An apparatus includes a support unit supporting a substrate including a film, a laser generation unit that generates a laser beam to process the film, a beam splitter that splits the laser beam into a first laser beam travelling along a first path toward an upper edge of the substrate and a second laser beam travelling along a second path toward a lower edge of the substrate, a first beam shaping unit on the first path shaping the first laser beam, a second beam shaping unit on the second path shaping the second laser beam, a first beam scanning unit downstream of the first beam shaping unit that applies the first laser beam to the upper edge in the manner of scanning, and a second beam scanning unit downstream of the second beam shaping unit that applies the second laser beam to the lower edge in the manner of scanning.

Disclosed is an optical system for laser machining that enables simpler and more reliable machining of several patterns simultaneously on the same part. The system comprises an ultra-short pulse laser source for generating a source laser beam; a device with a separation means for separating a source laser beam into a plurality of separated laser beams, such that each of the separated laser beams is directed in a direction of propagation specific thereto; a spatial offsetting unit for obtaining, from the plurality of separated laser beams, a plurality of offset laser beams such that each offset laser beam can propagate around a main axis of propagation A specific thereto and is capable of describing a movement around the main axis of propagation A; and a focusing means configured to focus each offset laser beam on a workpiece in the direction of the axis of propagation specific thereto.

A laser processing apparatus includes: a laser light source configured to generate a laser beam; a plurality of scanners, wherein each of the plurality of scanners is configured to move the laser beam along a processing path so that the laser beam is irradiated onto a corresponding workpiece of a plurality of workpieces, respectively; a plurality of lenses respectively disposed between the plurality of scanners and the plurality of workpieces; and a measuring circuit spaced apart from the plurality of lenses with the plurality of workpieces interposed therebetween, wherein: the measuring circuit moves along a measuring path and measures a characteristic of the laser beam; and the measuring path overlaps the processing path of each of the plurality of scanners.

An apparatus for laser machining a workpiece includes a beam shaping device for forming a focal zone from an input laser beam incident on the beam shaping device, and a telescope device for imaging the focal zone into a material of the workpiece. The beam shaping device is configured to impose a phase on a beam cross section of the input laser beam in such a way that the focal zone extends along a longitudinal centre axis which is curved at least in certain portions. The telescope device is assigned a beam splitting device for splitting an output laser beam output coupled from the beam shaping device into a plurality of polarized partial beams, each of which has one of at least two different polarization states. The focal zone has an asymmetrical cross section in a plane oriented perpendicular to the longitudinal centre axis.

A method includes transferring multiple discrete components from a first substrate to a second substrate, including illuminating multiple regions on a top surface of a dynamic release layer, the dynamic release layer adhering the multiple discrete components to the first substrate, each of the irradiated regions being aligned with a corresponding one of the discrete components. The illuminating induces a plastic deformation in each of the irradiated regions of the dynamic release layer. The plastic deformation causes at least some of the discrete components to be concurrently released from the first substrate.

A method and a laser assemblage are described for material processing, such that in a laser assemblage, a laser beam is focused onto a processing/imaging plane and the laser beam can be adapted in terms of its intensity distribution by way of at least one beam shaper. Provision is made in this context that in order to avoid uniformity defects in the processing/imaging plane, the laser beam is split by way of at least one beam splitter into at least two partial or individual beams, and the partial or individual beams are differently influenced, or each partial or individual beam is constituted from a laser source having a different wavelength, in such a way that after they are combined and focused onto the processing/imaging plane they form an output beam having an intensity profile, adjacent intensity maxima of the intensity profile differing in terms of their light properties. It is thereby possible to prevent the occurrence of obtrusive interference so that obtrusive speckle patterns are largely eliminated, with the result that beam shaping quality, in particular for laser processing processes, can be considerably improved.

A laser welding method includes a welding process of irradiating a multiple laser beam so as to weld together a first member and a second member at a boundary. The multiple laser beam includes a first beam that is advanced while forming a first molten pool in which the first member is melted, a second beam that is advanced while forming a second molten pool in which the second member is melted, and a main beam that is advanced subsequently to the first beam and the second beam and irradiated to an integrated molten pool formed by integration of the first molten pool and the second molten pool. The first beam and the second beam do not swing, while the main beam swings with respect to the boundary.

An apparatus for manufacturing a deposition mask including a stage on which a mask substrate is mounted, a light source configured to irradiate a laser beam, a beam splitter configured to split the irradiated laser beam into a plurality of laser beams, a scanner configured to simultaneously scan the plurality of laser beams onto the mask substrate, and a tuner configured to finely change irradiation states of the plurality of laser beams to correspond to shapes of a plurality of pattern holes, while the plurality of laser beams are scanned.

A method includes transferring multiple discrete components from a first substrate to a second substrate, including illuminating multiple regions on a top surface of a dynamic release layer, the dynamic release layer adhering the multiple discrete components to the first substrate, each of the irradiated regions being aligned with a corresponding one of the discrete components. The illuminating induces a plastic deformation in each of the irradiated regions of the dynamic release layer. The plastic deformation causes at least some of the discrete components to be concurrently released from the first substrate.

A laser processing device includes a laser oscillator, first to third optical fibers, a beam control mechanism, and first to third laser light emitting heads attached to the first to third optical fibers, respectively. The beam control mechanism includes a condenser lens, first to third optical path changing mechanisms provided on an optical path of laser light LB after being transmitted through the condenser lens, and a controller that controls operations of the first to third optical path changing mechanisms. The beam control mechanism causes the laser light to be emitted from the first laser light emitting head via the selected first optical fiber.