A laser beam trimming and redirecting device having an aperture therein, the aperture defined by a inner beveled surface for focusing the laser beam directed therethrough and the aperture having an outer beveled surface, or beveled edge, for trimming the laser beam and reflecting the excess energy back towards a source at an angle other than 180 degrees. A reflection capture device positionable upstream of the trimming and redirecting device is configured to absorb the reflected energy instead of the laser beam source or delivery components. The capture device is a liquid cooled device so as dissipate the heat energy absorbed preventing degradation of the device.

A method of fiber laser processing of thin film deposited on a substrate includes providing a laser beam from at least one fiber laser which is guided through a beam-shaping unit onto the thin film. The beam-shaping optics is configured to shape the laser beam into a line beam which irradiates a first irradiated thin film area Ab on a surface of the thin film, with the irradiated thin film area Ab being a fraction of the thin film area Af. By continuously displacing the beam shaping optics and the film relative to one another in a first direction at a distance dy between sequential irradiations, a sequence of uniform irradiated thin film areas Ab are formed on the film surface defining thus a first elongated column. Thereafter the beam shaped optics and film are displaced relative to one another at a distance dx in a second direction transverse to the first direction with the distance dx being smaller than a length of the irradiated film area Ab. With the steps performed to form respective columns, the elongated columns overlap one another covering the desired thin film area Af. The dx and dy distances are so selected that that each location of the film area Af is exposed to the shaped laser beam during a cumulative predetermined duration.

An apparatus and a method for forming alignment marks are disclosed. The method for forming alignment marks is a photolithography-free process and includes the following operations. A laser beam is provided. The laser beam is divided into a plurality of laser beams separated from each other. The plurality of laser beams is shaped into a plurality of patterned beams, so that the plurality of patterned beams is shaped with patterns corresponding to alignment marks. The plurality of patterned beams is projected onto a semiconductor wafer.

A maintenance management method for a lithography system according to a viewpoint of the present disclosure includes organizing and saving operating information for each of lithography cells that are each an apparatus group formed of a set of apparatuses and form the lithography system, organizing and saving maintenance information on consumables for each of the lithography cells, calculating a standard maintenance timing for each of the consumables for each of the lithography cells based on the operating information and the maintenance information on the consumable for each of the lithography cells, creating a maintenance schedule plan for each of the lithography cells or for each of manufacturing lines based on the standard maintenance timing, information on a downtime, and information on a loss cost due to the downtime for each of the lithography cells or for each of the manufacturing lines, and outputting the result of the creation of the maintenance schedule plan.

The present disclosure relates to a method involving a substrate having an interface layer, wherein the interface layer (IL) forms only an upper surface portion of the substrate, and a feedstock material (FM) placed on the IL. The method involves using a laser system to generate first and second beam components providing first and second power flux levels, respectively, where the second power flux level which is greater than the first. The FM is heated to a first level short of a melting point using the first beam component, at which point the particles of the FM begin to experience surface tension forces relative to the IL. Further heating the FM to a second level melts the FM and also melts the IL of the substrate, but where a portion of the IL remains unmelted by the second beam component as the particles of the FM and the IL are bonded together. The method also involves configuring the laser system such that the second beam component has a duration less than the first beam component by a factor of at least 1103, and a power controlled to be sufficient only to melt the interface layer of the substrate.

The present disclosure relates to a method involving a substrate having an interface layer, wherein the interface layer (IL) forms only an upper surface portion of the substrate, and a feedstock material (FM) placed on the IL. The method involves using a laser system to generate first and second beam components providing first and second power flux levels, respectively, where the second power flux level which is greater than the first. The FM is heated to a first level short of a melting point using the first beam component, at which point the particles of the FM begin to experience surface tension forces relative to the IL. Further heating the FM to a second level melts the FM and also melts the IL of the substrate, but where a portion of the IL remains unmelted by the second beam component as the particles of the FM and the IL are bonded together. The method also involves configuring the laser system such that the second beam component has a duration less than the first beam component by a factor of at least 1103, and a power controlled to be sufficient only to melt the interface layer of the substrate.

A laser irradiation apparatus (1) according to an embodiment includes an optical-system module (20) configured to apply laser light (L1) to an object to be irradiated, a shield plate (51) in which a slit (54) is formed, through which the laser light (L1) passes, and a reflected-light receiving component (61) disposed between the optical-system module (20) and the shield plate (51), in which the reflected-light receiving component (61) is able to receive, out of the laser light (L1), reflected light (R1) reflected by the shield plate (51).

A laser irradiation apparatus (1) according to an embodiment includes an optical-system module (20) configured to apply laser light (L1) to an object to be irradiated, a shield plate (51) in which a slit (54) is formed, through which the laser light (L1) passes, and a reflected-light receiving component (61) disposed between the optical-system module (20) and the shield plate (51), in which the reflected-light receiving component (61) is able to receive, out of the laser light (L1), reflected light (R1) reflected by the shield plate (51).

A laser irradiation apparatus (1) according to an embodiment includes an optical-system module (20) configured to apply laser light (L1) to an object to be irradiated, a shield plate (51) in which a slit (54) is formed, through which the laser light (L1) passes, and a reflected-light receiving component (61) disposed between the optical-system module (20) and the shield plate (51), in which the reflected-light receiving component (61) is able to receive, out of the laser light (L1), reflected light (R1) reflected by the shield plate (51).

A laser irradiation apparatus (1) according to an embodiment includes an optical-system module (20) configured to apply laser light (L1) to an object to be irradiated, a shield plate (51) in which a slit (54) is formed, through which the laser light (L1) passes, and a reflected-light receiving component (61) disposed between the optical-system module (20) and the shield plate (51), in which the reflected-light receiving component (61) is able to receive, out of the laser light (L1), reflected light (R1) reflected by the shield plate (51).