B23K26/0676

Laser Marking System and Method

A laser marking system including a spatial light modulator (SLM) with a multi-pixel, linear array of is microelectromechanical systems (MEMS) based diffractors, and methods of operating the same are disclosed. Generally, the system includes, in addition to the SLM, a laser operable to illuminate the SLM; imaging optics operable to focus a substantially linear swath of modulated light onto a surface of a workpiece, the linear swath including light from multiple pixels of the SLM, and a controller operable to control the SLM, laser and imaging optics to mark the surface of the workpiece to record a two-dimensional image thereon. In one embodiment, the diffractors include a number of electrostatically deflectable ribbons suspended over a substrate. In another, each diffractor is two-dimensional including an electrostatically deflectable first reflective operable to brought into optical interference with light reflected from a second reflective surface on a faceplate, or an adjacent diffractor.

SYSTEM, METHOD, AND APPARATUS FOR FUME EXTRACTION

A system, method, or apparatus for controlling the ignition of a volatile organic compound cloud. The system can include a laser source configured to emit one or more laser beams, one or more fume cells, and a conveyor carrying one or more confectionery products. The system is configured to etch the one or more confectionery products using the one or more laser beams. The etching creates a volatile organic compound cloud above the one or more confectionery products. The system is also configured to control one or more factors of the system, where the one or more factors include at least one of laser power, laser wavelength, geometry of laser beam, etch geometry, or fume extraction air flow. The system is further configured to ignite the volatile organic compound cloud based on the controlled one or more factors.

WELDING METHOD AND WELDING APPARATUS

A welding method includes: placing a workpiece including aluminum in a region to which laser light is emitted; and irradiating the laser light to the workpiece to melt an irradiated portion of the work piece to perform welding. Further, the laser light is formed of a main beam and plural auxiliary beams, and the plural auxiliary beams are positioned so as to surround a periphery of the main beam.

Apparatus and method for forming alignment marks

An apparatus and a method for forming alignment marks are disclosed. The method for forming alignment marks is a photolithography-free process and includes the following operations. A laser beam is provided. The laser beam is divided into a plurality of laser beams separated from each other. The plurality of laser beams is shaped into a plurality of patterned beams, so that the plurality of patterned beams is shaped with patterns corresponding to alignment marks. The plurality of patterned beams is projected onto a semiconductor wafer.

OPTICAL RELAY SYSTEM AND METHODS OF USE AND MANUFACTURE

Numerous embodiments of optical relay systems are disclosed. In one embodiment, a laser-processing apparatus includes an optical relay system configured to correct for beam placement errors by maintaining the optical path length of a beam of laser energy between a first positioner and a scan lens. In another embodiment, the optical relay system may include a first lens, a second lens, and a zoom lens assembly arranged between the first lens and the second lens, wherein the zoom lens assembly includes a first lens group and a second lens group. The zoom lens assembly may be movable relative to the first lens and the second lens (e.g., mounted on a positioner, such as a motion stage). The distance between the lenses of the first lens group and the distance between the lenses of the second lens group may be fixed or variable.

Laser processing method and method of manufacturing display apparatus

Provided are a laser processing method capable of performing various types of processing while reducing a need to change components and method of manufacturing a display apparatus by using the laser processing method. The laser processing method includes: splitting a laser beam emitted from a laser beam source into a plurality of laser beams by using a laser beam splitter; and transmitting at least two of the plurality of laser beams through a position adjustment equipment that is on paths of the at least two laser beams in order to adjust a distance between the at least two laser beams by using a difference between a refractive index of an element of the position adjustment equipment and a refractive index of a peripheral environment.

APPARATUS FOR FORMING LINE BEAM

The present disclosure relates to an apparatus for forming a line beam. The apparatus includes a laser source, a telescope unit, a beam-transforming unit, a Fourier unit, a long-axis optical unit, and a short-axis optical unit. The laser source is configured to generate input light. The telescope unit is configured to magnify the input light in an X-axis direction perpendicular to an optical axis, which is a progression direction of the input light. The beam-transforming unit is configured to divide light incident from the telescope unit into a plurality of sub-columns. The Fourier unit is configured to uniformly mix the plurality of sub-columns. The long-axis optical unit is configured to uniformly disperse light mixed by the Fourier unit in the X-axis direction. The short-axis optical unit is configured to focus light passing through the long-axis optical unit onto a reference plane, wherein the short-axis optical unit includes a concave reflective surface, and a curvature of the reflective surface is maintained constant in the X-axis direction.

METHOD AND APPARATUS FOR MANUFACTURING MICROFLUIDIC CHIP WITH FEMTOSECOND PLASMA GRATING
20210323814 · 2021-10-21 ·

The present disclosure discloses a method and apparatus for manufacturing a microfluidic chip with a femtosecond plasma grating. The method is characterized in that two or more beams of femtosecond pulse laser act on quartz glass together at a certain included angle and converge in the quartz glass, and when pulses achieve synchronization in time domain, the two optical pulses interfere; Benefited by constraint of an interference field, only one optical filament is formed in one interference period; and numbers of optical filaments are arranged equidistantly in space to form the plasma grating. The apparatus for manufacturing the microfluidic chip includes a plasma grating optical path, a microchannel processing platform, and a hydrofluoric acid ultrasonic cell.

Multi-beam laser spot welding of coated steels
11148226 · 2021-10-19 · ·

A method of laser spot welding a workpiece stack-up (10) that includes at least two overlapping steel workpieces (12, 14, 150) is disclosed. The method includes directing a plurality of laser beams (24, 24′, 24″) at the top surface (20) of the workpiece stack-up to create a molten steel weld pool (92) that penetrates into the stack-up. The molten steel weld pool is then grown to penetrate further into the stack-up by increasing an overall combined irradiance of the laser beams while reducing the total projected sectional area (88) of the laser beams at a plane of the top surface of the workpiece stack-up. Increasing the overall combined irradiance of the laser beams may be accomplished by moving the focal points (66, 66′, 66″) of the laser beams closer to the top surface or by reducing the mean angle of incidence (86) of the laser beams so as to reduce the eccentricity of the individual projected sectional areas of the laser beams.

Method of manufacturing deposition mask

A method of manufacturing a deposition mask including: arranging a deposition mask to be processed on a stage and forming a deposition hole in the deposition mask by irradiating the deposition mask with a laser beam. The laser beam forming the deposition hole is irradiated plural times in an identical moving path in a region where the deposition hole is formed, the laser beam includes a pulse laser, and pulse energy of the laser beam when the laser beam is irradiated once is different from pulse energy of the laser beam when the laser beam is irradiated twice.