A laser processing method for cutting a base material, including stacked first and second layers having different thermal expansion coefficients, includes radiating laser light onto a first inter-layer part under prescribed first inter-layer conditions, to cut the first inter-layer part, which extends from a position in the vicinity of a layer boundary inward of the surface of the second layer, through the layer boundary between the second layer and the first layer, to a position in the vicinity of a layer boundary inward of said one surface of the first layer, and radiating the laser light onto a part of the first layer inward from the position in the vicinity of the layer boundary, under first conditions, to cut the first layer, wherein the first inter-layer condition is a condition under which the amount of heat input by the laser light is less than under the first condition.

A method for separating a temporarily bonded substrate stack by bombardment of a joining layer of the substrate stack by means of laser beams emitted by a laser, characterised in that laser beams of the laser reflected and/or transmitted at the temporarily bonded substrate stack are detected during the bombardment of the joining layer with the laser beams. The invention also relates to a corresponding device.

A processing method of a workpiece used when the workpiece is processed is provided. The processing method of a workpiece includes a disposing step of disposing the workpiece in a gas containing a substance that generates an active species that reacts with the workpiece, a measurement step of measuring the distribution of the thickness of the workpiece disposed in the gas, and a laser beam irradiation step of irradiating the workpiece in the gas with a laser beam of which the power is adjusted based on the distribution of the thickness measured in the measurement step. In the laser beam irradiation step, the removal amount by which a region irradiated with the laser beam in the workpiece is removed by the active species is controlled by irradiating the workpiece with the laser beam of which the power is adjusted.

A cutting method for a display panel, wherein the cutting method includes: cutting a display motherboard to be cut into a plurality of separate display panels by using a first laser beam, wherein the display panels each include a plurality of leads disposed between conductive connectors and a cutting edge of the display panel formed after cutting by the first laser beam; and severing at least some leads of the display panel by using a second laser beam at a position on the display panel between the conductive connectors and the cutting edge of the display panel, the at least some leads being short-circuited leads.

A welding method for welding grouped conductor ends of a component for an electrical machine by means of a welding device. In the method, a relative position of a first conductor end and a second conductor end of grouped conductor ends and then a first size parameter of a molten pool formed during welding are detected. Subsequently, a second size parameter of the molten pool formed during welding is detected. In a further method step, a value of the molten pool is determined from the first size parameter, the second size parameter and the relative position. Finally, a welding energy input is controlled depending on the determined value of the molten pool.

A method of laser machining a workpiece includes the steps of: radiating a laser beam onto at least one workpiece, the laser beam having a core beam and a ring beam extending coaxially with one another, wherein the laser beam is moved over the workpiece along a pre-determined machining path, and adjusting a laser power of the core beam and/or a laser power of the ring beam as a function of a position of the laser beam on the workpiece. An associated laser machining system is also disclosed.

An additive manufacturing system may include an energy source, an optical system to modify and direct an energy beam from the energy source toward a component to form a melt pool, and a material delivery device to deliver material to the melt pool. The optical system may form an annular energy beam, direct the annular energy beam toward the component, receive at least a portion of thermal emissions produced by the annular energy beam and the melt pool, and direct the portion of the thermal emissions toward an imaging device, which may be used to control the energy source.

A method for separating and releasing a closed-form piece from a workpiece made of a brittle material is disclosed. A first pulsed laser-beam creates defects along the outline of the closed-form piece. A second laser-beam selectively heats the closed-form piece for a first time that is sufficient to initiate cracking between the defects. The heating is stopped for a period sufficiently long for the cracks to propagate completely between the defects. The second laser-beam is applied for a second time that causes melting and deformation of the closed-form piece. The deformation opens a gap between the closed-form piece and the rest of the workpiece, thereby allowing release of the closed-form piece.

A system and method is disclosed for forming a graded index (GRIN) on a substrate. In one implementation the method may involve applying a metal layer to the substrate. A fluence profile of optical energy applied to the metal layer may be controlled to substantially ablate the metal layer to create a vaporized metal layer. The fluence profile may be further controlled to control a size of metal nanoparticles created from the vaporized metal layer as the vaporized metal layer condenses and forms metal nanoparticles, the metal nanoparticles being deposited back on the substrate to form a GRIN surface on the substrate.

A method for laser keyhole welding is disclosed to weld two pieces together made of a metal alloy. The method independently adjusts power in a focused center beam and power in a concentric focused annular beam. At the termination of a weld, the power of the annular beam is reduced, motion of the focused beams is stopped, the power of the center beam is increased, and the power of both beams is initially ramped down rapidly and then ramped down slowly. Increasing the power of the center beam equalizes the temperature of both pieces prior to solidification and cooling at the termination of the weld. An additional pulse of power may be applied to prevent the formation of defects or to erase any defects.