A processing apparatus has: a light irradiation apparatus that irradiates a surface of an object with a processing light; and a partition member that surrounds a space including an optical path between the surface of the object and an optical member that is disposed at the most object side in an optical system of the light irradiation apparatus that allows the processing light to pass therethrough.

A processing apparatus has: a light irradiation apparatus that irradiates a surface of an object with a processing light; and a measurement apparatus that measures a position of an irradiation area, which is formed on the surface of the object by the light irradiation apparatus, relative to the object.

A coaxial laser metal deposition head includes a wire guide and a plurality of laser optical units. The wire guide defines a wire guide axis. The laser optical units are distributed around the wire guide axis. Each of the laser optical units is connected to a separate laser and each defines a beam axis. The optical units are fixed relative to the wire guide and in a first condition are positioned to allow each of the beam axes to intersect the wire guide axis at a common point.

A perforation system is disclosed that utilizes an optical beamlet generator and a scanner (e.g., at least two moveable mirrors). The optical beamlet generator may be a lenslet array or a diffractive optical element. The optical beamlet generator outputs a plurality of beamlets from a single input laser beam. These beamlets are moved in at least two dimensions relative to a surface of a substrate to form perforations in the substrate.

A laser processing apparatus includes a laser beam applying unit, an imaging unit, and a processing section. The processing unit includes a histogram generating section and a determining section. The histogram generating section generates, from an image obtained by the imaging unit imaging a plurality of processing marks formed by applying the laser beam from the laser beam applying unit to a one-surface side of the workpiece, a first histogram including a plurality of first positions along a first direction of the image and brightness at each of the first positions and a second histogram including a plurality of second positions along a second direction orthogonal to the first direction and brightness at each of the second positions. The determining section determines a boundary of each region where one of the processing marks is formed, based on the first histogram and the second histogram generated by the histogram generating section.

A method for laser-based machining of a flat substrate, to separate the substrate into a plurality of sections, in which the laser beam of a laser is directed at the substrate using an optical arrangement, which is positioned in the beam path of the laser. The optical arrangement forms a laser beam focal line that is extended as viewed along the beam direction and the substrate is positioned relative to the laser beam focal line such that an induced absorption is produced in the material of the substrate along a section of the laser beam focal line that is extended as viewed in the beam direction.

Embodiments are directed to systems for laser cutting at least one glass article comprising a pulsed laser assembly and a glass support assembly configured to support the glass article during laser cutting within the pulsed laser assembly, wherein the pulsed laser assembly comprises at least one non-diffracting beam (NDB) forming optical element configured to convert an input beam into a quasi-NDB beam; and at least one beam transforming element configured to convert the quasi-NDB beam into multiple quasi-NDB sub-beams spaced apart a distance of about 1 μm to about 500 μm; wherein the pulsed laser assembly is oriented to deliver one or more pulses of multiple quasi-NDB sub-beams onto a surface of the glass article, wherein each pulse of multiple quasi-NDB sub-beams is operable to cut a plurality of perforations in the glass article.

Provided are a laser cutting device and a laser cutting method. The laser cutting device comprises a beam expanding element provided with a plurality of lens wherein optical axes of the plurality of lens sets are located in the same line and each lens set comprises at least one lens; the beam expanding element converts an incident beam into a first beam; and a laser splitting element and the first beam are arranged in an emitting optical path of the beam expanding element, and the laser splitting element converts the first beam into a plurality of second beams spaced from one another. In the laser cutting device, by means of providing the laser splitting element, the first beam is converted into the plurality of second beams, so as to obtain the effect of beam adjustment.

A welding method includes: layering two or more plate materials each including a plating plate material having a preform on a surface of which a plating layer is formed to form a workpiece; disposing the workpiece in a region to be irradiated with a processing laser beam; generating the processing laser beam having a power distribution shape in which two or more power regions are disposed along a predetermined direction in a plane perpendicular to a light traveling direction; irradiating a surface of the workpiece with the processing laser beam; and moving the processing laser beam and the workpiece relatively while performing the irradiation, and melting an irradiated area of the workpiece to perform welding while sweeping the processing laser beam in the predetermined direction on the workpiece during a swing of the processing laser beam.

An apparatus and a method for forming alignment marks are disclosed. The method for forming alignment marks is a photolithography-free process and includes the following operations. A laser beam is provided. The laser beam is divided into a plurality of laser beams separated from each other. The plurality of laser beams is shaped into a plurality of patterned beams, so that the plurality of patterned beams is shaped with patterns corresponding to alignment marks. The plurality of patterned beams is projected onto a semiconductor wafer.