Disclosed is a laser keyhole welding structure and a keyhole welding method of an aluminum material which stably suppress the generation of sputtering to ensure a reliable electrical connection and obtain a mechanically strong connection. To achieve this, a laser keyhole welding structure of an aluminum material is formed by welding an aluminum material element constituting an electronic component by irradiating a laser beam to the electronic component, in which a tapered portion spread angle (θ) of an upper portion of a welding nugget to be formed is 45° or less. Also disclosed is a laser keyhole welding structure of an aluminum material.

A laser processing apparatus includes: a stage 2 capable of levitating and transporting a substrate 3 by jetting gas from a front surface; a laser oscillator configured to irradiate a laser beam 20a onto the substrate 3; and a gas jetting port arranged at a position overlapping a focus point position of the laser beam 20a in plan view, and being configured to jet inert gas. The front surface of the stage 2 is constituted by upper structures 5a and 5b, and the upper structures 5a and 5b are arranged so as to be spaced apart from each other and face each other. A gap between the upper structures 5a and 5b overlaps the focus point position of the laser beam 20a in plan view. A filling member 8 is arranged between the upper structures 5a and 5b so as to fill the gap between the upper structures 5a and 5b.

An optical component includes a block of a transparent material, having a trapezoidal cross-section defined by first and second parallel, rectangular faces on mutually-opposing sides of the block and third and fourth faces oriented diagonally at opposing ends of the first and second faces. One or more planar, partially-reflecting layers extend within the block between the third and fourth faces in an orientation parallel to the first and second faces.

A line beam irradiation apparatus (1000) includes a work stage (200), a line beam source (100) for irradiating a work (300) placed on the work stage (200) with a line beam; and a transporting device (250) for moving at least one of the work stage (200) and the line beam source (100) such that an irradiation position of the line beam on the work moves in a direction transverse to the line beam. The line beam source includes a plurality of semiconductor laser devices and a support for supporting the plurality of semiconductor laser devices. The plurality of semiconductor laser devices are arranged along a same line extending in a fast axis direction, and the laser light emitted from emission regions of respective ones of the semiconductor laser devices diverge parallel to the same line to form the line beam.

A substrate processing system includes a processing chamber, a substrate support, a heat source, a gas delivery system and a controller. The substrate support is disposed in the processing chamber and supports a substrate. The heat source heats the substrate. The gas delivery system supplies a process gas to the processing chamber. The controller controls the gas delivery system and the heat source to iteratively perform an isotropic atomic layer etch process including: during an iteration of the isotropic atomic layer etch process, performing pretreatment, atomistic adsorption, and pulsed thermal annealing; during the atomistic adsorption, exposing a surface of the substrate to the process gas including a halogen species that is selectively adsorbed onto an exposed material of the substrate to form a modified material; and during the pulsed thermal annealing, pulsing the heat source multiple times within a predetermined period to expose and remove the modified material.

An apparatus includes a beam source, beam forming optics, a first focusing lens having a focal length, a second focusing lens having a focal length similar to the focal length of the first lens, and a lens translator configured to move the second lens transversely relative to the beam forming optics and to the first lens, and thereby move the elongated focus transversely. In some embodiments, the beam forming optics are positioned between the beam source and the first focusing lens, the first focusing lens is positioned between the beam forming optics and the second focusing lens, and the beam forming optics, the first focusing lens, and the second focusing lens are arranged to receive a beam of laser radiation from the beam source and to form the beam into an elongated focus.

A laser etching apparatus includes a light source to emit a first laser beam having a first energy profile; and a scanner to radiate a second laser beam upon an object along a circular path, the second laser beam having a second energy profile different from the first energy profile.

A process for producing an aluminum member, including irradiating a surface of an aluminum raw material member including, as a component, aluminum or aluminum alloy and unavoidable impurities with a top-hat laser beam at an intensity of from 110 MW/cm2 to 320 MW/cm2. The aluminum member includes, in sequence, a base layer containing, as a component, aluminum or aluminum alloy and having unavoidable impurities; an oxide layer containing an aluminum oxide; and a porous layer containing a porous aggregate of aluminum metal particles.

A system for and a method of processing a transparent material, such as glass, using an adjustable laser beam line focus are disclosed. The system for processing a transparent material includes a laser source operable to emit a pulsed laser beam, and an optical assembly (6′) disposed within an optical path of the pulsed laser beam. The optical assembly (6′) is configured to transform the pulsed laser beam into a laser beam focal line having an adjustable length and an adjustable diameter. At least a portion of the laser beam focal line is operable to be positioned within a bulk of the transparent material such that the laser beam focal line produces a material modification along the laser beam focal line. Method of laser processing a transparent material by adjusting at least one of the length of the laser beam focal line and the diameter of the laser beam focal line is also disclosed.

A method of creating a cladded tool with a distributor including a feed mechanism and an energy source. The method includes providing a substrate and distributing particulate material from the feed mechanism onto the substrate. The particulate material includes agglomerated particles with diameters between 30 and 100 microns. The method also includes activating the energy source to produce a beam spot on the particulate material, the substrate, or both and at least partially melting the particulate material, the substrate, or both with the beam spot to form a bonded layer of particulate material on the substrate.