Device for generating a linear intensity distribution in a working plane (20), comprising at least one laser light source (11), optics (14) which shape the light (12) emitted by the at least one laser light source (11) in a first direction (X) and/or in a second direction (Y), a beam transformation device (13) increasing the beam quality factor (M.sub.x.sup.2) with respect to the first direction (X) and decreasing the beam quality factor (M.sub.y.sup.2) with respect to the second direction (Y), as well as an objective (17) acting in the second direction (Y) and a focusing device (18) acting in the second direction (Y), which is arranged behind the objective (17), wherein the objective (17) and the focusing device (18) image into the working plane (20) a plane (19) behind the beam transformation device (13) in which the light (12) in the second direction (Y) has an intensity distribution with a super-Gaussian profile or with a profile similar to a super-Gaussian profile.

A laser crystallizing apparatus may include a laser light source, an optical system, and an optical module. The laser light source may generate a laser beam. The optical system may convert the laser beam into a line laser beam. The optical module may disperse energy of the line laser beam in a first direction for generating a dispersed line laser beam. The first direction may be perpendicular to a lengthwise direction of the optical module.

A method for processing a transparent workpiece includes forming a first contour line, comprising a first plurality of defects, in the transparent workpiece; forming a second contour line, comprising a second plurality of defects, in the transparent workpiece, wherein the second contour line defines a second contour intersecting the first contour line at an intersection point, wherein the laser pulse energy of the second pulsed laser beam is increased from a first laser pulse energy to a second laser pulse energy at a first distance from the intersection point; and wherein the laser pulse energy of the second pulsed laser beam is decreasing from the second laser pulse energy to the first laser pulse energy at a second distance from the intersection point.

A method of laser processing a coated substrate having a coating later disposed on a transparent workpiece that includes determining an optical characteristic of the coating layer and selecting a beam path for a pulsed laser beam based on the optical characteristic. The beam path is selected a polarization-adjusting beam path and a frequency-adjusting beam path. The method also includes directing the pulsed laser beam down the selected beam path to form a modified pulsed laser beam and directing the modified pulsed laser beam into the transparent workpiece, where the modified pulsed laser beam forms a laser beam focal line that induces absorption in the transparent workpiece to produce a defect in the transparent workpiece. The laser beam focal line includes a wavelength λ, a spot size w.sub.o, and a Rayleigh range Z.sub.R that is greater than

[00001]$F_D\frac{\pi w_o^2}{\lambda },$

where F.sub.D is a dimensionless divergence factor.

A laser processing system includes a laser beam source that produces a raw laser beam; a beam expansion system that receives the raw laser beam and produces an expanded laser beam; a homogenization system that receives the expanded laser beam and produces a laser beam that is homogenized and has a line-shaped beam cross section in the processing plane, wherein the homogenization system includes a first homogenization arrangement that homogenizes along the short axis and a second homogenization arrangement for homogenization along the long axis, each of the homogenization arrangements includes optical elements that split the laser beam into a multiplicity of partial beams and a condenser system that superposes the partial beams in a superposition plane, and the first homogenization arrangement includes a first condenser system with at least one first mirror and the second homogenization arrangement includes a second condenser system with at least one second mirror.

A substrate comprising: (i) a first series of blind vias into a thickness of a substrate and open to a first primary surface; and (ii) a second series of blind vias into the thickness of a substrate and open to a second primary surface. Each blind via includes an interior wall. The interior wall includes a first tapered region and a second tapered region. The first tapered region and the second tapered region have a distinct slope. Each of the blind vias of the second series of blind vias is coaxial with a different blind via of the first series of blind vias. Each blind via of the first series of blind vias has a depth that deviates from a mean depth by less than +/−10%. Each blind via of the second series of blind vias has a depth that deviates from a mean depth by less than +/−10%.

The present disclosure relates to an apparatus for forming a line beam. The apparatus includes a laser source, a telescope unit, a beam-transforming unit, a Fourier unit, a long-axis optical unit, and a short-axis optical unit. The laser source is configured to generate input light. The telescope unit is configured to magnify the input light in an X-axis direction perpendicular to an optical axis, which is a progression direction of the input light. The beam-transforming unit is configured to divide light incident from the telescope unit into a plurality of sub-columns. The Fourier unit is configured to uniformly mix the plurality of sub-columns. The long-axis optical unit is configured to uniformly disperse light mixed by the Fourier unit in the X-axis direction. The short-axis optical unit is configured to focus light passing through the long-axis optical unit onto a reference plane, wherein the short-axis optical unit includes a concave reflective surface, and a curvature of the reflective surface is maintained constant in the X-axis direction.

The illumination optical system includes a beam shaper which converts an intensity distribution of a laser beam in each of a short axis direction and a long axis direction, which is a Gaussian distribution, into an intensity distribution of a parallel beam on a modulation surface of the optical modulator in each of the short axis direction and the long axis direction, which is a top hat distribution. The modulation surface and an irradiated surface are optically conjugated with respect to the long axis direction by a third lens and a fourth lens. Further, the modulation surface and a front focus position of the fourth lens are optically conjugated with respect to the short axis direction by a first lens, a second lens, and the third lens. The fourth lens condenses a beam having a top hat distribution at the front focus position onto the irradiated surface.

A method for providing a first and a second laser beam, which are spatially offset in relation to an input laser beam. The method includes: providing a laser source for generating the input laser beam; providing a spatial offsetting unit for providing an offset laser beam that can keep the same polarization between the input laser beam and the offset laser beam; providing a separating unit including a first module for separation by polarization in order to obtain, from the offset laser beam: the first laser beam spatially offset by transmission; and the second laser beam spatially offset by reflection, the first and second spatially offset laser beams being suitable for each describing a circle.

Silica-containing substrates including vias with a narrow waist, electronic devices incorporating a silica-containing substrate, and methods of forming vias with narrow waist in silica-containing substrates are disclosed. In one embodiment, an article includes a silica-containing substrate including greater than or equal to 85 mol % silica, a first surface, a second surface opposite the first surface, and a via extending through the silica-containing substrate from the first surface toward the second surface. The via includes a first diameter at the first surface wherein the first diameter is less than or equal to 100 μm, a second diameter at the second surface wherein the first diameter is less than or equal to 100 μm, and a via waist between the first surface and the second surface. The via waist has a waist diameter that is less than the first diameter and the second diameter such that a ratio between the waist diameter and each of the first diameter and the second diameter is less than or equal to 75%.