A laser power control device includes a storage unit that stores relational data having a measurement value of a heat radiation sensor, which measures intensity of heat radiation of an irradiation object irradiated with a laser beam from a laser machining device in association with a power value of the laser beam on a machining surface of the laser machining device.

A bonding method includes: an oxide-film forming step, on an irradiated surface, an oxide film having a film thickness corresponding to a first output and an irradiation time of an oxide-film-forming laser beam; a first reflected-laser-beam detection step of detecting a second output; a first absorptance computing step of computing a first absorptance for the oxide-film-forming laser beam; laser-beam switching step of switching the oxide-film-forming laser beam radiated onto the irradiated surface to a heat-bonding laser beam; and a heat bonding step of heating a first bonding surface until the temperature thereof reaches a predetermined bonding temperature, and bonding the first bonding surface to a second bonding surface.

A laser processing method is performed in a laser processing apparatus which outputs a laser beam from a processing head to a workpiece, to perform laser processing while controlling reflected light of the output laser beam to a prescribed value or less. The laser processing method includes the step of, before performing laser processing for the workpiece, increasing laser power stepwise from laser power lower than laser power included in a processing condition of the laser processing, to emit a laser beam from a laser oscillator, and measuring reflected light by a reflected light sensor, and the step of deciding an output condition for decreasing reflected light based on a measured value of the reflected light and the prescribed value, and the step of decreasing reflected light before performing the laser processing by irradiating the workpiece with a laser beam for a predetermined period of time on the decided output condition.

A method of heating a portion of an object includes the steps of projecting an energy beam onto a surface of the object so as to produce a primary spot on the surface, and repetitively scanning the beam in two dimensions in accordance with a scanning pattern so as to establish an effective spot on the surface, and displacing the effective spot in relation to the surface of the object to progressively heat the at least one selected portion of the object. Displacing the effective spot in relation to the surface of the object includes displacing the effective spot following a track featuring at least one change of direction.

The effective spot is maintained aligned with the track by modifying operation of a scanner in correspondence with the at least one change of direction.

A method for machining a surface of a metal component, in particular a connecting rod or a cam for a motor vehicle, including the following steps: providing a metal component which has a surface to be machined; premachining the surface to be machined; structuring the premachined surface by means of a laser beam in such a way that elevations but no depressions are formed as laser structures on the premachined surface with respect to the level thereof.

Provided is a laser build-up method capable of building up a layer with a uniform weld penetrating amount on first and second surfaces even when non-uniformity in distribution of supplied metallic powder due to the shape of a joint or the effect of gravity. A laser build-up method for a corner region formed by a first surface (11) and a second surface (12) in a different orientation from the first surface includes: supplying metallic powder (55) to the corner region; forming a melted part by performing weaving irradiation of a laser (25) on the first and second surfaces (11, 12) under a predetermined irradiation condition and melting the metallic powder (55); measuring a first temperature of the melted part of the first surface (11) and a second temperature of the melted part of the second surface (12); and setting the irradiation condition based on the first and second temperatures.

The invention provides a method of manufacturing a display panel and the display panel. The display panel is applied to a display device having a camera, and the display panel includes an alignment film layer, a liquid crystal layer, and a camera hole. The method includes: performing laser treatment to the alignment film layer to obtain a first light transmission hole and performing laser treatment to the liquid crystal layer to obtain a second light transmission hole. The method provided by the invention reduces a difference of amount of ambient light entering at different angles of the alignment film layer and the liquid crystal layer, and thereby improves imaging quality of the camera.

Numerous embodiments are disclosed. In one, a laser-processing apparatus includes a positioner arranged within a beam path along which a beam of laser energy is propagatable. A controller may be used to control an operation of the positioner to deflect the beam path within first and second primary angular ranges, and to deflect the beam path to a plurality of angles within each of the first and second primary angular ranges. In another, an integrated beam dump system includes a frame; and a pickoff mirror and beam dump coupled to the frame. In still another, a wavefront correction optic includes a mirror having a reflective surface having a shape characterized by a particular ratio of fringe Zernike terms Z4 and Z9. Many more embodiments are disclosed.

A system for laser bonding of flip chip, and more particularly, to a system for laser bonding of flip chip for bonding a flip chip-type semiconductor chip to a substrate by using a laser beam is provided. According to the system for laser bonding of flip chip of the present disclosure, by performing laser bonding on a substrate while pressurizing semiconductor chips, even semiconductor chips which are bent or likely to bend may be bonded to the substrate without causing poor contact of solder bumps.

A laser welding method is capable of easily restraining poor welding when spatters adhere to a protective glass of an optical system. The laser welding method includes a step of calculating a decrease-amount of the laser power before laser welding is performed by irradiating a welding portion of a workpiece with the laser beam having a predetermined power. The step of calculating the decrease-amount includes irradiating the welding portion with an inspecting laser beam having a power smaller than the predetermined power, receiving a return beam of the inspecting laser beam, measuring an intensity of the return beam, and comparing the intensity of the return beam with a standard intensity to calculate an amount of decrease in power of the inspecting laser beam at the welding portion.