and at least any one of a signal transmitting time, an electric current transmitting time and a light transmitting time is adjusted so as to be the time set respectively for transmitting paths; wherein the signal transmitting time in which the trigger signal transmits over the signal path, the electric current transmitting time in which the laser light transmits over the electric current path, a light transmitting time in which the laser light transmits over the optical path.