Patent classifications
B23K26/0622
ULTRASONIC ADDITIVE MANUFACTURING OF CLADDED AMORPHOUS METAL PRODUCTS
An embodiment relates to an ultrasonic additive manufacturing process, comprising joining a foil comprising a bulk metallic glass to a substrate; and forming a cladded composite comprising the foil and the substrate; wherein a thickness of the cladded composite is greater than a critical casting thickness of the bulk metallic glass, wherein the cladded composite comprises a cladding layer of the bulk metallic glass on the substrate and the bulk metallic glass comprises approximately 0% crystallinity, approximately 0% porosity, less than 50 MPa thermal stress, approximately 0% distortion, approximately 0 inch heat affected zone, approximately 0% dilution, and a strength of about 2,000-3,500 MPa.
ULTRASONIC ADDITIVE MANUFACTURING OF CLADDED AMORPHOUS METAL PRODUCTS
An embodiment relates to an ultrasonic additive manufacturing process, comprising joining a foil comprising a bulk metallic glass to a substrate; and forming a cladded composite comprising the foil and the substrate; wherein a thickness of the cladded composite is greater than a critical casting thickness of the bulk metallic glass, wherein the cladded composite comprises a cladding layer of the bulk metallic glass on the substrate and the bulk metallic glass comprises approximately 0% crystallinity, approximately 0% porosity, less than 50 MPa thermal stress, approximately 0% distortion, approximately 0 inch heat affected zone, approximately 0% dilution, and a strength of about 2,000-3,500 MPa.
METHOD OF PROCESSING MICRO-HOLES OF UPPER MOLD USED FOR TRANSFERRING OR LAMINATING THIN FILM SHEETS USING FEMTOSECOND PULSED LASER BEAM
Proposed is a method of processing micro-holes formed in an upper mold used for adsorbing, transferring, and laminating a thin structure. The micro-holes drilled by setting n mono-layers in a thickness direction of the upper mold, applying the femtosecond pulsed laser beam onto a second mono-layer in a given pattern, processing the micro-holes at a thickness of the next mono-layer in a 2D manner, and sequentially applying the femtosecond pulsed laser beam to the mono-layers while lowering a focus of the laser in units of 1 /n. The femtosecond pulsed laser beam is applied along inner surfaces of the micro-holes, thereby adjusting a dimension of a diameter of each of the micro-holes to be processed, and improving surface roughness of each of the inner surfaces of the micro-holes. Surroundings of an inlet-side edge are chamfered or rounded to prevent generation of the burrs and damage to the thin film sheet.
PULSE DURATION MEASURING APPARATUS
A pulse duration measuring apparatus includes a polarizing beam splitter for splitting a pulsed laser beam into a first laser beam and a second laser beam, a first mirror for reflecting the first laser beam traveling toward the polarizing beam splitter, a second mirror for reflecting the second laser beam traveling toward the polarizing beam splitter, a first quarter wavelength plate disposed between the polarizing beam splitter and the first mirror, a second quarter wavelength plate disposed between the polarizing beam splitter and the second mirror, an optical path length changing unit for moving the first mirror or the second mirror to change the length of the respective optical paths, a nonlinear crystal body for allowing a combined laser beam to pass therethrough, and a photodetector for measuring an optical intensity of the combined laser beam that has passed through the nonlinear crystal body.
PULSE DURATION MEASURING APPARATUS
A pulse duration measuring apparatus includes a polarizing beam splitter for splitting a pulsed laser beam into a first laser beam and a second laser beam, a first mirror for reflecting the first laser beam traveling toward the polarizing beam splitter, a second mirror for reflecting the second laser beam traveling toward the polarizing beam splitter, a first quarter wavelength plate disposed between the polarizing beam splitter and the first mirror, a second quarter wavelength plate disposed between the polarizing beam splitter and the second mirror, an optical path length changing unit for moving the first mirror or the second mirror to change the length of the respective optical paths, a nonlinear crystal body for allowing a combined laser beam to pass therethrough, and a photodetector for measuring an optical intensity of the combined laser beam that has passed through the nonlinear crystal body.
WATER JET LASER PROCESSING MACHINE
A water jet laser processing machine (100) is provided with a nozzle (26) that can eject a water column (34) and introduce a laser beam into the water column (34), a pump (40) that supplies pressurized water to the nozzle (26), a pressure sensor (42) that detects the pressure of the water supplied from the pump (40) to the nozzle (26), a storage unit (52) that stores a threshold value for assessing a decrease in the pressure of the water supplied from the pump (40) to the nozzle (26), and a determination unit (51) that, on the basis of the pressure detected by the pressure sensor (42) and the threshold value stored by the storage unit (52), determines whether the pressure detected by the pressure sensor (42) has decreased, thereby determining whether the nozzle (26) has damage.
PROCESSING DEVICE AND PROCESSING METHOD FOR SOLID STRUCTURE
A processing device and a processing method for a solid structure are used to perform a processing procedure on the solid structure. The processing device for the solid structure of the invention provides energy to the solid structure by various electromagnetic radiation sources to cause the solid structure to generate qualitative changes or defects, that is, to form a modified layer. Stress and/or hardness of the modified layer are/is different from that of other non-processed areas.
Laser processing method and laser processing apparatus
A laser processing method includes a first step of irradiating a surface of a composite material with a laser to form a hole processing groove on the composite material by scanning first paths from an outside corresponding to an inner peripheral surface side of a through hole to be formed to an inside corresponding to a center side of the through hole to be formed, the first paths extending across a width direction of the hole processing groove; and a second step of irradiating and penetrating through the hole processing groove with the laser to form the through hole by scanning second paths from the outside to the inside after the first step, the second paths extending across the width direction of the hole processing groove. The laser used at the first step has a smaller heat input amount per unit time than the laser used at the second step.
LASER WELDING APPARATUS AND LASER WELDING METHOD
A laser welding apparatus includes a laser medium, an excitation light source and a control unit. The control unit supplies drive power to the excitation light source to inject excitation energy to the laser medium. The control unit supplies preliminary excitation power, which is smaller than pulsed drive power, to the excitation light source over a preliminary supply time, which is longer than a pulse width of the drive power before welding the first weld to be welded. After the preliminary supply time elapses and then an interval, the pulsed drive power is supplied to the excitation light source to weld the first weld.
LASER WELDING APPARATUS AND LASER WELDING METHOD
A laser welding apparatus includes a laser medium, an excitation light source and a control unit. The control unit supplies drive power to the excitation light source to inject excitation energy to the laser medium. The control unit supplies preliminary excitation power, which is smaller than pulsed drive power, to the excitation light source over a preliminary supply time, which is longer than a pulse width of the drive power before welding the first weld to be welded. After the preliminary supply time elapses and then an interval, the pulsed drive power is supplied to the excitation light source to weld the first weld.