In various embodiments, a workpiece is processed utilizing primary and secondary laser beams having different wavelengths and which are coupled into specialized optical fibers. The primary and secondary beams may be utilized during different stages of workpiece processing.

This shaping apparatus is equipped with: a movement system which moves a target surface; a measurement system for acquiring position information of the target surface in a state movable by the movement system, a beam shaping system that has a beam irradiation section and a material processing section which supplies a shaping material irradiated by a beam from beam irradiation section; and a controller. On the basis of 3D data of a three-dimensional shaped object to be formed on a target surface and position information of the target surface acquired using the measurement system, the controller controls the movement system and the beam shaping system such that a target portion on the target surface is shaped by supplying the shaping material while moving the target surface and the beam from beam irradiation section relative to each other.

In various embodiments, workpieces are processed, e.g., via welding or cutting, while the shape and/or one or more other parameters of the laser processing beam are altered. The shape and/or one or more other parameters of the laser processing beam may be varied based on one or more characteristics of the workpiece.

In various embodiments, laser emissions are steered into different regions of an optical fiber, and/or into different optical fibers, in a temporal pattern such that an output has different spatial output profiles. The temporal pattern has a frequency sufficient such that a workpiece is processed by an effective output shape combining the different spatial output profiles.

A thin layer etching apparatus includes an etchant supply unit configured to supply an etchant onto a substrate to etch a thin layer formed on the substrate, a temperature measuring unit configured to measure a temperature of the substrate while an etching process is performed by the etchant, a laser irradiating unit configured to irradiate a first laser beam on a first portion including a central portion of the substrate and to irradiate a second laser beam in a ring shape on a second portion surrounding the first portion so that the temperature of the substrate is maintained at a predetermined temperature during the etching process, and a process control unit configured to control power of the first and second laser beams based on the temperature of the substrate measured by the temperature measuring unit to reduce a temperature difference between the first and second portions of the substrate.

An annular hollow offset-focus laser cladding device, including a housing, a conical reflector arranged in the housing, an annular off-axis parabolic focusing mirror opposite to and arranged coaxially with the conical reflector, a nozzle installed below the conical reflector and a powder-spraying tube connected to a lower end of the nozzle. A top of the housing is provided with a light entrance; the conical reflector faces the light entrance; The powder-spraying tube is coaxial with the annular hollow offset-focusing light reflected by the annular off-axis parabolic focusing mirror; a collimating protective gas jacket is arranged on a periphery of the powder-spraying tube, and the collimating protective gas jacket is located between the annular hollow offset-focused light and the powder-spraying tube; the annular off-axis parabolic focusing mirror is configured to create a horizontally offset of parent parabola focus.

The invention relates to methods for laser welding a first and a second workpiece portion with a laser beam that is guided using a laser machining head along a joining gap formed between the workpiece portions, in which method the laser beam is focused and a filler is lined up with the joining gap. At least one gap width of the joining gap of the workpiece portions to be welded is detected and evaluated along the course of the joining gap and compared with at least a first and a second gap measurement. If a detected gap width is within the first gap measurement, the feeding of the filler to the joining gap is stopped and a beam profile of the laser beam is set with a point or annular focus, and if a detected gap width is within the second gap measurement, a feeding of the filler is actuated.

Adopted is a laser beam irradiation optical unit for forming a spot on an object to be machined and irradiating the object to be machined with a laser beam emitted from a laser oscillator to perform laser machining including an energy intensity distribution adjustment mechanism that adjusts an energy intensity distribution of the laser beam at the spot in an irradiation trajectory of the laser beam from the laser oscillator to the object to be machined, in which the energy intensity distribution adjustment mechanism adjusts the energy intensity distribution of the laser beam at the spot so as to be non-uniform.

A system for and a method of processing a transparent material, such as glass, using an adjustable laser beam line focus are disclosed. The system for processing a transparent material includes a laser source operable to emit a pulsed laser beam, and an optical assembly (6′) disposed within an optical path of the pulsed laser beam. The optical assembly (6′) is configured to transform the pulsed laser beam into a laser beam focal line having an adjustable length and an adjustable diameter. At least a portion of the laser beam focal line is operable to be positioned within a bulk of the transparent material such that the laser beam focal line produces a material modification along the laser beam focal line. Method of laser processing a transparent material by adjusting at least one of the length of the laser beam focal line and the diameter of the laser beam focal line is also disclosed.

The present disclosure relates to a laser based system for laser peening a workpiece. The system has a pulse laser configured to generate laser pulses and a controller for controlling operation of the pulse laser. The controller is further configured to control the pulse laser to cause the pulse laser to generate at least one of the laser pulses with a spatio-temporally varying laser fluence over a duration of the at least one of the laser pulses.