Patent classifications
B23K26/066
Electrode Tab Welding Method and Secondary Battery Including Electrode Assembly
Provided is an electrode tab welding method including aligning one end portion of an electrode tab unit including a plurality of electrode tabs protruding from one side or both sides of an electrode assembly in which electrodes and separators are stacked to overlap one end portion of an electrode lead; and irradiating an overlapping area where the electrode tab unit and the electrode lead overlap each other with a laser for welding. Each of the electrode tabs belonging to the electrode tab unit is an ultra-thin electrode tab having a thickness of 15 μm or less, and the number of electrode tabs stacked in one direction in the electrode tab unit is at least 40.
Electrode Tab Welding Method and Secondary Battery Including Electrode Assembly
Provided is an electrode tab welding method including aligning one end portion of an electrode tab unit including a plurality of electrode tabs protruding from one side or both sides of an electrode assembly in which electrodes and separators are stacked to overlap one end portion of an electrode lead; and irradiating an overlapping area where the electrode tab unit and the electrode lead overlap each other with a laser for welding. Each of the electrode tabs belonging to the electrode tab unit is an ultra-thin electrode tab having a thickness of 15 μm or less, and the number of electrode tabs stacked in one direction in the electrode tab unit is at least 40.
Laser pulse shaping for additive manufacturing
The present disclosure relates to an apparatus for additively manufacturing a product in a layer-by-layer sequence, wherein the product is formed using powder particles deposited on an interface layer of a substrate. A laser generates first and second beam components. The second beam component has a higher power level and a shorter duration than the first beam component. A mask creates a 2D optical pattern in which only select portions of the second beam components can irradiate the powder particles. The first beam component heats the powder particles close to a melting point, where the particles experience surface tension forces relative to the interface layer. While the particles are heated, the second beam component further heats the particles and also melts the interface layer before the surface tension forces can act on and distort the particles, enabling the particles and the interface layer are able to bond together.
Laser pulse shaping for additive manufacturing
The present disclosure relates to an apparatus for additively manufacturing a product in a layer-by-layer sequence, wherein the product is formed using powder particles deposited on an interface layer of a substrate. A laser generates first and second beam components. The second beam component has a higher power level and a shorter duration than the first beam component. A mask creates a 2D optical pattern in which only select portions of the second beam components can irradiate the powder particles. The first beam component heats the powder particles close to a melting point, where the particles experience surface tension forces relative to the interface layer. While the particles are heated, the second beam component further heats the particles and also melts the interface layer before the surface tension forces can act on and distort the particles, enabling the particles and the interface layer are able to bond together.
Laser processing machine
A laser processing machine includes: a variable focal length optical system in which a focus position is periodically changed in response to a drive signal to be inputted; a position-detection light source configured to emit a detection light onto a workpiece through the variable focal length optical system; a light detector configured to receive the detection light reflected on the workpiece and output a light detection signal; a signal processor configured to output a synchronization pulse signal in synchronization with the focus timing when the detection light is focused on the surface of the workpiece in accordance with the inputted light detection signal; and a laser oscillator configured to oscillate a pulse laser beam in accordance with the inputted synchronization pulse signal to radiate the pulse laser beam on the workpiece through the variable focal length optical system.
Laser processing machine
A laser processing machine includes: a variable focal length optical system in which a focus position is periodically changed in response to a drive signal to be inputted; a position-detection light source configured to emit a detection light onto a workpiece through the variable focal length optical system; a light detector configured to receive the detection light reflected on the workpiece and output a light detection signal; a signal processor configured to output a synchronization pulse signal in synchronization with the focus timing when the detection light is focused on the surface of the workpiece in accordance with the inputted light detection signal; and a laser oscillator configured to oscillate a pulse laser beam in accordance with the inputted synchronization pulse signal to radiate the pulse laser beam on the workpiece through the variable focal length optical system.
METHOD FOR PRODUCING MICROSTRUCTURES ON AN OPTICAL CRYSTAL
A method for producing at least one optically usable microstructure, in particular at least one waveguide structure, on an optical crystal is provided. The method includes irradiating a pulsed laser beam onto a surface of the optical crystal, moving the pulsed laser beam and the optical crystal relative to one another along a feed direction in order to remove material of the optical crystal along at least one ablation path in order to form the optically usable microstructure. The pulsed laser beam is irradiated onto the surface of the optical crystal with pulse durations of less than 5 ps, preferably less than 850 fs, more preferably less than 500 fs, in particular less than 300 fs, and with a wavelength of less than 570 nm, preferably less than 380 nm.
GROOVE PROCESSING DEVICE AND GROOVE PROCESSING METHOD
A groove processing device (100) that forms a groove in a surface of an object using laser beams (LB) includes: a light source device (11) that outputs the laser beams (LB); a polygon mirror (10) that reflects the laser beams output from the light source device (11); a condensing optical system that is provided on an optical path of the laser beams (LB) reflected by the polygon mirror (11) and focuses the laser beams (LB); and a shielding plate (35) that is provided between the condensing optical system and the object at a position which blocks some of the laser beams (LB) focused through the condensing optical system and blocks some of the laser beams (LB). Among the laser beams (LB) focused through the condensing optical system, some of the laser beams (LB) that are not blocked by the shielding plate (35) form the groove in the surface of the object at a focus of the laser beams (LB). The shielding plate (35) is provided closer to the condensing optical system than the focus and is rotated with respect to the surface of the object so as to block the laser beams (LB) that do not form the groove.
GROOVE PROCESSING DEVICE AND GROOVE PROCESSING METHOD
A groove processing device (100) that forms a groove in a surface of an object using laser beams (LB) includes: a light source device (11) that outputs the laser beams (LB); a polygon mirror (10) that reflects the laser beams output from the light source device (11); a condensing optical system that is provided on an optical path of the laser beams (LB) reflected by the polygon mirror (11) and focuses the laser beams (LB); and a shielding plate (35) that is provided between the condensing optical system and the object at a position which blocks some of the laser beams (LB) focused through the condensing optical system and blocks some of the laser beams (LB). Among the laser beams (LB) focused through the condensing optical system, some of the laser beams (LB) that are not blocked by the shielding plate (35) form the groove in the surface of the object at a focus of the laser beams (LB). The shielding plate (35) is provided closer to the condensing optical system than the focus and is rotated with respect to the surface of the object so as to block the laser beams (LB) that do not form the groove.
Jig for spot welding
A spot welding jig is provided. The spot welding jig presses electrode leads of battery cells to be closely adhered onto a bus bar when spot welding is performed to the electrode leads interposed on the bus bar along a width direction of the electrode leads. The spot welding jig includes a passing portion through which a welding laser passes, and a predetermined number of barriers configured to vertically partition an inner space of the passing portion.