Disclosed herein is a laser processing apparatus including first and second laser mechanisms, a laser oscillator for oscillating an original laser beam, an optical system for branching the original laser beam into first and second laser beams, and first and second operation panels for respectively setting first and second processing conditions for the first and second laser mechanisms. The first and second laser mechanisms include first and second chuck tables for holding first and second workpieces, first and second X moving units for moving the first and second chuck tables in an X direction, first and second Y moving units for moving the first and second chuck tables in a Y direction perpendicular to the X direction, and first and second focusing units for focusing the first and second laser beams to the first and second workpieces held on the first and second chuck tables, respectively.

A method of customizing the surface of a firearm and a resulting customized firearm includes laser ablating a predetermined metallic surface area of the firearm. An image that fits within the borders of the laser ablated surface is then ink-printed onto the laser ablated surface of the firearm.

A laser machining method and a laser machining device according to the present invention include: emitting a beam of laser light in a form of pulse separated from each other; making a plurality of beams of the laser light incident on a light collection optical system that reduces a gap between the beams of the laser light; irradiating the surface to be machined with the plurality of beams of the laser light emitted to form a plurality of focused spots separated from each other, the plurality of focused spots each causing ablation; and moving the light collection optical system and the surface to be machined relative to each other both to simultaneously form a plurality of grooves on the surface to be machined.

A laser processing head includes first and second contact points connected to a power source. The power source generates a current to flow through an electrode wire between the first and second contact points to heat the electrode wire. A laser source generates one or more laser beams having lasing power sufficient to at least partially melt the electrode wire. A coaxial laser head focuses the one or more laser beams at one or more focal points on a workpiece to at least partially melt the electrode wire.

A multi-laser beam focusing and scribing device with following function includes a beam splitter module, a focusing lens module, a first shaft, a diffractive optical element (DOE) beam shaping lens, a second adjustment shaft, a coaxial charge-coupled device (CCD) vision module, and a distance-measuring sensor. The first adjustment shaft is configured to adjust a focus position, and the second adjustment shaft is configured to adjust a spacing between scribed lines, and is electrically-powered. The beam splitter module is configured to split an incident laser beam into a plurality of sub-beams.

Described is a method of providing a rubber article (100) with a digital code pattern (102), wherein the rubber article (100) comprises a cured polymer material (104), the method comprising: Generating, e.g. by means of electromagnetic radiation (110), a digital code pattern (102) in the cured polymer material of the rubber article, the digital code pattern (102) comprising a first surface portion (106) and a second surface portion (108) having different optical reflectivity. Generating the digital code pattern (102) may include generating protrusions (114) or holes (126) in the second surface portions (108). The digital code pattern (102) may identify the rubber article (100) e.g. within a batch of rubber articles. Described is also a rubber article (100) comprising a digital code pattern (102), a rubber article marking device and a computer program product for controlling a rubber article marking device.

A method includes transferring multiple discrete components from a first substrate to a second substrate, including illuminating multiple regions on a top surface of a dynamic release layer, the dynamic release layer adhering the multiple discrete components to the first substrate, each of the irradiated regions being aligned with a corresponding one of the discrete components. The illuminating induces a plastic deformation in each of the irradiated regions of the dynamic release layer. The plastic deformation causes at least some of the discrete components to be concurrently released from the first substrate.

A substrate manufacturing method includes applying a laser beam of a wavelength transmittable through a material of a workpiece, thereby forming a peel-off layer inside the workpiece, and after the forming of the peel-off layer, with the peel-off layer as a starting point of separation, separating the workpiece, thereby manufacturing a substrate. In the forming of the peel-off layer, by alternately repeating moving the workpiece and a focusing point at which the laser beam is focused relative to each other along a first direction, in a state in which the focusing point is positioned inside the workpiece, and moving the workpiece and a position at which the focusing point is formed relative to each other along a second direction perpendicular to the first direction, the peel-off layer including first modified portions and second modified portions which are alternately lined up in the second direction is formed.

An apparatus for manufacturing a deposition mask including a stage on which a mask substrate is mounted, a light source configured to irradiate a laser beam, a beam splitter configured to split the irradiated laser beam into a plurality of laser beams, a scanner configured to simultaneously scan the plurality of laser beams onto the mask substrate, and a tuner configured to finely change irradiation states of the plurality of laser beams to correspond to shapes of a plurality of pattern holes, while the plurality of laser beams are scanned.

Disclosed is an optical system for laser machining that enables simpler and more reliable machining of several patterns simultaneously on the same part. The system comprises an ultra-short pulse laser source for generating a source laser beam; a device with a separation means for separating a source laser beam into a plurality of separated laser beams, such that each of the separated laser beams is directed in a direction of propagation specific thereto; a spatial offsetting unit for obtaining, from the plurality of separated laser beams, a plurality of offset laser beams such that each offset laser beam can propagate around a main axis of propagation A specific thereto and is capable of describing a movement around the main axis of propagation A; and a focusing means configured to focus each offset laser beam on a workpiece in the direction of the axis of propagation specific thereto.