Patent classifications
B23K26/0861
Additive Manufacturing Method
An additive manufacturing method wherein an object is manufactured by powder being applied layer-by-layer by an application device onto a base along a buildup surface and being bonded in regions to form a matrix. To provide an efficient additive powder bed method, a position of the base is checked by at least one measurement with a sensor device and the position of the base is automatically corrected at least in relation to the application device based on the at least one measurement.
USE OF WAFER BRIGHTNESS TO MONITOR LASER ANNEAL PROCESS AND LASER ANNEAL TOOL
A method is provided for monitoring the laser annealing of a semiconductor wafer. After annealing, images of many regions of the wafer are captured. The surface brightness of these regions is measured by computer, and statistics of these surface brightness measurements are determined, such as their mean and their standard deviation. Using a correlation between the surface brightnesses and the electrical resistance of the annealed wafer, the surface brightness statistics can be used to determine whether the annealing process resulted in a wafer that meets end user specifications. The surface brightness statistics can also be used to monitor the annealing tool, both during manufacturing and periodically or following maintenance.
LASER PROCESSING SYSTEM AND LASER PROCESSING METHOD
A laser processing system includes a wavelength tunable laser apparatus capable of changing the wavelength of pulsed laser light to be outputted, an optical system irradiating a workpiece with the pulsed laser light, a reference wavelength acquisition section acquiring a reference wavelength corresponding to photon absorption according to the material of the workpiece, a laser processing controller controlling the wavelength tunable laser apparatus to perform preprocessing before final processing performed on the workpiece, changes the wavelength of the pulsed laser light over a predetermined range containing the reference wavelength, and performs wavelength search preprocessing at a plurality of wavelengths, a processed state measurer measuring a processed state on a wavelength basis achieved by the wavelength search preprocessing performed at the plurality of wavelengths, and an optimum wavelength determination section assessing the processed state on a wavelength basis to determine an optimum wavelength used in the final processing.
Substrate Manufacturing Method
A substrate manufacturing method capable of easily obtaining a thin magnesium oxide single crystal substrate is provided. A first step is performed which disposes a condenser for condensing a laser beam on an irradiated surface of a magnesium oxide single crystal member in a non-contact manner. A second step is performed which forms processing mark lines in parallel by irradiating the laser beam to the surface of the single crystal substrate under designated irradiation conditions to condense the laser beam into an inner portion of the single crystal substrate while moving the condenser and the single crystal substrate relative to each other in a two-dimensional manner. A third step is performed which forms new processing mark lines between the adjacent irradiation lines in the second step to allow planar separation, by irradiating the laser beam to the surface of the single crystal substrate under designated irradiation conditions to condense the laser beam into an inner portion of the single crystal substrate while moving the condenser and the single crystal substrate 20 relative to each other in a two-dimensional manner.
Methods for laser ablation analysis
Methods for laser induced ablation spectroscopy are disclosed. A sample site position sensor, and stage position motors can move the stage in three independent spatial coordinate directions, and a stage position control circuit is used to move an analysis sample site to selected coordinate positions for laser ablation. Light emitted from a plasma plume produced with laser ablation can be gathered into a lightguide fiber bundle that is subdivided into branches. One branch can convey a first portion of the light to a broadband spectrometer operable to analyze a relatively wide spectral segment, and a different branch can convey a second portion of the light to a high dispersion spectrometer operable to measure minor concentrations and/or trace elements. Emissions from a plasma plume can be simultaneously analyzed in various ways using a plurality of spectrometers having distinct and/or complementary capabilities.
Manufacturing machine
A manufacturing machine is capable of subtractive manufacturing and additive manufacturing for a workpiece. The manufacturing machine includes: a first headstock and a second headstock disposed in a first processing area and configured to hold a workpiece; a lower tool rest and a tool spindle disposed in the first processing area and configured to hold a tool to be used for subtractive manufacturing for the workpiece; an additive manufacturing head disposed in a second processing area; and a robot arm configured to hold a workpiece and transport the workpiece between the first processing area and the second processing area. The additive manufacturing head is configured to discharge a material toward the workpiece held by the robot arm during additive manufacturing for the workpiece. Accordingly, the manufacturing machine configured simply to be capable of subtractive manufacturing and additive manufacturing is provided.
LASER CUTTING
Laser cutting systems and methods are described herein. One or more systems include a laser generating component, an optical component, a fixture for holding a support with a part positioned on the support, and a control mechanism for adjusting at least one of the laser generating component, the optical component, and the fixture such that a ratio of a laser energy applied to the part and a part material thickness is maintained within a predetermined acceptable range at each point along a cut path to cut through the part while maintaining the integrity of the support. Other systems and methods are disclosed herein.
LASER SLICING APPARATUS AND LASER SLICING METHOD
A laser slicing apparatus for dividing a workpiece with a laser beam, including: a light shielding area detection section that detects light shielding areas existing on a side of a first surface of the workpiece; and a control section that radiates a first laser beam from the side of the first surface so as to scan across a whole area of the first surface of the workpiece and form a first modified layer in a to-be-sliced plane inside the workpiece, and that radiates a second laser beam to the light shielding areas of the workpiece from a second surface on an opposite side of the first surface and form a second modified layer in such a manner that the second modified layer is continuous with the first modified layer in the to-be-sliced plane.
Apparatus and method for direct writing of single crystal super alloys and metals
A method and apparatus for direct writing of single crystal super alloys and metals. The method including heating a substrate to a predetermined temperature below its melting point; using a laser to form a melt pool on a surface of the substrate, wherein the substrate is positioned on a base plate, and wherein the laser and the base plate are movable relative to each other, the laser being used for direct metal deposition; introducing a superalloy powder to the melt pool; and controlling the temperature of the melt pool to maintain a predetermined thermal gradient on a solid and liquid interface of the melt pool so as to form a single crystal deposit on the substrate. The apparatus configured to generally achieve the aforementioned method.
LASER IRRADIATION APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
A laser irradiation apparatus (1) according to an embodiment includes an optical-system module (20) configured to apply laser light (L1) to an object to be irradiated, a shield plate (51) in which a slit (54) is formed, through which the laser light (L1) passes, and a reflected-light receiving component (61) disposed between the optical-system module (20) and the shield plate (51), in which the reflected-light receiving component (61) is able to receive, out of the laser light (L1), reflected light (R1) reflected by the shield plate (51).