A method for laser welding is provided. The method includes arranging at least one heat source point from a first collection of heat source points so as to overlap at least a portion of at least one heat source point from a second collection of heat source points, irradiating a portion of a target with the first and second collections of heat source points, the heat source points maintaining a linear profile within their respective collection, and directing the at least two collections of heat source points in a travel direction along a weld line, each linear profile maintaining an oblique angle relative to the travel direction.

The invention relates to a device (1) for cutting human or animal tissue, such as a cornea (3), or a crystalline lens, said device comprising a femtosecond laser (2) that can emit a L.A.S.E.R. beam (4) in the form of impulses, and means for directing and focusing said beam onto or into the tissue for the cutting thereof as such. According to the invention, the device comprises means (9) for shaping the L.A.S.E.R. beam (4), which are positioned in the trajectory of said beam, and can modulate the energy distribution of the L.A.S.E.R. beam (4) in the focal plane thereof, corresponding to the cutting plane.

A processing system for forming a cross-section of an object. The processing system comprises a focused ion beam system for forming the cross-section from a pre-prepared surface region of the object and a laser and a light optical system for forming the pre-prepared surface region by laser ablation of a processing region of the object with a first and a second laser beam. The light optical system is configured to direct the first and the second laser beams onto common impingement locations of a common scanning line in the processing region for scanning the first laser beam and for scanning the second laser beam. For each of the impingement locations, an angle between a first incidence direction along an axis of the first laser beam and a second incidence direction along an axis of the second laser beam is greater than 10 degrees, measured in a stationary coordinate system.

An optical module (1A) includes a polarization beam splitter (10A), polarization elements (20 and 40) having nonreciprocal optical activity and respectively arranged on an optical path of a first polarization component (L2) transmitted through a light splitting surface (11) in irradiation light (L1) and an optical path of a second polarization component (L4) reflected in the light splitting surface (11), a first reflective SLM (30) that modulates and reflects a first polarization component (L2) passing through the first polarization element (20), and a second reflective SLM (50) that modulates and reflects the second polarization component (L4) passing through the second polarization element (40). First modulation light (L3) passing through the polarization element (20) again and then reflected by the light splitting surface (11) and second modulation light (L5) passing through the polarization element (40) again and then transmitted through the light splitting surface (11) are combined with each other.

A method is described of radiatively cutting a wafer, the method comprising the steps of low power cutting of two trenches followed by high power cutting of a fissure. A single pulsed radiation beam is split into a first pulsed radiation beam for cutting at least one of the trenches and a second pulsed radiation beam for cutting the fissure. When cutting a fissure on the wafer in a cutting direction along a cutting street, the first and second radiation beams are directed simultaneously with the first radiation beam leading and the second radiation beam trailing. For cutting a fissure in the opposite cutting direction, a third pulsed radiation beam for trenching is split from said single pulsed radiation beam.

A laser welding system is provided including a laser source configured to produce at least one laser beam, beam modifying means configured to split the at least one laser beam, directing means, and controlling means configured to control the directing means. The controlling is configured to control the directing means to cause the split laser beam to form at least two heat source points on the target, the heat source points maintaining a linear profile, and move the at least two heat source points in a travel direction along the target, wherein the linear profile forms a predetermined, oblique angle relative to the travel direction.

The present disclosure provides examples of a laser-based material processing system for liquid-assisted, ultrashort pulse (USP) laser micromachining An example material processing application includes drilling thru-holes or blind holes in a nearly transparent glass workpiece (substrate) using parallel processing with an n×m array of focused laser beams. Methods and systems are disclosed herein which provide for formation of high aspect ratio holes with low taper in fine pitch arrangements.

A capacitor and methods of processing an anode metal foil are presented. The capacitor includes a housing, one or more anodes disposed within the housing, one or more cathodes disposed within the housing, one or more separators disposed between an adjacent anode and cathode, and an electrolyte disposed around the one or more anodes, one or more cathodes, and one or more separators within the housing. The one or more anodes each include a metal foil that includes a first plurality of tunnels through a thickness of the metal foil in a first ordered arrangement, the first ordered arrangement being a close packed hexagonal array arrangement, and having a first diameter, and a second plurality of tunnels through the thickness of the metal foil having a second ordered arrangement and a second diameter greater than the first diameter.

Numerous embodiments are disclosed. In one, a laser-processing apparatus includes a positioner arranged within a beam path along which a beam of laser energy is propagatable. A controller may be used to control an operation of the positioner to deflect the beam path within first and second primary angular ranges, and to deflect the beam path to a plurality of angles within each of the first and second primary angular ranges. In another, an integrated beam dump system includes a frame; and a pickoff mirror and beam dump coupled to the frame. In still another, a wavefront correction optic includes a mirror having a reflective surface having a shape characterized by a particular ratio of fringe Zernike terms Z4 and Z9. Many more embodiments are disclosed.

An apparatus includes a splitter configured to split a laser beam into a plurality of beamlets, a phase modulator array optically coupled to the splitter and operative to produce phase differences between the beamlets, phase modulation electronics operably coupled to the phase modulator and configured to control an operation of the phase modulator array, a multicore photonic crystal fiber amplifier, the multicore photonic crystal fiber amplifier configured to amplify the beamlets output by the phase modulator array, thereby producing an amplified laser beam at an output thereof, and a waveguide optically coupled between an output of the phase modulator array and an input of the multicore photonic crystal fiber amplifier.