Disclosed herein is a laser processing apparatus including first and second laser mechanisms, a laser oscillator for oscillating an original laser beam, an optical system for branching the original laser beam into first and second laser beams, and first and second operation panels for respectively setting first and second processing conditions for the first and second laser mechanisms. The first and second laser mechanisms include first and second chuck tables for holding first and second workpieces, first and second X moving units for moving the first and second chuck tables in an X direction, first and second Y moving units for moving the first and second chuck tables in a Y direction perpendicular to the X direction, and first and second focusing units for focusing the first and second laser beams to the first and second workpieces held on the first and second chuck tables, respectively.

Systems and methods for dicing a sample by a Bessel beam matrix are disclosed. The method for dicing a sample by a Bessel beam matrix may comprise generating a Bessel beam matrix including multiple Bessel beams arranged in a matrix form, according to a predetermined dicing layout of the sample; controlling a focus position of each Bessel beam in the generated Bessel beam matrix; and focusing simultaneously the Bessel beams of the Bessel beam matrix at the respective controlled focus positions within the sample for dicing.

A method includes transferring multiple discrete components from a first substrate to a second substrate, including illuminating multiple regions on a top surface of a dynamic release layer, the dynamic release layer adhering the multiple discrete components to the first substrate, each of the irradiated regions being aligned with a corresponding one of the discrete components. The illuminating induces a plastic deformation in each of the irradiated regions of the dynamic release layer. The plastic deformation causes at least some of the discrete components to be concurrently released from the first substrate.

An example system includes a laser tool configured for downhole movement. The laser tool includes an optical assembly configured to shape a laser beam for output. The laser beam may have an optical power of at least one kilowatt (1 kW). A housing contains the optical assembly. The housing is configured for movement to direct the output laser beam within a wellbore. The movement includes rotation of the laser tool around a longitudinal axis of the housing and tilting the housing relative to a longitudinal axis of the wellbore. A control system is configured to control at least one of the movement of the housing or an operation of the optical assembly to direct the output laser beam within the wellbore.

A laser processing apparatus includes: a light flux separating-and-combining device configured to polarize and separate a laser light into two polarized light fluxes having polarization orthogonal to each other and emit the two light fluxes with their optical paths matching each other toward different regions of a spatial light modulator, and configured to combine the two polarized light fluxes modulated by the spatial light modulator and emit the two light fluxes toward a condenser lens; and a controller configured to control hologram patterns presented by the spatial light modulator for respective regions of the spatial light modulator irradiated with the two polarized light fluxes such that the laser light is condensed by the condenser lens at two positions different from each other in a thickness direction inside of the wafer and the same as each other in a relative movement direction of the laser light to form modified regions.

A printing apparatus for printing a three-dimensional object, including an operative surface; a printing head comprising a frame attached pivotally to at least one control arm, wherein the frame is rotatable about an axis disposed at a point of attachment between the frame and control arm; a plurality of powder dispensers connected at a plurality of positions along the frame, the powder dispensers being configured to deposit multiple layers of powder onto the operative surface simultaneously when the printing head travels relative to the operative surface; and an energy source for emitting at least one energy beam onto at least one layer of powder.

A method and a laser assemblage are described for material processing, such that in a laser assemblage, a laser beam is focused onto a processing/imaging plane and the laser beam can be adapted in terms of its intensity distribution by way of at least one beam shaper. Provision is made in this context that in order to avoid uniformity defects in the processing/imaging plane, the laser beam is split by way of at least one beam splitter into at least two partial or individual beams, and the partial or individual beams are differently influenced, or each partial or individual beam is constituted from a laser source having a different wavelength, in such a way that after they are combined and focused onto the processing/imaging plane they form an output beam having an intensity profile, adjacent intensity maxima of the intensity profile differing in terms of their light properties. It is thereby possible to prevent the occurrence of obtrusive interference so that obtrusive speckle patterns are largely eliminated, with the result that beam shaping quality, in particular for laser processing processes, can be considerably improved.

A multi-beam soldering system includes a multi-beam scanner, a sensor, and a controller. The multi-beam scanner generates at least a first beam and a second beam, and guides the first beam to a first element of a soldering zone and guides the second beam to a second element of the soldering zone. The sensor detects a first temperature of the first element and a second temperature of the second element simultaneously during soldering process. The controller adjusts the parameters of the first beam and the second beam under the condition that the first temperature is substantially different from the second temperature.

A fiber selector includes: a plurality of first reflecting members corresponding to a plurality of focusing optical systems which focus a laser beam from a collimating optical system, and equipped with a reflecting surface capable of reflecting the laser beam towards the focusing optical system; a rotary motor that rotationally moves the first reflecting member between a first position at which the laser beam reflects and a second position which does not block the laser beam, in which the fiber selector rotationally moves the plurality of first reflecting members between the first position and second position so as to selectively switch the propagating direction of the laser beam to any of the plurality of focusing optical systems, in which the reflecting surface of the first reflecting member is a plane perpendicular to the rotation axis of the shaft to which this first reflecting member is fixed, and is arranged so as to face the direction of the rotary motor that causes the shaft to which this first reflecting member is fixed to rotate.

A method of laser processing a workpiece includes: focusing a pulsed laser beam into a laser beam focal line directed into the workpiece such that the laser beam focal line generates an induced absorption and produces a defect line along the laser beam focal line within the workpiece. The laser beam focal line has length L and a substantially uniform intensity profile such that the peak intensity distribution over at least 85% of the length L of the focal line does not vary by more 40%, and in some embodiments by no more than 30 or 20% from its mean peak intensity.