Embodiments of a method of forming one or more holes in a substrate for use as a process chamber component are provided herein. In some embodiments, a method of forming one or more holes in a substrate for use as a process chamber component include forming the one or more holes in the substrate with one or more laser drills using at least one of a percussion drilling, a trepanning, or an ablation process, wherein each of the one or more holes have an aspect ratio of about 1:1 to about 50:1, and wherein the substrate is a component for gas delivery or fluid delivery.

The present disclosure relates to fluid injection valves. Embodiments of the teachings thereof may include a valve needle for a fluid injection valve and a fluid injection valve. For example, a valve needle for a fluid injection valve may include: a needle shaft; and a sealing ball welded to a tip of the needle shaft. The welded joint between the sealing ball and the needle shaft comprises at least two separate weld seams extending along a perimeter of the valve needle in the form of c-shaped arcs.

A laser slicing apparatus for dividing a workpiece with a laser beam, including: a light shielding area detection section that detects light shielding areas existing on a side of a first surface of the workpiece; and a control section that radiates a first laser beam from the side of the first surface so as to scan across a whole area of the first surface of the workpiece and form a first modified layer in a to-be-sliced plane inside the workpiece, and that radiates a second laser beam to the light shielding areas of the workpiece from a second surface on an opposite side of the first surface and form a second modified layer in such a manner that the second modified layer is continuous with the first modified layer in the to-be-sliced plane.

A laser machining method is a laser machining method for joining a first member containing a first metal and a second member containing a second metal different from the first metal, the method including a first step of forming a joint in which the first metal and the second metal are melted by performing scanning with a first laser beam, and a second step of stirring a metal structure near the joint by performing scanning, on a rear side in a scanning direction of the first laser beam, with a second laser beam having a beam diameter larger than a bean diameter of the first laser beam and having a lower power density than a power density of the first laser beam.

This invention provides an effective and a method of laser processing for separating semiconductor devices formed on a single substrate (6) or separating high thickness, hard and solid substrates (6), which is rapid. During preparation of the device or substrate (6) for the cleaving/breaking/dicing procedure an area of damage (8, 11) is achieved by obtaining deep and narrow damage area along the intended line of cleaving. The laser processing method comprises a step of modifying a pulsed laser beam (1) by an focusing unit (1), such as that an spike-shaped beam convergence zone, more particularly an above workpiece material optical damage threshold fluence (power distribution) in the bulk of the workpiece (6) is produced. During the aforementioned step a modified area (having a spike-type shape) is created. The laser processing method further comprises a step of creating a number of such damage structures (8, 11) in a predetermined breaking line by relative translation of the workpiece (6) relative the laser beam (1) condensation point.

An optical communication cable and related systems and methods are provided. The optical cable includes a plurality of wrapped core elements, and the outer surfaces of adjacent wrapped core elements are joined together by discrete bond sections. The discrete bonds sections may be structures such as laser welds, ultrasonic welds, or adhesive material. The discrete bonds hold the wrapped core elements together in the wrapped pattern, such as an SZ stranding pattern.

The invention provides a preparation method of a low temperature poly-silicon thin film, a preparation method of a low temperature poly-silicon thin film transistor, and a laser crystallization apparatus, and belongs to the technical field of display. The preparation method of a low temperature poly-silicon thin film of the invention comprises: forming an amorphous silicon thin film on a transparent substrate; and performing laser annealing on said amorphous silicon thin film from a side of said amorphous silicon thin film departing from said substrate, and performing laser irradiation from a side of said substrate departing from said amorphous silicon thin film, to form a low temperature poly-silicon thin film. The preparation method of a low temperature poly-silicon thin film of the invention may not only perform laser annealing on an amorphous silicon thin film form a side of the amorphous silicon thin film departing from the substrate, but also perform laser irradiation from a side of the substrate departing from the amorphous silicon thin film, and the temperature of the amorphous silicon thin film can be retained by performing laser irradiation from a side of the substrate departing from the amorphous silicon thin film. In this way, the crystallization period of poly-silicon may be elongated, and it is possible to obtain crystal grains with larger sizes, to increase carrier mobility, and to reduce drain current.

A unit for a turbocharger can include a turbine wheel portion that includes a turbine wheel material and a turbine wheel axis; a shaft portion that includes a shaft material and a shaft axis where the shaft material includes a molybdenum content less than 0.5 percent by weight; and a weld that includes a nail shape in cross-section where a head portion of the nail shape includes an axial dimension of approximately 1 mm or less and wherein a shank portion of the nail shape includes an axial dimension of approximately 0.4 mm or less.

A flexure hinge with two material segments connected to each other via a material tapering to a thin spot which defines a pivot axis between the two material segments. The material segments are provided with recesses such that the strength existing in the thin spot with respect to normal stresses or bending stresses is kept largely constant within a distance from the thin spot.

A method for surface treatment of a roll, in which a laser is emitted on a roll surface to fabricate a pattern, includes a section allocation operation in which the roll surface is divided into multiple sections, and a pattern fabrication operation in which the roll is rotated in a circumferential direction, and a random pattern is fabricated on each of the fabrication sections, and an apparatus includes an apparatus frame, a fixing unit which is installed on the apparatus frame, supports a roll, and rotates in a circumferential direction of the roll, a laser unit which is installed on the apparatus frame, and emits a laser to the roll so that a pattern received may be formed on the roll surface through etching, and a displacement unit which is installed on the apparatus frame, and moves the laser unit along a lengthwise direction of the roll.