A laser etching apparatus includes a chamber, a laser port, a laser emitter, a particle grabber, and a revolving window module. The chamber is configured to receive a substrate. The laser port is disposed below the chamber in a downward direction. The laser emitter is configured to emit a laser to the substrate disposed within the chamber through the laser port. The particle grabber is disposed within the chamber and includes a body disposed over the laser port. An opening is formed through the body. The opening is configured to pass the laser therethrough. The revolving window module includes a revolving window and a driving part configured to drive the revolving window. The revolving window is disposed between the particle grabber and the laser port.

Methods for manufacturing hot-stamped components are described. The method includes providing a hot-stamped component by hot forming die quenching, and selecting a first and a second portion of the hot-stamped component, wherein the first portion has a different width than the second portion. A laser system, wherein the laser system c includes one or more optical elements and a laser source for generating a laser beam. The laser system is moved along a length of the component. Finally, the laser beam is applied in a single pass onto the selected first and second portions using the laser system, wherein a laser beam spot size is adjusted during the application of the laser beam and is adapted to the widths of the first and second portions, and wherein a power of the laser beam is regulated based on the temperature measured in the hot-stamped component. The disclosure further relates to components obtained using such methods.

A laser processing system includes a laser beam source that produces a raw laser beam; a beam expansion system that receives the raw laser beam and produces an expanded laser beam; a homogenization system that receives the expanded laser beam and produces a laser beam that is homogenized and has a line-shaped beam cross section in the processing plane, wherein the homogenization system includes a first homogenization arrangement that homogenizes along the short axis and a second homogenization arrangement for homogenization along the long axis, each of the homogenization arrangements includes optical elements that split the laser beam into a multiplicity of partial beams and a condenser system that superposes the partial beams in a superposition plane, and the first homogenization arrangement includes a first condenser system with at least one first mirror and the second homogenization arrangement includes a second condenser system with at least one second mirror.

There is provided an additive manufacturing device including a control device of controlling a relative posture of a heat retaining light beam irradiation device to a melting light beam irradiation device, in a state where a heat retaining light irradiation range of a heat retaining light beam larger than a melting light irradiation range of a melting light beam is overlapped with the melting light irradiation range, and such that a size of the heat retaining light irradiation range is changeable with respect to a size of the melting light irradiation range.

A method for laser soldering includes selecting a copper-containing material as a filler material, supplying the filler material at a butt joint of two components, and melting the filler material in a main process zone by means of laser radiation in an advancement direction. The filler material in the main process zone is melted by means of laser radiation of a wavelength λH in the blue or green spectral range with 400 nm≤λH≤600 nm.

A laser etching apparatus includes a chamber, a laser port, a laser emitter, a particle grabber, and a revolving window module. The chamber is configured to receive a substrate. The laser port is disposed below the chamber in a downward direction. The laser emitter is configured to emit a laser to the substrate disposed within the chamber through the laser port. The particle grabber is disposed within the chamber and includes a body disposed over the laser port. An opening is formed through the body. The opening is configured to pass the laser therethrough. The revolving window module includes a revolving window and a driving part configured to drive the revolving window. The revolving window is disposed between the particle grabber and the laser port.

A method for fusion welding of one or more steel sheets (1, 2) made of press-hardened steel, preferably manganese-boron steel is disclosed. At least one of the steel sheets has a metallic coating (4) which contains aluminum, and the fusion welding is performed while filler material (11) is being fed into the molten bath (9). In order to improve the hardenability of the weld seam (14), irrespective of whether the steel sheets to be welded together are steel sheets of the same or different material grades and/or steel sheets of different sheet thicknesses, a single laser focal spot (16) with different energy distribution is generated on the molten bath by means of one or more optical elements such that the laser focal spot (16) has a smaller laser focal spot area (16.1) and a larger laser focal spot area (16.2).

A substrate processing system includes a laser processing apparatus including a holder and a radiation unit, the holder being configured to hold a substrate including a base substrate, an irregularity pattern formed on a main surface of the base substrate, and an irregularity layer formed along the irregularity pattern, the radiation unit being configured to radiate a laser beam to a protrusion of the irregularity layer to flatten the irregularity layer by removing the protrusion in a state that the substrate is held by the holder; a controller configured to control a position of an irradiation point of the laser beam; and a polishing apparatus configured to polish the irregularity layer in which the protrusion is removed with the laser beam to be flattened.

A laser irradiation apparatus (1) according to one embodiment includes a laser generating device (14) that generates a laser beam, a flotation unit (10) that causes a workpiece (16) that is to be irradiated with the laser beam to float, and a conveying unit (11) that conveys the floating workpiece (16). The conveying unit (11) conveys the workpiece (16) with the conveying unit (11) holding the workpiece (16) at a position where the conveying unit (11) does not overlap an irradiation position (15) of the laser beam. The laser irradiation apparatus (1) according to one embodiment makes it possible to suppress uneven irradiation with a laser beam.

A method for joining copper hairpins includes providing at least two ends to be joined to one another of the copper hairpins, and joining the copper hairpins. The copper hairpins are joined by laser beam welding with a machining beam having a wavelength of less than 1000 nm.