Disclosed is a system for efficiently cutting a transparent substrate. The system includes a laser source in optical communication with at least one multi-foci optical system. The laser source outputs at least one optical signal to the optical system. The optical system is positioned between the laser source and the substrate to be cut. The optical system includes at least one housing detachably coupled to at least one base member. One or more plate members having one or more apertures formed therein may be coupled to at least one of the housing, the baser member, or both. The aperture formed on the plate member may be configured to permit the optical signal to enter and exit the optical system. Various optical subassemblies may be positioned within or coupled to the optical system.

An example system includes a laser tool configured for downhole movement. The laser tool includes an optical assembly configured to shape a laser beam for output. The laser beam may have an optical power of at least one kilowatt (1 kW). A housing contains the optical assembly. The housing is configured for movement to direct the output laser beam within a wellbore. The movement includes rotation of the laser tool around a longitudinal axis of the housing and tilting the housing relative to a longitudinal axis of the wellbore. A control system is configured to control at least one of the movement of the housing or an operation of the optical assembly to direct the output laser beam within the wellbore.

A laser processing apparatus includes: a light flux separating-and-combining device configured to polarize and separate a laser light into two polarized light fluxes having polarization orthogonal to each other and emit the two light fluxes with their optical paths matching each other toward different regions of a spatial light modulator, and configured to combine the two polarized light fluxes modulated by the spatial light modulator and emit the two light fluxes toward a condenser lens; and a controller configured to control hologram patterns presented by the spatial light modulator for respective regions of the spatial light modulator irradiated with the two polarized light fluxes such that the laser light is condensed by the condenser lens at two positions different from each other in a thickness direction inside of the wafer and the same as each other in a relative movement direction of the laser light to form modified regions.

A shaping system forms a three-dimensional shaped object on a target surface using a beam and has: a beam irradiation section emitting beams passing through tilted optical paths; a material supplying section having a material supplying port and supplies along the axis a powdered material irradiated with the beams from the beam irradiation section; a cover member having an inner surface that gradually converges from a side at one end to a side at the other end and has an outlet formed at the other end through which the beams from the beam irradiation section pass; and a gas supply apparatus supplying inert gas via a gas supplying port into a space inside the cover member, and the inert gas flows outside the space via the outlet of the cover member, and the shaping material is supplied outside the space via the outlet of the cover member.

A light irradiation apparatus includes a light source, a dispersive element, a spatial light modulator, and a focusing element. The dispersive element disperses pulsed light output from the light source and outputs the light. The dispersive element includes, for example. The spatial light modulator modulates a phase spectrum or an intensity spectrum of the light output from the dispersive element and outputs the light. The focusing element receives the light output from the spatial light modulator in a dispersing state, and focuses the light on a common region (focusing region) in a surface or an inside of an object.

Self-retaining suture systems including a suture thread bearing a plurality of laser-cut retainers are disclosed. A laser system allows the creation of retainers and self-retaining suture systems in configurations which are difficult and/or impossible to achieve using mechanical cutting technology.

The invention relates to a method and a device for machining a material layer using energetic radiation to produce three-dimensional components by melting a particulate material in layers. In the method, one or more energetic beams of one or more beam sources are directed onto a layer to be machined and guided over the layer by a dynamic beam guidance system. The method is characterized in that at least one of the energetic beams is divided into multiple individual beams by modulation over time, which are directed onto the layer to be machined in a spatially separated manner. The separation is carried out such that the sum of the power of the individual beams corresponds to the power of the respective energetic beam minus power losses caused by the separation process.

The present disclosure generally relates to a system and method for multiple beam laser deposition of thin films wherein separate laser beams are used to ablate material from separate targets for concurrent deposition on a common substrate. The targets may include, but not limited to polymers, organics, inorganics, nanocrystals, solutions, or mixtures of materials. A target may be disposed on a tiltable mount to adjust the direction of the ablation plumes. Multiple ablation modes may be concurrently employed at the various targets, including, but not limited to pulsed laser, MAPLE, IR-MAPLE and other modes. The system may include a camera and processor for plume axis determination and feedback control of the plume axis by controlling a tilt of a target holder. Maple target loading sequences and liquid states are described. Fluorescent image monitoring is described.

A laser peening processing device includes a laser oscillator configured to oscillate a laser beam; and a nozzle configured to inject liquid to a workpiece for laser peening processing, and to cause the laser beam to be incident on the liquid to irradiate the workpiece with the laser beam which propagates through the liquid. The nozzle includes a lens configured to concentrate the laser beam so that a focal point of the laser beam is formed at a processing position of the laser peening processing, a cylindrical casing configured to protect the laser beam before the laser beam is incident on the liquid, and a pipe disposed in the casing and configured to form a flow path for the liquid.

In various embodiments, a beam-parameter adjustment system and focusing system alters a spatial power distribution of a radiation beam, via thermo-optic effects, before the beam is coupled into an optical fiber or delivered to a workpiece.