A laser processing machine includes a condenser and a water pillar forming unit. The condenser condenses a laser beam emitted from a laser oscillator and irradiates it to a workpiece held on a chuck table. The water pillar forming unit is disposed on a lower end of the condenser and is configured to form a thread-shaped water pillar on a front side of the workpiece. The laser oscillator includes a first laser oscillator, which emits a first laser beam having a short pulse width, and a second laser oscillator, which emits a second laser beam having a long pulse width. After the laser beams emitted from the first and second laser oscillators have transmitted through the thread-shaped water pillar formed by the water pillar forming unit and have been irradiated to the workpiece, a plasma occurred in the water pillar forming unit applies processing to the workpiece.

The invention relates to a method for thermally stable joining of a glass element to a support element, wherein the glass element has a first coefficient of expansion and the support element has a second coefficient of expansion differing from the first coefficient of expansion. The method thus comprises a step of attaching an intermediate glass material to the support element, wherein the intermediate glass material has a third coefficient of expansion which substantially corresponds to the second coefficient of expansion. In addition, the method comprises a step of local heating of the intermediate glass material in order to join the glass element to the support element via the intermediate glass material.

A method of forming a build in a powder bed includes providing a first diode laser fiber array and a second diode laser fiber array, emitting a plurality of laser beams from selected fibers of the second diode laser fiber array onto the powder bed, corresponding to a pattern of a layer of the build, simultaneously melting powder in the powder bed corresponding to the pattern of the layer of the build, scanning a first diode laser fiber array along an outer boundary of the powder bed and emitting a plurality of laser beams from selected fibers of the first diode laser fiber array and simultaneously melting powder in the powder bed corresponding to the outer boundary of the layer of the build to contour the layer of the build. An apparatus for forming a build in a powder bed including a first diode laser fiber array and a second diode laser fiber array is also disclosed. The first diode laser fiber array configured to contour the layer of the build.

A method of forming a build in a powder bed includes providing a first diode laser fiber array and a second diode laser fiber array, emitting a plurality of laser beams from selected fibers of the second diode laser fiber array onto the powder bed, corresponding to a pattern of a layer of the build, simultaneously melting powder in the powder bed corresponding to the pattern of the layer of the build, scanning a first diode laser fiber array along an outer boundary of the powder bed and emitting a plurality of laser beams from selected fibers of the first diode laser fiber array and simultaneously melting powder in the powder bed corresponding to the outer boundary of the layer of the build to contour the layer of the build. An apparatus for forming a build in a powder bed including a first diode laser fiber array and a second diode laser fiber array is also disclosed. The first diode laser fiber array configured to contour the layer of the build.

A laser cutting method includes a step of determining a material to be removed and dividing the material to be removed into a plurality of material chips so as thereby to organize a machining plan for laser cutting; and, a step of, according to the machining plan for laser cutting, moving a laser along a boundary defining the material to be removed on the workpiece to perform cutting in a first direction and a second direction, such that the material chips can be separated from the workpiece orderly piece by piece so as to form a specific pattern. While in laser cutting, the method removes the material piece by piece. With the laser to remove the material chips through cutting along the boundary, the pattern on the workpiece is thus finished equivalently by the laser. Thereupon, the machining time can be significantly reduced.

A laser cutting method includes a step of determining a material to be removed and dividing the material to be removed into a plurality of material chips so as thereby to organize a machining plan for laser cutting; and, a step of, according to the machining plan for laser cutting, moving a laser along a boundary defining the material to be removed on the workpiece to perform cutting in a first direction and a second direction, such that the material chips can be separated from the workpiece orderly piece by piece so as to form a specific pattern. While in laser cutting, the method removes the material piece by piece. With the laser to remove the material chips through cutting along the boundary, the pattern on the workpiece is thus finished equivalently by the laser. Thereupon, the machining time can be significantly reduced.

A substrate processing method of transcribing, in a combined substrate in which a first substrate and a second substrate are bonded to each other, a device layer formed on a surface of the second substrate to the first substrate is provided. A laser beam is radiated in a pulse shape from a rear surface side of the second substrate to a laser absorption layer formed between the second substrate and the device layer.

A processed product manufacturing method includes preparing a workpiece containing metal and forming a plurality of first regions and a second region along a surface of the workpiece by the irradiation of a laser beam. The first regions are applied with a tensile residual stress. In the second region applied with a compressive residual stress, a plurality of irradiation points separated from each other in the surface of the workpiece are irradiated with the laser beam. The first regions are formed to be separated from each other and each of the first regions is surrounded by the second region when viewed from a direction orthogonal to the surface.

A processed product manufacturing method includes preparing a workpiece containing metal and forming a plurality of first regions and a second region along a surface of the workpiece by the irradiation of a laser beam. The first regions are applied with a tensile residual stress. In the second region applied with a compressive residual stress, a plurality of irradiation points separated from each other in the surface of the workpiece are irradiated with the laser beam. The first regions are formed to be separated from each other and each of the first regions is surrounded by the second region when viewed from a direction orthogonal to the surface.

A laser processing device includes an optical scanning unit that scans laser light; a condenser lens that condenses the laser light onto a workpiece; a plasma light sensor that detects plasma light from the workpiece; and a control unit configured to generate processing position data for the laser light for processing the workpiece, wherein the control unit causes the optical scanning unit to scan the laser light and causes the plasma light sensor to acquire a detection result of detecting the plasma light from the workpiece, and the control unit generates the processing position data for the laser light for processing the workpiece on the basis of the detection result.