According to one implementation, a laser peening processing apparatus includes a laser oscillator, a condensing lens, an optical element, a liquid tank and a beam expander. The laser oscillator oscillates laser light. The condensing lens condenses the laser light on a surface of an object. The optical element changes a travelling direction of the laser light. The liquid tank inputs the laser light into liquid, and emits and ejects the laser light and the liquid from an exit to the surface. The beam expander adjusts a magnifying ratio of a beam diameter of the laser light entering into the condensing lens. By adjusting the magnifying ratio, a beam diameter of the laser light irradiating the surface becomes a diameter required for laser peening processing of the surface. The adjusting the magnifying ratio also prevents the laser light, having an excess beam diameter, from entering into the optical element.

Reference light receiver (300) receives reference light (RL) reflected by second reflecting surface (200b) of folding mirror (200). Partial light receiver (600) receives a part of laser light (LB) reflected by partial reflection mirror (500). Controller (14) detects an abnormality in an inclination angle of first reflecting surface (200a) of folding mirror (200) with respect to an optical path of laser light (LB) incident on first reflecting surface (200a) of folding mirror (200) based on an output of reference light receiver (300), and detects an abnormality in a spot of laser light (LB) on an irradiated object based on an output of partial light receiver (600).

A semiconductor fabrication apparatus includes a source chamber being operable to generate charged particles; and a processing chamber integrated with the source chamber and configured to receive the charged particles from the source chamber. The processing chamber includes a wafer stage being operable to secure and move a wafer, and a laser-charged particles interaction module that further includes a laser source to generate a first laser beam; a beam splitter configured to split the first laser beam into a second laser beam and a third laser beam; and a mirror configured to reflect the third laser beam such that the third laser beam is redirected to intersect with the second laser beam to form a laser interference pattern at a path of the charged particles, and wherein the laser interference pattern modulates the charged particles by in a micron-zone mode for processing the wafer using the modulated charged particles.

A system and method for automated laser ablation includes an end effector for performing laser ablation at a location with restricted access. The systems and methods of the present disclosure specifically provide for a miniature laser end effector which may be inserted through a port or bore in order to ablate the surface of an internal component of a complex assembly. In several embodiments of the present subject matter, the end effector is mounted on a machine and coupled to a laser system.

A method of forming an object from a material includes directing a first beam of light toward a first target location of the material to define a first portion of the object. The method also includes, after directing the first beam of light toward the first target location, determining an optical correction to be applied by an optical system. The optical correction is based on an atmospheric change in an atmospheric distortion region proximate the first target location due, at least in part, to interaction of the first beam of light and the material. The method further includes directing a second beam of light toward a second target location of the material to define a second portion of the object. The second beam of light is directed through at least a portion of the atmospheric distortion region while the optical correction is applied.

A laser processing system includes a laser oscillator that forms a fusion zone in a workpiece by irradiating a fusion-scheduled region of a processing target surface of the workpiece with a laser beam, a photometer that measures intensity of light from the fusion zone of the workpiece, and a jig disposed on the processing target surface of the workpiece not to overlap the fusion-scheduled region in order to press the workpiece. The jig has a reflection surface inclined in a manner that the reflection surface is further away from the fusion-scheduled region as the reflection surface is further away from the processing target surface in a normal direction of the processing target surface of the workpiece.

A laser cleaning system including a laser source, an energy-transferring optical fiber, a laser cleaning head, a coreless motor, a connection lens barrel, and a mirror.

A lens alignment system and method is disclosed. The disclosed system/method integrates one or more lens retaining members/tubes (LRM/LRT) and focal length spacers (FLS) each comprising a metallic material product (MMP) specifically manufactured to have a thermal expansion coefficient (TEC) in a predetermined range via selection of the individual MMP materials and an associated MMP manufacturing process providing for controlled TEC. This controlled LRM/LRT TEC enables a plurality of optical lenses (POL) fixed along a common optical axis (COA) by the LRM/LRT to maintain precise interspatial alignment characteristics that ensure consistent and/or controlled series focal length (SFL) within the POL to generate a thermally neutral optical system (TNOS). Integration of the POL using this LRM/LRT/FLS lens alignment system reduces the overall TNOS implementation cost, reduces the overall TNOS mass, reduces TNOS parts component count, and increases the reliability of the overall optical system.

The present invention provides an online laser leveling detection method of a 3D printer. The method comprises: (1), arranging a bar-shaped triangular reflecting prism and a bar-shaped photoelectric receiver; (2), fixedly mounting a laser emitter and a plane mirror on the side face of a printer head; (3), with the aid of a detection laser beam, fine tuning the mounting azimuths of an X-axis guide rail, a Y-axis guide rail, and the printer head till the motion levelness of the printer head is adjusted to meet requirements of the design accuracy of the printer; (4), with the aid of the detection laser beam, fine tuning the mounting azimuth of a printing platform till the mounting levelness of the printing platform is adjusted to meet the requirements of the design accuracy of the printer; (5), starting the 3D printing program; (6), in the printing process, detecting in real time whether a nozzle of the printer head generates faults including material blockage, shortage, and breakage. The present invention communicates detection signals of a laser detection system with a printer control system and designs the signal processing program to achieve detection of the motion levelness and the mounting levelness as well as monitoring of extrusion faults of the printer head.

A laser processing device for generating a plurality of grooves in a surface comprises an optical diffraction arrangement adapted to receive a laser radiation and to generate an output radiation hereupon, the output radiation having a plurality of intensity maxima. An actuator arrangement is provided for generating a relative movement between the output radiation and the surface, wherein each intensity maximum generates a groove of the plurality of grooves.