Laser cutting systems and methods are described herein. One or more systems include a laser generating component, an optical component, a fixture for holding a support with a part positioned on the support, and a control mechanism for adjusting at least one of the laser generating component, the optical component, and the fixture such that a ratio of a laser energy applied to the part and a part material thickness is maintained within a predetermined acceptable range at each point along a cut path to cut through the part while maintaining the integrity of the support. Other systems and methods are disclosed herein.

A laser ablation system, and method, facilitates the execution of user-defined scans (i.e., in which a laser beam is scanned across a sample along a beam trajectory to ablate or dissociate a portion of the sample) and enables the user define additional scans while a scan is being executed.

A controller performs gap control such that a Z-axis position of a tip of a cutting head of the machine is not below a preset lower limit position while keeping the distance between the tip of the cutting head and a workpiece constant. The numerical controller calculates a substantial lower limit position based on a detected state of the workpiece and the preset lower limit position. If the Z-axis position of the tip of the cutting head is below the calculated substantial lower limit position, it is compensated so as not to be below the substantial lower limit position.

The present disclosure generally relates to methods and apparatuses for additive manufacturing using foil-based build materials. Such methods and apparatuses eliminate several drawbacks of conventional powder-based methods, including powder handling, recoater jams, and health risks. In addition, the present disclosure provides methods and apparatuses for compensation of in-process warping of build plates and foil-based build materials, in-process monitoring, and closed loop control.

A laser shock peening method and device for a bottom surface of a tenon groove of an aircraft blade. During the laser shock peening process, according to geometric characteristics of the bottom surface of a tenon groove, a circular facula of a laser beam is changed into a strip-shaped facula, at the same time as a flow-guiding injection device and a water pumping device are respectively arranged at two end surfaces of the bottom surface of the tenon groove to ensure the stability of a water confinement layer.

A laser processing method includes irradiating a laser light into a substrate along a cutting line to form a laser-scribed layer within the substrate, irradiating an X-ray onto a first surface of the substrate along the cutting line, obtaining an image of a diffracted X-ray from the substrate, and determining whether or not the laser-scribed layer is formed along the cutting line, based on analysis of the obtained image of the diffracted X-ray.

Disclosed are methods of determining a reference focus position of a beam of a beam-based machine tool. The methods providing a relative motion trajectory defining a discoid area with respect to a surrounding area, the discoid area being connected to the surrounding area via at least one bridge area, and performing a sequence of test cuts on a workpiece, wherein at each test cut, a cutting structure is cut in the workpiece by guiding the beam along the relative motion trajectory and the cutting is performed along the at least one bridge area of the relative motion trajectory at differently set focus positions.

An apparatus for fabricating a part, comprising a curved shaft; a build plate connected to the curved shaft; a motor; and a transmission connecting the motor and the curved shaft. The build plate moves along a curved path having a radius of curvature originating on an axis when the transmission transfers power from the motor to the curved shaft. Material deposited on the build plate along the curved path forms the part comprising a solid of revolution around the axis. In one or more examples, the part is an aircraft engine inlet.

A method for metallization includes providing a transparent donor substrate (34) having deposited thereon a donor film (36) including a metal with a thickness less than 2 ?m. The donor substrate is positioned in proximity to an acceptor substrate (22) including a semiconductor material with the donor film facing toward the acceptor substrate and with a gap of at least 0.1 mm between the donor film and the acceptor substrate. A train of laser pulses, having a pulse duration less than 2 ns, is directed to impinge on the donor substrate so as to cause droplets (44) of the metal to be ejected from the donor layer and land on the acceptor substrate, thereby forming a circuit trace (25) in ohmic contact with the semiconductor material.

A laser processing system includes a laser processing apparatus having a laser oscillator, a processing apparatus main body, and a laser nozzle that is provided in the processing apparatus main body, a robot for transferring a workpiece to a machining position of the laser nozzle to perform predetermined machining for the workpiece, an output measurement instrument that is located at a standby position provided in the processing apparatus main body and that is capable of measuring output of the laser beam from the laser nozzle, and a robot controller for controlling operation of the robot, wherein the robot controller controls the robot to support the output measurement instrument located at the standby position and to move the output measurement instrument to an irradiation position of the laser beam of the laser nozzle for measurement of the output.