Patent classifications
B23K26/0676
OPTICAL APPARATUS FOR THE LASER WELDING OF A WORKPIECE, WITH A PLURALITY OF PARTIAL BEAMS HAVING A CORE ZONE AND A RING ZONE IN THE BEAM PROFILE
A laser welding optical apparatus includes: a laser beam source; a collimation optical unit collimating the provided laser beam; a beam splitter splitting the collimated laser beam into partial beams, the beam splitter having a first setting facility, which variably sets the splitting of the collimated laser; and a focusing optical unit focusing the partial beams onto the welding workpiece The laser beam source has a multiclad fiber having a core and ring fiber, and a second setting facility, which variably splits an input laser beam at an end of the multiclad fiber between the core and ring fiber. A second end of the multiclad fiber provides the laser beam for the collimation optical unit. The beam splitter splits the collimated laser beam among two leading and trailing partial beams. The first setting facility sets the energy distribution between the leading and the trailing partial beams.
LASER BEAM SHAPING DEVICE, LASER PROCESSING SYSTEM AND LASER INTERLOCKING WELDING STRUCTURE
A laser beam shaping device includes a multi-zone structure lens and a focusing lens. The multi-zone structure lens includes a lens body and a refractive structure. The lens body has an incident plane and an emission plane, and one of the incident plane and the emission plane is furnished with the refractive structure. The light source passing through the refractive structure deviates and leaves the lens body via the emission plane. The light source passing through the lens body is divided into N sets of light beams. After the N sets of light beams penetrate through the focusing lens, N set of incident beams are formed to project the interface of the first material and the second material in an oblique inward manner with respect to the optical axis of the focusing lens. In additional, a laser processing system and a laser interlocking welding structure respectively are also provided.
Optical device for laser treatment of the internal surfaces of a covering part
An optical device that is intended for laser treatment of internal surfaces of a covering part of the leading-edge type, including a collimator that is intended to be connected to a laser source via an optical fibre to produce a laser beam having a collimated and flat spatial pulse profile, a cylindrical lens that is configured to focus the laser beam along a spatial line that is transverse to the propagation of the laser beam thus forming a line-laser-beam, a reflecting optical component that is configured to be able to be introduced into the interior of the covering part and to uniformly reflect the line-laser-beam onto at least one internal surface of the covering part and in directions of incidence that are almost normal to at least one internal surface.
LASER BEAM IRRADIATING APPARATUS
A laser beam irradiating apparatus includes a laser oscillator configured to emit a laser beam, a first polarization beam splitter configured to separate the laser beam into a first laser beam of s-polarized light and a second laser beam of p-polarized light, a first spatial light modulator configured to modulate the first laser beam according to a phase pattern, and emit the resulting first laser beam, a second spatial light modulator configured to modulate the second laser beam according to a phase pattern, and emit the resulting second laser beam; a second polarization beam splitter configured to synthesize the first laser beam emitted from the first spatial light modulator and the second laser beam emitted from the second spatial light modulator, and an imaging unit configured to image the synthesized laser beam, and irradiate a target object with the resulting laser beam.
KOEHLER INTEGRATOR DEVICE AND APPLICATION THEREOF IN A MULTI-FOCAL CONFOCAL MICROSCOPE
A Koehler integrator device (10) comprises a collimating lens (11) being arranged for collimating a light field created by an incoherent or partially coherent light source, a pair of planar first and second micro-lens arrays (12, 13) being arranged for relaying portions of the collimated light field along separate imaging channels, wherein all micro-lenses of the first and second micro-lens arrays (12, 13) have an equal micro-lens focal length and pitch and the micro-lens arrays (12, 13) are arranged with a mutual distance equal to the micro-lens focal length, and a collecting Fourier lens (4) having a Fourier lens diameter and a Fourier lens focal length defining a Fourier lens front focal plane and a Fourier lens back focal plane, wherein the Fourier lens (14) is arranged for superimposing light from all imaging channels in the Fourier lens front focal plane and wherein the second micro-lens array (13) is arranged in the Fourier lens back focal plane, wherein a third micro-lens array (15) is arranged in the Fourier lens front focal plane for creating a wavelength independent array of illumination spots. Furthermore, a confocal microscope apparatus, which comprises the Koehler integrator device, and a method of using the confocal microscope apparatus are described.
Laser drilling of metal foils for assembly in an electrolytic capacitor
A capacitor and methods of processing an anode metal foil are presented. The capacitor includes a housing, one or more anodes disposed within the housing, one or more cathodes disposed within the housing, one or more separators disposed between an adjacent anode and cathode, and an electrolyte disposed around the one or more anodes, one or more cathodes, and one or more separators within the housing. The one or more anodes each include a metal foil that includes a first plurality of tunnels through a thickness of the metal foil in a first ordered arrangement, the first ordered arrangement being a close packed hexagonal array arrangement, and having a first diameter, and a second plurality of tunnels through the thickness of the metal foil having a second ordered arrangement and a second diameter greater than the first diameter.
Laser processing apparatus, semiconductor device manufacturing method, and amorphous silicon crystallization method
A laser processing apparatus includes: a laser light source that generates a laser beam; a first beam splitter on which the laser beam is incident; a second beam splitter on which the laser beam having passed through the first beam splitter is incident; and a homogenizer that controls an energy density of the laser beam emitted from the second beam splitter. The laser beam output from the homogenizer includes a p-polarized component and an s-polarized component, and a ratio of energy intensity of the p-polarized component to the s-polarized component is preferably not lower than 0.74 and not higher than 1.23 on a surface of the workpiece.
ADDITIVE MANUFACTURE IN METALS WITH A FIBER ARRAY LASER SOURCE AND ADAPTIVE MULTI-BEAM SHAPING
A system that uses a scalable array of individually controllable laser beams that are generated by a fiber array system to process materials into an object. The adaptive control of individual beams may include beam power, focal spot width, centroid position, scanning orientation, amplitude and frequency, piston phase and polarization states of individual beams. Laser beam arrays may be arranged in a two dimensional cluster and configured to provide a pre-defined spatiotemporal laser power density distribution, or may be arranged linearly and configured to provide oscillating focal spots along a wide processing line. These systems may also have a set of material sensors that gather information on a material and environment immediately before, during, and immediately after processing, or a set of thermal management modules that pre-heat and post-heat material to control thermal gradient, or both.
LASER PROCESSING METHOD
For processing a workpiece held by a chuck table with branched pulsed laser beams, if it is assumed that branch intervals at which adjacent ones of the branched pulsed laser beams are spaced from each other on a surface of the workpiece are represented by L, a value calculated by dividing a processing feed speed at which the chuck table is moved with respect to a condensing lens by a processing feed unit by the frequency of the pulsed laser beam at a processing point where the branched pulsed laser beams are applied to the workpiece is represented by S, and any integer is represented by n, then the branching intervals, the processing feed speed, and the frequency of the pulsed laser beam are established to satisfy the relationship of L≠n×S.
LASER ANNEALING APPARATUS AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Provided is a laser annealing apparatus causing laser light to be radiated to processing receiving areas arranged, out of a first direction and a second direction perpendicular to the first direction, along at least the second direction and move a batch radiation area and a workpiece in the first direction, and the laser annealing apparatus includes an energy density measuring apparatus measuring the energy density at, out of first and second ends of the batch radiation area in the second direction, at least the second end, an energy density adjusting apparatus adjusting the energy density at the first end, and a controller controlling the energy density adjusting apparatus. The energy density at the first end when (N+1)-th scanning is performed is so adjusted that the energy density at the first end in an (N+1)-th scan area approaches the energy density at the second end in the N-th scan area.