A method for processing a transparent workpiece includes forming a contour of defect in the transparent workpiece and separating the transparent workpiece along the contour using an infrared laser beam. During separation, the method also includes detecting a position and propagation direction of a crack tip relative to a reference location and propagation direction of an infrared beam spot, determining a detected distance and angular offset between the crack tip and the reference location of the infrared beam spot, comparing the detected distance to a preset distance, comparing the detected angular offset to a preset angular offset, and modifying at least one of a power of the infrared laser beam or a speed of relative translation between the infrared laser beam and the transparent workpiece in response to a difference between the detected distance and the preset distance and between the detected angular offset and the preset angular offset.

Provided is a welding method enabling enhancement of quality of welding between an upper plate and a lower plate. One aspect of the present disclosure is the welding method including welding the upper plate and the lower plate overlapped with the upper plate by irradiating a surface of the upper plate with a laser beam. The welding includes: forming an auxiliary welding path that is continuous and includes a reciprocating or circling path; and forming a main welding path that intersects a welding advancing direction and that includes turning points, after formation of the auxiliary welding path.

A method for laser cutting a workpiece having a thickness of less than 6 mm includes the steps of directing a first laser beam, a second laser beam, and a gas jet at an entrance surface of the workpiece such that the first and second laser beams at least partially overlap one another on the workpiece. The first laser beam has a smaller focus diameter than the second laser beam, a beam parameter product of the first laser beam is at most 5 mm*mrad, and a power proportion of the second laser beam of a total laser power is less than 20%. A cutting kerf with a broken cutting edge is formed on the entrance surface of the workpiece.

A laser processing system includes: a wavelength-variable laser device configured to output each of a laser beam at an absorption line as a wavelength at which light is absorbed by oxygen and a laser beam at a non-absorption line as a wavelength at which the amount of light absorption by oxygen is smaller than at the absorption line; an optical system configured to irradiate a workpiece with the laser beam; and a laser control unit configured to control the wavelength-variable laser device, set the wavelength of the laser beam output from the wavelength-variable laser device to be the non-absorption line when laser processing is performed on the surface of the workpiece in gas containing oxygen, and set the wavelength of the laser beam output from the wavelength-variable laser device to be the absorption line when ozone cleaning is performed on the surface of the workpiece in gas containing oxygen.

To improve quality and reduce reject in the large-scale production of components of an electrical machine provided with coil windings, a welding method is provided for welding conductor ends organized into groups of conductor ends of a component for an electrical machine. The method includes detecting a relative position of a first conductor end and a second conductor end of a group of conductor ends, and controlling a welding energy input to the conductor ends to be welded depending on the detected relative position. A welding apparatus for performing the welding method is also provided.

A laser processing apparatus of the present disclosure controls outputs of a blue laser oscillator and an infrared laser oscillator such that before a surface melting is detected on a workpiece, the workpiece is irradiated with at least blue laser light, and after the surface melting is detected on the workpiece, a power of infrared laser light with which the workpiece is irradiated is increased as compared to before the surface melting is detected.

A rechargeable battery pack unit encompassing a rechargeable battery cell, which includes a cell pole, and encompassing a current collector, the cell pole being integrally joined to the current collector in a connecting area, a ratio of a wall thickness of the cell pole and the thickness of the current collector being maximally, and the current collector being made of copper.

The present invention includes a laser-welded lap joint including a weld zone formed by laser lap welding in a lapped portion including a plurality of lapped steel sheets. The weld zone includes a main weld zone that penetrates the steel sheets in the lapped portion and a final weld zone formed at one end of the main weld zone and having a crater, and the weld zone satisfies formulas (1) to (4):
L≥15.0;  (1)
10.0≥L2≥2l.sub.c;  (2)
t1≥2d.sub.c;  (3)
w.sub.c>d.sub.c  (4).

A method for matching and tracking workpieces in laser etching operation includes generating by the computer a label image that uniquely identifies the workpiece, moving a laser head to the workpiece, setting the laser head to a first power level by a power controller, etching the product image on the workpiece using a laser beam emitted from the laser head, wherein the laser beam is modulated at the first power level in accordance with a product image in a pixel wise fashion across the workpiece, moving the laser head to the label by the transport mechanism, setting the laser head to a second power level by the power controller, etching the label image on the workpiece using a laser beam emitted from the laser head, wherein the laser beam is modulated at the second power level in accordance with the label image in a pixel wise fashion across the label.

A laser processing apparatus includes a spatial light modulator for inputting laser light output from a laser light source and outputting laser light after phase modulation by a hologram, and a control unit for presenting, on the spatial light modulator, the hologram for focusing the laser light after the phase modulation output from the spatial light modulator on a plurality of irradiation points in a processing object by a focusing optical system. The control unit controls light intensities of at least two irradiation points included in the plurality of irradiation points independently of each other.