Provided is a laser welding apparatus configured to weld an electrode lead of at least one secondary battery of a battery module and a main bus bar configured to electrically connect a plurality of secondary batteries to each other. The laser welding apparatus includes: a laser beam emitting unit including a laser emitting element to irradiate a laser beam to the electrode lead and the main bus bar; a pressing jig including a pressing bar configured to move in a left-and-right direction such that the electrode lead is adhered to the main bus bar; and a blocking block movable to block the laser beam generated in the laser beam emitting unit from reaching the at least one secondary battery or movable to allow the generated laser beam to pass therethrough, according to a position of the pressing bar moved in the left-and-right direction.

A laser marking system comprises a laser energy source that generates a laser beam, a laser controller configured to focus the laser beam over a field of view greater than a size of laser-markable items, and a start-up target that includes laser-safe material and is located within the field of view. The laser controller is further configured to point the laser beam at the start-up target during a start-up phase of the laser energy source and focus the laser beam on one of the laser-markable items after the start-up phase.

A laser marking system comprises a laser energy source that generates a laser beam, a laser controller configured to focus the laser beam over a field of view greater than a size of laser-markable items, and a start-up target that includes laser-safe material and is located within the field of view. The laser controller is further configured to point the laser beam at the start-up target during a start-up phase of the laser energy source and focus the laser beam on one of the laser-markable items after the start-up phase.

To provide a laser irradiation apparatus which suppresses adhesion of foreign matters to an optical element, a laser irradiation device includes: emission optical systems, which form a beam in which laser light generated by a laser oscillator converges on a predetermined beam spot, and continuously change an irradiation direction or the like of the beam; and a protective member which is arranged between the emission optical system and the beam spot, and protects the emission optical system from foreign matters scattered from an irradiation object side, and the protective member has an aperture through which the beam passes and moves in connection with a change of the irradiation direction or the like of the beam so that the aperture is positioned on a path of the beam.

A method and an apparatus for processing an object by generation of laser radiation as a collimated laser beam, influencing the intensity distribution and/or the phase progression over the cross section of the laser beam, splitting the laser beam into two partial beams, and deflection and focusing of the partial beams so that the partial beams are superimposed in a processing zone in the material of the object.

A method and an apparatus for processing an object by generation of laser radiation as a collimated laser beam, influencing the intensity distribution and/or the phase progression over the cross section of the laser beam, splitting the laser beam into two partial beams, and deflection and focusing of the partial beams so that the partial beams are superimposed in a processing zone in the material of the object.

A manufacturing method for a printed circuit board includes: passing a first laser beam output from a laser output device through a first aperture so as to define an outer diameter of the first laser beam, positioning the first laser beam by an optical axis positioning device including a galvano device and an fθ lens, and irradiating the printed circuit board with the first laser beam such that a through-hole is formed in a copper layer; and passing a second laser beam output from the laser output device through a second aperture so as to define an outer diameter of the second laser beam whereby a diameter of the second aperture is smaller than a diameter of the first aperture, positioning the second laser beam by the optical axis positioning device, and irradiating the printed circuit board with the second laser beam such that an insulating layer is processed.

An optical device, its use, and a method for interference structuring of a sample. A laser emits a laser beam that is split into at least two partial beams by a beam splitter. A first cylindrical lens and a second cylindrical lens for refracting the partial beams into an interference area are arranged in the beam path. The partial beams interfere in such a way that a structure having linear structure elements may be formed in a structural region of the sample. The cylinder axis of the first cylindrical lens is aligned parallel to the cylinder axis of the second cylindrical lens.

A method of processing a transparent workpiece that includes directing a laser beam combination comprising a first beam and a second beam into the transparent workpiece simultaneously, the first beam passing through an impingement surface of the transparent workpiece at a first impingement location and the second beam passing through the impingement surface at a second impingement location. The first beam forms a first laser beam focal line in the transparent workpiece and generates a first induced absorption to produce a first defect segment within the transparent workpiece, the first defect segment having a first chamfer angle and the second beam forms a second laser beam focal line in the transparent workpiece and generates a second induced absorption to produce a second defect segment within the transparent workpiece, the second defect segment having a second chamfer angle, the second chamfer angle differing from the first chamfer angle.

A method of processing a transparent workpiece that includes directing a laser beam combination comprising a first beam and a second beam into the transparent workpiece simultaneously, the first beam passing through an impingement surface of the transparent workpiece at a first impingement location and the second beam passing through the impingement surface at a second impingement location. The first beam forms a first laser beam focal line in the transparent workpiece and generates a first induced absorption to produce a first defect segment within the transparent workpiece, the first defect segment having a first chamfer angle and the second beam forms a second laser beam focal line in the transparent workpiece and generates a second induced absorption to produce a second defect segment within the transparent workpiece, the second defect segment having a second chamfer angle, the second chamfer angle differing from the first chamfer angle.