Disclosed is a magnetic domain refining method for radiating a laser beam to a surface of a directional electrical steel plate at intervals, which is capable of further reducing noise along with an iron loss reduction effect and further improving iron loss and noise reduction effects in an area where the directional electrical steel plate are bonded together, such as the joint part of the iron core of a transformer. Irradiated radiations formed by a laser beam in at least any one area of the directional electrical steel plate are unfolded in a fan rib form using one point of the directional electrical steel plate as a central point.

A machining apparatus for laser machining a workpiece (12) in a machining zone (13) is provided, having a first interface (14) for a machining laser source for generating a machining laser beam (15), an outlet opening (18) for the machining laser beam (15), In an optical system between the first interface (14) and the outlet opening (18), which has at least one laser beam guiding device (22) having at least one movable surface (24) and at least one actuator (26), with which the movable surface (24) is dynamically adjustable, and a cooling device (28) for cooling the at least one actuator (26), wherein the cooling device (28) has at least one primary circuit (30) through which a first cooling fluid can flow without contact with the actuator (26). Furthermore, a set of parts for a machining apparatus for laser machining a workpiece (12) and a method of laser machining a workpiece (12) using such machining apparatus are also provided.

A system for machining materials by means of laser beam includes a deflection device for deflecting the laser beam and a wobble device configured to superimpose a wobble movement of the laser beam with a wobble figure and a wobble frequency onto a feed movement of the laser beam corresponding to a machining path by controlling the deflection device. The wobble device is configured, for carrying out the wobble movement, to control the deflection device according to a compensated wobble movement. Control values for a deflection of the laser beam along the wobble figure are adapted as a function of the wobble frequency and/or a path speed of the wobble movement that varies along the wobble figure is adapted as a function of a position of the laser beam in the wobble figure and as a function of the wobble frequency.

A manufacturing process of an element chip comprises a preparing step for preparing a substrate having first and second sides opposed to each other, the substrate containing a semiconductor layer, a wiring layer and a resin layer formed on the first side, and the substrate including a plurality of dicing regions and element regions defined by the dicing regions. Also, the manufacturing process comprises a laser grooving step for irradiating a laser beam onto the dicing regions to form grooves so as to expose the semiconductor layer along the dicing regions. Further, the manufacturing process comprises a dicing step for plasma-etching the semiconductor layer along the dicing regions through the second side to divide the substrate into a plurality of the element chips. The laser grooving step includes a melting step for melting a surface of the semiconductor layer exposed along the dicing regions.

A laser processing system includes a laser beam source that produces a raw laser beam; a beam expansion system that receives the raw laser beam and produces an expanded laser beam; a homogenization system that receives the expanded laser beam and produces a laser beam that is homogenized and has a line-shaped beam cross section in the processing plane, wherein the homogenization system includes a first homogenization arrangement that homogenizes along the short axis and a second homogenization arrangement for homogenization along the long axis, each of the homogenization arrangements includes optical elements that split the laser beam into a multiplicity of partial beams and a condenser system that superposes the partial beams in a superposition plane, and the first homogenization arrangement includes a first condenser system with at least one first mirror and the second homogenization arrangement includes a second condenser system with at least one second mirror.

The present disclosure provides methods for printing at least a portion of a three-dimensional (3D) object, comprising receiving, in computer memory, a model of the 3D object. Next, at least one filament material from a source of the at least one filament material may be directed towards a substrate that is configured to support the 3D object, thereby depositing a first layer corresponding to a portion of the 3D object adjacent to the substrate. A second layer corresponding to at least a portion of the 3D object may be deposited. The first and second layer may be deposited in accordance with the model of the 3D object. At least a first energy beam from at least one energy source may be used to selectively melt at least a portion of the first layer and/or the second layer, thereby forming at least a portion of the 3D object.

The present disclosure includes a laser welding method in which a joint surface between a plurality of workpiece members is welded by radiating laser beam LB, and a locus of laser beam LB is controlled so as to perform wobbling scanning Sw by a combination of scanning motion Sa moving along first direction x parallel to the joint surface and swing motion Sb including first swing component Bx along first direction x and second swing component By along second direction y perpendicular to first direction x, the method including a defect determination step of determining occurrence of a welding defect; and an output control step of increasing or decreasing an output of laser beam LB when laser beam LB is radiated again toward the welding defect in a case where the welding defect occurs.

A method for monitoring, in particular for controlling, a cutting process on a workpiece, includes focusing a machining beam, in particular a laser beam, on the workpiece, detecting a region of the workpiece to be monitored, the region including an interaction region in which the machining beam interacts with the workpiece, and determining at least one characteristic variable of the cutting process, in particular of a kerf formed during the cutting process, on the basis of the detected interaction region. In a fusion cutting process, a cutting front length of a cutting front formed at the kerf is determined as a characteristic variable on the basis of the detected interaction region. A corresponding device for monitoring, in particular for controlling, a cutting process on a workpiece, is also provided.

To provide a laser annealing apparatus which is high efficiency of irradiation energy and capable of achieving uniformity in density of irradiation energy in a region irradiated with a laser beam.

SOLVING MEANS

Scheduled treatment regions of a treatment film are each defined in the form of a strip extending in a scanning direction. Irradiation surface areas of line beams are oriented to be inclined relative to the scanning direction within respective scheduled treatment regions.

The present disclosure relates to an optical fiber having a core and a cladding, where the cladding is doped with a dopant. The cladding has a dopant concentration gradient in the radial direction such that a concentration of the dopant changes with respect to radial distance from a core-cladding interface. Doping the cladding of the optical fiber enables ablation of the fiber surface with a line source to provide an ablated wedge or crack such that cleaving can be achieved by applying a stress force to the fiber after ablation or by applying a pull force during ablation.