A controlled thermal coefficient product manufacturing system and method is disclosed. The disclosed product relates to the manufacture of metallic material product (MMP) having a thermal expansion coefficient (TEC) in a predetermined range. The disclosed system and method provides for a first material deformation (FMD) of the MMP that comprises at least some of a first material phase (FMP) wherein the FMP comprises martensite randomly oriented and a first thermal expansion coefficient (FTC). In response to the FMD at least some of the FMP is oriented in at least one predetermined orientation. Subsequent to deformation, the MMP comprises a second thermal expansion coefficient (STC) that is within a predetermined range and wherein the thermal expansion of the MMP is in at least one predetermined direction. The MMP may be comprised of a second material phase (SMP) that may or may not transform to the FMP in response to the FMD.

The present laser processing device has a laser oscillator, a laser power supply, a control unit, an optical fiber cable, an electric cable, a processing head, an operation panels and a laser processing monitor unit. The laser processing monitor unit includes the control unit, the operation panel a sensor signal processing unites and a sensor unites as a basic configuration for a main function, that is, a monitoring function, and additionally includes a reference beam source, a reference beam source power supply, an optical measuring instrument and an optical path switching unit as a calibration unites for calibrating an optical sensor incorporated in the sensor unit.

A method using femtosecond laser for nano precision preparation. Initial damage nanoholes formed by using femtosecond laser multiphoton excitation are used as a seed structure, and the energy and polarization state of subsequent laser pulses are adjusted in real time, such that uniform and directional optical near-field enhancement is generated near the seed structure and finally the high-precision removal of machined materials is realized. Benefiting from the high localization of near-field spot energy in space, the method uses femtosecond laser pulses having the wavelength of 800 nm to achieve a machining accuracy having the minimum linewidth of only 18 nm, and the linewidth resolution reaches 1/40 of the wavelength; and the method using femtosecond laser for nano precision preparation does not need a vacuum environment, having good air/solution machining compatibility.

Machining device (100) comprising: a light source (33); an optial system (2) for obtaining a spatially offest outgoing light beam (7) remaining parallel to a given position upstream focusing means (9), said optical system (2) comprising: a movable mirror (19) such that its normal is able to depict a trajectory in a three-dimensional space, said optical system (2) being configured such that said first incident light beam (4) and said normal to the movable mirror (19) are separated by an angle (15) comprised between 0° and 15° for all possible positions and orientations of said movable mirror (19); driving means (6) for moving said movable mirror (19); a retro refletion system (21) able to provide a second incident light beam (8) parallel to a first refelected light beam (23) on said movable mirror (19); focusing means (9) for focusing outgoing light beam (7) on a target (10).

The invention relates to a machining head (100) for the laser machining of a workpiece, having a first interface (102) for a machining laser source for emitting a machining laser beam; a second interface (104) for an illumination light source for emitting a linearly polarised illumination light beam; an exit opening (112) for the machining laser beam and the illumination light beam; a third interface (106) for a detector device for detecting the illumination light beam reflected from the workpiece; and guide optics (116, 117) for at least partial coaxial guiding of the emitted illumination light beam through the exit opening and of the illumination light beam reflected from the workpiece, through the exit opening, to the third interface. The guide optics have a polarising beam splitter (116) for guiding at least part of the emitted linearly polarised illumination light beam in the direction of the exit opening; and a retardation plate (117) disposed between the polarising beam splitter and the exit opening. The invention also relates to a method for laser machining of a workpiece.

A carrier holds an extreme ultraviolet light source collector mirror. The carrier includes a front panel having an inner surface and an outer surface opposite the inner surface, and defining a through opening that has an edge having a plurality of scallops; a back panel having an inner surface that faces the front panel and an outer surface opposite the inner surface; and a plurality of posts that are configured to connect the back panel to the front panel and to sandwich a flat rim around the circular boundary of the collector mirror between the inner surface of one of the panels and flanges of the posts. The scallops are positioned around a circumference of the edge and being separated by arcs, where the arcs define a circle that has a diameter that is less than a diameter of the circular boundary of the reflective surface of the collector mirror.

A processing apparatus includes: a beam irradiation apparatus that is configured to irradiate an object with an energy beam; and a beam deflection apparatus that is configured to change a propagating direction of the energy beam toward the beam irradiation apparatus, wherein when the energy beam propagating toward the beam irradiation apparatus from the beam deflection apparatus propagates in a first direction, the beam irradiation apparatus emits the energy beam in a second direction, and when the energy beam propagating toward the beam irradiation apparatus from the beam deflection apparatus propagates in a third direction that is different from the first direction, the beam irradiation apparatus emits the energy beam in a fourth direction that is different from the second direction.

Laser marked articles having a predetermined feature marked onto a wall that is either user readable, machine readable, or both. Also, methods of making the marked articles by laser marking.

A laser processing apparatus includes a laser source; a width adjuster that adjusts a width of a laser beam irradiated from the laser source; and a scanner that adjusts an irradiation direction of the laser beam having passed through the width adjuster, wherein the width adjuster includes a first width adjusting portion and a second width adjusting portion arranged on a traveling direction of the laser beam, a focal length of the first width adjusting portion is equal to or greater that about 20,000 mm and a focal length of the second width adjusting portion is equal to or greater than about 20,000 mm.

A laser irradiation apparatus (1) according to an embodiment includes an optical-system module (20) configured to apply laser light (L1) to an object to be irradiated, a shield plate (51) in which a slit (54) is formed, through which the laser light (L1) passes, and a reflected-light receiving component (61) disposed between the optical-system module (20) and the shield plate (51), in which the reflected-light receiving component (61) is able to receive, out of the laser light (L1), reflected light (R1) reflected by the shield plate (51).