A method for scribing transparent material with a laser is provided. The method includes providing relative movement between the laser and the transparent material, pulsing the laser at a first pulse repetition rate in a kHz range to establish a speed of scribing of the transparent material, and forming each of said first laser pulses with a series of second laser pulses having a second pulse repetition rate in a MHz range, wherein each of said second lasers pulses is formed from a series of third laser pulses having a third pulse repetition rate in a GHz range.

Method and system for a laser welding process employing the use of a single pulsed fiber laser source configured to generate a radiative output with a wavelength spectrum extending from about 1.8 microns to about 2.6 microns. In a specific case, the laser output from the single pulsed fiber laser source is focused onto the interface of the two pieces of materials at least one of which includes any of glasses, inorganic crystals, and semiconductors.

Method and system for a laser welding process employing the use of a single pulsed fiber laser source configured to generate a radiative output with a wavelength spectrum extending from about 1.8 microns to about 2.6 microns. In a specific case, the laser output from the single pulsed fiber laser source is focused onto the interface of the two pieces of materials at least one of which includes any of glasses, inorganic crystals, and semiconductors.

A process of forming a non-optically detectable authentication marking (210,320, 410,535) in a diamond (200,300). Authentication marking (210,320,410,535) is formed adjacent the outer surface of an article formed from a diamond material having intrinsic optical centers. Method includes the step of applying an image of predesigned authentication marking(210,320,410,535) to a region (201,310,530) of a diamond (200,300) at or adjacent the surface of the diamond (200,300) by way of a direct laser writing; wherein the fluorescence background of the diamond material from intrinsic optical center is suppressed by authentication marking(210,320, 410, 535) under fluorescent imaging, such that the non-optically detectable identifiable authentication marking (210,320,410,535) is viewable against the fluorescence background at the region (201,310,530) of the diamond (200,300) where the authentication marking (210,320,410,535) is applied.

A processing apparatus processes an object by irradiating the object with a processing light, and includes: a combining optical system that combines an optical path of the processing light from the processing light source and an optical path of a first measurement light from a measurement light source; an irradiation optical system that irradiates the object with processing light and the first measurement light through the combining optical system; a position change apparatus that changes a position of the irradiation optical system relative to the object; an imaging apparatus a position of which is changed together with the irradiation optical system and which captures an image of the object; and a detection apparatus that detects, through the irradiation optical system and the combining optical system, a second measurement light generated from the object due to the first measurement light with which the object is irradiated through the irradiation optical system.

A processing apparatus processes an object by irradiating the object with a processing light, and includes: a combining optical system that combines an optical path of the processing light from the processing light source and an optical path of a first measurement light from a measurement light source; an irradiation optical system that irradiates the object with processing light and the first measurement light through the combining optical system; a position change apparatus that changes a position of the irradiation optical system relative to the object; an imaging apparatus a position of which is changed together with the irradiation optical system and which captures an image of the object; and a detection apparatus that detects, through the irradiation optical system and the combining optical system, a second measurement light generated from the object due to the first measurement light with which the object is irradiated through the irradiation optical system.

A busbar assembly of the present invention includes first and second busbars disposed in parallel in a common plane with a gap therebetween, and an insulating resin layer including a gap filling part and an upper surface laminated part, the upper surface laminated part having a first busbar-side upper surface opening that exposes a predetermined area of the upper surfaces of the first busbar and the gap filling part that straddles a boundary therebetween, and a second busbar-side upper surface opening that exposes a predetermined area of the upper surfaces of the second busbar and the gap filling part that straddles a boundary therebetween, a part of the upper surface laminated part between the first and second busbar-side upper surface openings forming a partitioning wall.

A busbar assembly of the present invention includes first and second busbars disposed in parallel in a common plane with a gap therebetween, and an insulating resin layer including a gap filling part and an upper surface laminated part, the upper surface laminated part having a first busbar-side upper surface opening that exposes a predetermined area of the upper surfaces of the first busbar and the gap filling part that straddles a boundary therebetween, and a second busbar-side upper surface opening that exposes a predetermined area of the upper surfaces of the second busbar and the gap filling part that straddles a boundary therebetween, a part of the upper surface laminated part between the first and second busbar-side upper surface openings forming a partitioning wall.

A layer on a substrate is laser annealed by pulses in a plurality of laser beams formed into a uniform line beam. The laser beams are partitioned into a first set of beams and a second set of beams. The second set of beams is incident onto the layer from a smaller range of angles than all of the beams combined. Pulses in the beams are synchronized such that pulses in the first set of beams are incident on the layer before pulses in the second set of beams. Pulses in the first set of beams melt the layer and pulses in the second set of beams sustain melting.

A layer on a substrate is laser annealed by pulses in a plurality of laser beams formed into a uniform line beam. The laser beams are partitioned into a first set of beams and a second set of beams. The second set of beams is incident onto the layer from a smaller range of angles than all of the beams combined. Pulses in the beams are synchronized such that pulses in the first set of beams are incident on the layer before pulses in the second set of beams. Pulses in the first set of beams melt the layer and pulses in the second set of beams sustain melting.