A Koehler integrator device (10) comprises a collimating lens (11) being arranged for collimating a light field created by an incoherent or partially coherent light source, a pair of planar first and second micro-lens arrays (12, 13) being arranged for relaying portions of the collimated light field along separate imaging channels, wherein all micro-lenses of the first and second micro-lens arrays (12, 13) have an equal micro-lens focal length and pitch and the micro-lens arrays (12, 13) are arranged with a mutual distance equal to the micro-lens focal length, and a collecting Fourier lens (4) having a Fourier lens diameter and a Fourier lens focal length defining a Fourier lens front focal plane and a Fourier lens back focal plane, wherein the Fourier lens (14) is arranged for superimposing light from all imaging channels in the Fourier lens front focal plane and wherein the second micro-lens array (13) is arranged in the Fourier lens back focal plane, wherein a third micro-lens array (15) is arranged in the Fourier lens front focal plane for creating a wavelength independent array of illumination spots. Furthermore, a confocal microscope apparatus, which comprises the Koehler integrator device, and a method of using the confocal microscope apparatus are described.

A dynamic lens for projecting different output beam shapes upon a target for heating, melting, or otherwise modifying the state of the target material. The dynamic lens includes a first light source of high power laser diodes generating a first light beam onto a lensing array with an LCOS device including a plurality of liquid crystal cells to curve and focus the first light beam into a second light beam forming the output beam shape on the target. A controller generates a control signal corresponding to the output beam shape. A single-point laser projects a third light beam tracing an outline of the output beam shape on the target to more clearly define the edge of the output beam shape. The single-point laser may be an IR fiber laser source scanned or traced by a scanner, such as a galvano scanner, directing the third light beam in two dimensions.

An apparatus and a method for thermal processing within a processing region (1) at a workpiece surface (2) by means of a laser beam (6) emitted by at least one radiation source (5). Arranged in the beam path of the laser beam (6) between the at least one radiation source (5) and the processing region (1) on the workpiece surface (2), there is at least one element (10, 11, 12) by means of which the intensity of the laser beam (6) is modifiable in a locally defined manner within the processing region (1). As an alternative or in addition thereto, the intensity of at least one of the laser beams (6) is modifiable in a locally defined manner within the processing region (1) by a defined actuation of the plurality of radiation sources (5) such that a locally defined distribution of the intensity of the laser beam (6) striking the workpiece surface (2) is achievable within the processing region (1).

A beam adjusting unit of a laser processing apparatus that adjusts a beam diameter of a laser beam includes a first lens unit and a second lens unit that can move along an optical path of the laser beam and a first movement mechanism and a second movement mechanism that move the first lens unit and the second lens unit, respectively, along the optical path. A control unit includes a storing section that stores the beam diameter of the laser beam and positions of the first lens unit and the second lens unit corresponding to the beam diameter in advance, and causes the first movement mechanism and the second movement mechanism to be actuated to move the first lens unit and the second lens unit to positions corresponding to a predetermined beam diameter.

A high power, dual wavelength laser source is formed of a plurality of conventional IR laser diodes disposed in an aligned configuration such that the output beams from the plurality of laser diodes may be simultaneously passed through a bulk optic frequency multiplying device (e.g., a second-harmonic or third-harmonic generating crystal). The combination of the individual laser diodes creates a high power input beam, where the power level itself is determined by the number of individual devices (or bars) used at the input. The frequency multiplying device creates a known harmonic of the input beam, providing as an output two beams, one operating at the original wavelength (denoted λ) and another operating at a fraction of that original wavelength.

Apparatus and methods for laser bond inspection (LBI) of internal bonds in a composite structure with limited access. The technology solves the problem of access for an LBI process head through selection of optics, an articulated optical path and simplification of the method of collecting debris. A small-format process head is specifically designed for laser bond inspection in limited-access spaces. This process head allows access to locations within ½ inch of a nearby wall or structure and utilizes a laser beam that is much smaller (˜2-3 mm) in diameter. The apparatus incorporates articulated joints to improve access to locations in the structure being inspected. The process head may also be configured to protect the optical elements (e.g., the focusing lens) from blow-back of debris from the LBI inspection process.

A laser decontamination system according to an embodiment of the present invention includes: a laser generator generating a laser beam; an optical head inserted inside a pipe and focusing the laser beam on a contamination material inside the pipe for laser ablation; a first optical fiber connecting the laser generator and the optical head and transmitting the laser beam to the optical head; a spectroscope for analyzing a plasma spectrum generated in the pipe by the laser ablation; a second optical fiber connecting the spectroscope and the optical head and transmitting the plasma spectrum to the spectroscope; a dust collector for collecting a dust generated in the pipe by the laser ablation; a dust collection pipe connecting the dust collector and the inside of the pipe and transmitting the dust to the dust collector; and a blocking film positioned between the optical head and the pipe to block the dust.

In various embodiments, workpieces are processed, e.g., via welding or cutting, while the shape and/or one or more other parameters of the laser processing beam are altered. The shape and/or one or more other parameters of the laser processing beam may be varied based on one or more characteristics of the workpiece.

Described herein is a system for processing a workpiece that includes a plurality of lasers that each produces a laser beam pulse. The system also includes a laser control module that sequences temporal characteristics of the laser beam pulses. Additionally, the system includes a laser beam compensation module that shapes a near field intensity profile of at least one of the laser beam pulses and adjusts a path length of at least one of the laser beam pulses. The system also includes at least one laser beam position element that combines the laser beam pulses to produce a combined laser beam pulse at a surface of the workpiece.

A laser apparatus may include a laser generator generating at least one a laser beam, which is used as an input light, an optical system converting the input light, which is provided from the laser generator, into a plurality of pattern lights, and a stage, on which a target object is loaded. The output light may be irradiated onto the target object. The optical system may divide the input light into a plurality of divided lights, and the pattern lights may be produced by constructive interference of the plurality of divided lights. A diameter of each of the pattern lights may be smaller than a diameter of the input light.