A method of fabricating a frame to enclose one or more semiconductor dies includes forming one or more features including one or more cavities and one or more through-vias in a substrate by a first laser ablation process, filling the one or more through-vias with a dielectric material, and forming a via-in-via in the dielectric material filled in each of the one or more through-vias by a second laser ablation process. The one or more cavities is configured to enclose one or more semiconductor dies therein. In the first laser ablation process, frequency, pulse width, and pulse energy of a first pulsed laser beam to irradiate the substrate are tuned based on a depth of the one or more features. In the second laser ablation process, frequency, pulse width, and pulse energy of a second pulsed laser beam to irradiate the dielectric material are tuned based on a depth of the via-in-via.

Exposure device (6) for an apparatus (1) for the additive production of three-dimensional objects (2), comprising: —at least one energy beam generating device (7), which is configured in order to generate an energy beam (4), —at least one light-guide fibre (8), which is optically couplable or coupled to the energy beam generating device (7) and is configured in order to guide at least one energy beam (4), introduced into it, between an input region (8a) of the light-guide fibre (8) and an output region (8b) of the light-guide fibre (8), the light-guide fibre (8) comprising a plurality of fibre cores (15), at least one energy beam (4) being introducible or introduced into each fibre core (15).

Laminated liquid crystal films may be processed using a laser beam to form tear lines. Tear lines create a weak line in a liquid crystal film along which a portion of a PET layer may be torn from the whole PET layer. Tear lines are made by the precise volumetric removal of PET material from a portion of a PET layer by burning away the PET material using the laser beam. The form, extent and depth of penetration of a laser beam into a PET layer may be precisely controlled by adjusting the power and/or scan speed of the laser beam relative to the laminated liquid crystal film on which the PET layer is positioned. In this manner, a desired volume of PET material may be removed from the PET layer.

A 3D laser machining system comprises: a move state simulation unit that simulates a move state of a machining head using 3D CAD data about a workpiece containing material information defining thermophysical properties and 3D CAD data about a machining head under a condition of moving the machining head relative to the workpiece while the machining head is maintained at a predetermined angle a predetermined distance along a machining line in virtual space; a thermal fluid simulation unit that conducts non-stationary thermal fluid simulation for obtaining a temperature distribution in a region covering the workpiece to be changed by the move of the machining head outputting a laser beam; and a machining condition setting unit that sets a laser machining condition containing a relative move condition for the machining head and a laser beam output condition before laser machining on the basis of results of the simulations.

Provided is a welding method that can enhance joining quality between an upper plate and a lower plate. One aspect of the present disclosure is a joining method including joining the upper plate to the lower plate that is overlapped with the upper plate by applying energy to a top surface of the upper plate to thereby melt the upper plate and the lower plate together. A joining path designed to apply the energy to the top surface of the upper plate crosses an axis along a joining-travel direction and includes a turn-point. An amount of the energy includes a first energy applied in the vicinity of the turn-point and a second energy amount applied in an area other than the vicinity of the turn-point. The first energy amount is smaller than the second energy amount.

A laser processing method includes a step of processing a workpiece by relatively moving the workpiece with respect to a plurality of laser spots including a first spot, a second spot, and a third spot which are linearly arranged so that the first spot, the second spot, and the third spot pass through a processing target portion of the workpiece in this order. To a total amount of energy of laser beam in the first spot, the second spot, and the third spot, a ratio of energy in the first spot is not less than 20% and not more than 30%, a ratio of energy in the second spot is not less than 20% and not more than 30%, and a ratio of energy in the third spot is not less than 45% and not more than 55%.

There are provided high power laser and laser mechanical earth removing equipment, and operations using laser cutting tools having stand off distances. These equipment provide high power laser beams, greater than kW to cut and volumetrically remove targeted materials and to remove laser affected material with gravity assistance, mechanical cutters, fluid jets, scrapers and wheels. There is also provided a method of using this equipment in mining, road resurfacing and other earth removing or working activities.

In various embodiments, workpieces are processed, e.g., via welding or cutting, while the shape and/or one or more other parameters of the laser processing beam are altered. The shape and/or one or more other parameters of the laser processing beam may be varied based on one or more characteristics of the workpiece.

A laser beam irradiation unit of a laser beam irradiation apparatus includes a laser beam source that emits a laser beam and a spatial light modulator that modulates the laser beam emitted from the laser beam source, according to a phase pattern, and that emits the laser beam. A controller has a storing section that stores the phase pattern to be displayed in the spatial light modulator and a rotation instructing section that rotates the phase pattern stored in the storing section. The controller uniformizes the power density of the laser beam with which a plate-shaped workpiece is irradiated, by rotating the phase pattern while the plate-shaped workpiece is irradiated with the laser beam.

A shaping apparatus is equipped with: a beam shaping system having a beam irradiation section that includes a condensing optical system which emits a beam and a material processing section which supplies a shaping material irradiated by the beam from the beam irradiation section; and a controller which, on the basis of 3D data of a three-dimensional shaped object to be formed on a target surface, controls a workpiece movement system and the beam shaping system such that a target portion on the target surface is shaped by supplying the shaping material from the material processing section while moving the beam from the beam irradiation section and the target surface on a workpiece (or a table) relative to each other. Further the intensity distribution of the beam in the shaping plane facing the emitting surface of the condensing optical system can be modified.