A method for selectively irradiating a powder layer in additive manufacturing of a component. The method including: determining an irradiation pattern of the layer for additive manufacturing, wherein a first partial pattern is defined which is intended for continuous irradiation and comprises a plurality of irradiation vectors and wherein a second partial pattern is defined, which is intended for a pulsed irradiation, with the first and the second partial pattern being selected in such a manner that the second partial pattern connects irradiation vectors of the first partial pattern, and irradiating the layer in accordance with the irradiation patterns defined. A computer program product, an irradiating device, and a control unit for controlling an irradiating device are included.

A method for selectively irradiating a powder layer in additive manufacturing of a component. The method including: determining an irradiation pattern of the layer for additive manufacturing, wherein a first partial pattern is defined which is intended for continuous irradiation and comprises a plurality of irradiation vectors and wherein a second partial pattern is defined, which is intended for a pulsed irradiation, with the first and the second partial pattern being selected in such a manner that the second partial pattern connects irradiation vectors of the first partial pattern, and irradiating the layer in accordance with the irradiation patterns defined. A computer program product, an irradiating device, and a control unit for controlling an irradiating device are included.

A protective film substance for laser processing includes a solution including a water-soluble resin, an organic solvent, and a light absorbent. The solution has an absorbance, i.e., an absorbance converted for a solution diluted 200 times, equal to 0.05 or more per an optical path length of 1 cm at a wavelength of 532 nm. Alternatively, the protective film substance for laser processing includes a solution including a water-soluble resin, an organic solvent, and a polyhydroxyanthraquinone derivative.

An electronic device includes a support member and a mount member mounting on the support member. The support member and the mount member are sealed by a resin member. The support member includes a surface having a laser irradiation mark. The mount member includes a surface having a rough portion with an accumulation of material of the support member.

An electronic device includes a support member and a mount member mounting on the support member. The support member and the mount member are sealed by a resin member. The support member includes a surface having a laser irradiation mark. The mount member includes a surface having a rough portion with an accumulation of material of the support member.

A welded joint comprising: a pair of steel base materials having a sheet thickness of 0.4 to 4.0 mm, and at least one of which has a tensile strength of 780 MPa or more; and a weld metal that welds the pair of steel base materials, wherein, when the weld metal is seen in plan view, a weld toe of the weld metal has peaks and valleys, an average distance in a direction orthogonal to a weld line direction between a top point of a peak and a bottom point of a valley that are adjacent to one another is 3.0 mm or less, and an average number of a total of peaks and valleys, at which the distance in the direction orthogonal to the weld line direction between the top point of the peak and the bottom point of the valley that are adjacent to one another is 0.1 mm to 3.0 mm, is 2 to 30/15 mm, and an automobile component having the welded joint.

A laser beam application unit of a laser processing machine includes a laser oscillator that emits a laser beam, an fθ main lens that focuses and applies the laser beam which has been emitted from the laser oscillator, to a workpiece held on a holding table, a scan unit that is arranged on an optical path between the laser oscillator and the fθ main lens, scans the laser beam, and guides the resulting scanned laser beam to the fθ main lens, and an fθ sub-lens that is arranged on the optical path between the laser oscillator and the scan unit and converts the laser beam from parallel light into diffused light.

A laser beam application unit of a laser processing machine includes a laser oscillator that emits a laser beam, an fθ main lens that focuses and applies the laser beam which has been emitted from the laser oscillator, to a workpiece held on a holding table, a scan unit that is arranged on an optical path between the laser oscillator and the fθ main lens, scans the laser beam, and guides the resulting scanned laser beam to the fθ main lens, and an fθ sub-lens that is arranged on the optical path between the laser oscillator and the scan unit and converts the laser beam from parallel light into diffused light.

A laser beam applying unit in a laser processing apparatus includes a laser oscillator for emitting a laser beam, a beam condenser for focusing the laser beam emitted from the laser oscillator and applying the focused laser beam to a workpiece held on a holding table, and a scanning unit that is disposed on an optical path of the laser beam between the laser oscillator and the beam condenser and that has scanning mirrors for scanning the laser beam and guiding the scanned laser beam toward the beam condenser. The scanning mirrors are housed in a chamber having a first window for allowing the laser beam emitted from the laser oscillator to pass therethrough to the scanning mirrors and a second window for allowing the laser beam scanned by the scanning mirrors to pass therethrough to the beam condenser.

A laser beam irradiation unit of a laser processing apparatus includes a first splitting unit that causes a laser beam emitted from a laser oscillator to branch into a first optical path and a second optical path, a first beam condenser that focuses the laser beam having been introduced to the first optical path, and a second beam condenser that focuses the laser beam having been introduced to the second optical path. The laser beam irradiation unit further includes a second splitting unit on the first optical path between the first splitting unit and the first beam condenser that splits the laser beam into at least two laser beams, and a laser beam scanning unit on the second optical path between the first splitting unit and the second beam condenser that executes scanning with the laser beam and introduces the laser beam to the second beam condenser.