An example system includes a laser tool configured for downhole movement. The laser tool includes an optical assembly configured to shape a laser beam for output. The laser beam may have an optical power of at least one kilowatt (1 kW). A housing contains the optical assembly. The housing is configured for movement to direct the output laser beam within a wellbore. The movement includes rotation of the laser tool around a longitudinal axis of the housing and tilting the housing relative to a longitudinal axis of the wellbore. A control system is configured to control at least one of the movement of the housing or an operation of the optical assembly to direct the output laser beam within the wellbore.

A method for providing a first and a second laser beam, which are spatially offset in relation to an input laser beam. The method includes: providing a laser source for generating the input laser beam; providing a spatial offsetting unit for providing an offset laser beam that can keep the same polarization between the input laser beam and the offset laser beam; providing a separating unit including a first module for separation by polarization in order to obtain, from the offset laser beam: the first laser beam spatially offset by transmission; and the second laser beam spatially offset by reflection, the first and second spatially offset laser beams being suitable for each describing a circle.

A laser welding method includes a welding process of irradiating a multiple laser beam so as to weld together a first member and a second member at a boundary. The multiple laser beam includes a first beam that is advanced while forming a first molten pool in which the first member is melted, a second beam that is advanced while forming a second molten pool in which the second member is melted, and a main beam that is advanced subsequently to the first beam and the second beam and irradiated to an integrated molten pool formed by integration of the first molten pool and the second molten pool. The first beam and the second beam do not swing, while the main beam swings with respect to the boundary.

An additive manufacturing system includes a platform, a dispenser to dispense a plurality of layers of feed material on a top surface of the platform, a light source to generate a first light beam and a second light beam, a polygon mirror scanner, a galvo mirror scanner positioned adjacent to the polygon mirror scanner, and a controller. The controller is coupled to the light source, the polygon mirror scanner and the galvo mirror scanner, and the controller is configured to cause the light source and polygon mirror scanner to apply the first light beam to a region of the layer of feed material, and to cause the light source and galvo mirror scanner to apply the second light beam to at least a portion of the region of the layer of feed material.

A laser processing apparatus includes: a light flux separating-and-combining device configured to polarize and separate a laser light into two polarized light fluxes having polarization orthogonal to each other and emit the two light fluxes with their optical paths matching each other toward different regions of a spatial light modulator, and configured to combine the two polarized light fluxes modulated by the spatial light modulator and emit the two light fluxes toward a condenser lens; and a controller configured to control hologram patterns presented by the spatial light modulator for respective regions of the spatial light modulator irradiated with the two polarized light fluxes such that the laser light is condensed by the condenser lens at two positions different from each other in a thickness direction inside of the wafer and the same as each other in a relative movement direction of the laser light to form modified regions.

Methods of dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a method of dicing a semiconductor wafer having a plurality of integrated circuits involves forming a mask above the semiconductor wafer, the mask composed of a layer covering and protecting the integrated circuits. The mask is then patterned with a spatially multi-focused laser beam laser scribing process to provide a patterned mask with gaps, exposing regions of the semiconductor wafer between the integrated circuits. The semiconductor wafer is then plasma etched through the gaps in the patterned mask to singulate the integrated circuits.

A welding method includes a step of, while irradiating laser beam toward a workpiece, relatively moving the laser beam and the workpiece and, while sweeping the laser beam on the workpiece, melting the workpiece in an irradiated portion to perform welding. Further, the laser beam is configured by a main power region and a sub-power region, at least a part of the sub-power region is present on a sweeping direction side of the main power region, a power density of the main power region is equal to or higher than a power density of the sub-power region, and the power density of the main power region is at least power density that can generate a keyhole.

A perforation system is disclosed that utilizes an optical beamlet generator and a scanner (e.g., at least two moveable mirrors). The optical beamlet generator may be a lenslet array or a diffractive optical element. The optical beamlet generator outputs a plurality of beamlets from a single input laser beam. These beamlets are moved in at least two dimensions relative to a surface of a substrate to form perforations in the substrate.

A laser integrated switching device for mounting on a laser cutting machine is disclosed, wherein it comprises a laser tube, a X/Y deflection laser outputting module, a triaxial deflection laser outputting module, a first optical path, a second optical path, and an optical path switcher; wherein the first optical path is disposed with both ends thereof connecting to the laser tube and the X/Y deflection laser outputting module, the second optical path is disposed with both ends thereof connecting to the laser tube and the triaxial deflection laser outputting module, and the optical path switcher is disposed between the first and second optical paths, thereby before the optical path switcher switches the laser beams to the first optical path or the second optical path, the laser tube alternately outputs laser beams to the X/Y deflection laser outputting module or the triaxial deflection laser outputting module.

The invention relates to a device and a method for generating a multiple spot during laser material processing. According to the present invention, the power distribution is selected by pushing at least a first mirror into the laser beam. The light beam always falls on only one side of the mirror, so that the mirror can be produced easily and economically.