In various embodiments, workpieces are processed, e.g., via welding or cutting, while the shape and/or one or more other parameters of the laser processing beam are altered. The shape and/or one or more other parameters of the laser processing beam may be varied based on one or more characteristics of the workpiece.

A method for generating Bessel beams includes the steps of: utilizing a light source to generate an incident beam to a phase modulation module; utilizing the phase modulation module to rectify the incident beam into a circular beam, and to modulate a phase of the circular beam into an asymmetric phase so as to form an asymmetric collimated circular beam provided to a scanning module; utilizing the scanning module to compensate the asymmetric collimated circular beam, and utilizing the asymmetric collimated circular beam to scan at different angles and then enter a focusing element; and, utilizing the focusing element to focus and interfere the asymmetric collimated circular beam into form a Bessel beam for machining.

A laser machining device includes: a broadband light source, which generates a broadband laser beam; a first lens unit to which the broadband laser beam is incident and having a first effective focal length; a second lens unit spaced apart from the first lens unit in a first direction and having a second effective focal length; a beam splitter disposed between the first lens unit and the second lens unit, and which is movable in the first direction and a direction opposite to the first direction within the first effective focal length from the first lens unit, and splits the broadband laser beam passing through the first lens unit into a plurality of sub-laser beams; and a focusing lens spaced apart from the second lens unit in the first direction, and which focuses the sub-laser beams passing through the second lens unit on a substrate.

A processing apparatus includes: a beam irradiation apparatus that is configured to irradiate an object with an energy beam; and a beam deflection apparatus that is configured to change a propagating direction of the energy beam toward the beam irradiation apparatus, wherein when the energy beam propagating toward the beam irradiation apparatus from the beam deflection apparatus propagates in a first direction, the beam irradiation apparatus emits the energy beam in a second direction, and when the energy beam propagating toward the beam irradiation apparatus from the beam deflection apparatus propagates in a third direction that is different from the first direction, the beam irradiation apparatus emits the energy beam in a fourth direction that is different from the second direction.

The present invention discloses an optical path/beam splitting unit and a coaxial-wire-feed cladding head thereof. The optical path/beam splitting unit includes an adjustable mirror and at least one stage of beam splitter. Several adjustable mirrors are distributed around the beam splitter. The beam splitter splits an incident laser beam into a plurality of split beams perpendicular to the incident laser beam. The split beams all are focused to a point through the adjustable mirrors. The coaxial-wire-feed cladding head includes a cladding head mirror cavity provided therein with the optical path/beam splitting unit and a wire feeding tube. The wire feeding tube is coaxially arranged with the collimated laser beam. The wire feeding tube extends out of the cladding head mirror cavity. A wire passes through the wire feeding tube and the wire feeding nozzle in order. The adjustable mirrors adjust the focusing of the split beams onto the wire.

A flexible board is disclosed. The flexible board comprises a flexible baseplate, a scattering structure that is arranged on at least one surface of the flexible baseplate, a buffer layer that is arranged at one side of the scattering structure far from the flexible baseplate, and an active layer that is arranged at one side of the buffer layer far from the flexible baseplate. The flexible board according to the present disclosure has an apparent advantage in protecting the active layer.

A method of separating a substrate includes directing a laser beam into the substrate such that a focal line is formed with at least a portion of the laser beam focal line within a bulk of the substrate at an oblique angle with respect to a laser-incident surface of the substrate. The laser beam focal line is formed by a pulsed laser beam that is disposed along a beam propagation direction. The method further includes pulsing the pulsed laser beam from a first edge of the substrate to a second edge of the substrate in a single pass. The laser beam focal line generates an induced multi-photon absorption within the substrate that produces a damage track within the bulk of the substrate along the laser beam focal line, and the damage track is at an oblique angle relative to the laser-incident surface of the substrate.

A laser array comprises first and second laser unit to respectively emit a first and second laser beams that propagate in a first and second directions and that are polarized in first and second polarization directions and a polarization coupling prism arranged to couple the two laser beams. The coupling prism comprises: a light entry surface to receive the first laser beam; a reflecting surface to reflect the first laser beam at an angle greater than the limit angle of total inner reflection; and a light exit surface through which the first laser beam exits the prism. The second laser unit is arranged relative to the polarization coupling prism to cause the second laser beam to impinge on and be reflected at the light exit surface in the same direction as the first laser beam exiting the prism, resulting in a collinear superposition of the first and second laser beams.

In various embodiments, a beam-parameter adjustment system and focusing system alters a spatial power distribution of a radiation beam, via thermo-optic effects, before the beam is coupled into an optical fiber or delivered to a workpiece.

Numerous embodiments are disclosed. In one, a laser-processing apparatus includes a positioner arranged within a beam path along which a beam of laser energy is propagatable. A controller may be used to control an operation of the positioner to deflect the beam path within first and second primary angular ranges, and to deflect the beam path to a plurality of angles within each of the first and second primary angular ranges. In another, an integrated beam dump system includes a frame; and a pickoff mirror and beam dump coupled to the frame. In still another, a wavefront correction optic includes a mirror having a reflective surface having a shape characterized by a particular ratio of fringe Zernike terms Z4 and Z9. Many more embodiments are disclosed.