A laser irradiation apparatus may include: an irradiation head section including first and second irradiation heads each configured to perform laser light irradiation on a workpiece; a laser unit section including first and second laser units configured to respectively output first laser light and second laser light; a beam delivery section provided in an optical path between the laser unit section and the irradiation head section, and configured to perform switching of optical paths between optical paths of the first laser light and the second laser light to cause the first or second laser light to enter the first or second irradiation head; a first beam property varying section provided in an optical path between the first laser unit and the irradiation head section; and a second beam property varying section provided in an optical path between the second laser unit and the irradiation head section.

Method and devices using lasers to reduce reflection of transparent solids in the optical spectrum, coatings and devices employing transparent solids are disclosed. The lasers are used to shape surfaces of the transparent solid materials by raising the temperature of the material to around the melting temperature, and thereby generate desired target nanostructure two-dimensional antireflection flection pattern arrays on the surfaces. The laser fluence value, wavelength, repetition rate, pulse duration and number of consecutive laser pulses per focus spot are selected, and a desired focus spot distribution on the surface of the transparent solid material is identified. The transparent solid material is relatively translated to generate the desired nanostructure two-dimensional pattern array.

A laser machining apparatus comprises a workbench for positioning an object to be machined by laser; a laser emitter configured to emit a laser beam transversely to the workbench; a movement mechanism configured to three-dimensionally move the workbench or the laser emitter reciprocally to each other; a control unit connected to the movement mechanism and/or the laser emitter and configured to generate and send an enabling signal according to operator manipulations on a manipulation element connected to the same control unit. In particular, the control unit comprises a box-like body having a supporting base, a cover panel and elastic return means interposed between the supporting base and the cover panel which are movable reciprocally towards and away from each other between an active condition and an inactive condition.

A laser slicing apparatus for dividing a workpiece with a laser beam, including: a light shielding area detection section that detects light shielding areas existing on a side of a first surface of the workpiece; and a control section that radiates a first laser beam from the side of the first surface so as to scan across a whole area of the first surface of the workpiece and form a first modified layer in a to-be-sliced plane inside the workpiece, and that radiates a second laser beam to the light shielding areas of the workpiece from a second surface on an opposite side of the first surface and form a second modified layer in such a manner that the second modified layer is continuous with the first modified layer in the to-be-sliced plane.

A method and apparatus for substrate dicing are described. The method includes utilizing a laser to dice a substrate along a dicing path to form a perforated line around each device within the substrate. The dicing path is created by exposing the substrate to bursts of laser pulses at different locations around each device. The laser pulses are delivered to the substrate and may have a pulse repetition frequency of greater than about 25 MHz, a pulse width of less than about 15 picoseconds, and a laser wavelength of about 1.0 ?m to about 5 ?m.

A laser irradiation apparatus may include: an irradiation head section including first and second irradiation heads each configured to perform laser light irradiation on a workpiece; a laser unit section including first and second laser units configured to respectively output first laser light and second laser light; a beam delivery section provided in an optical path between the laser unit section and the irradiation head section, and configured to perform switching of optical paths between optical paths of the first laser light and the second laser light to cause the first or second laser light to enter the first or second irradiation head; a first beam property varying section provided in an optical path between the first laser unit and the irradiation head section; and a second beam property varying section provided in an optical path between the second laser unit and the irradiation head section.

The invention relates to a method for the additive manufacture of three-dimensional metallic components (12), said components (12) being built layer-by-layer or section-by-section under vacuum conditions by fusing a metallic material with the component (12) at a machining point by means of a radiation source with a high energy density. In order to keep the energy applied to the machining point by the radiation itself relatively low, the metallic material is supplied in the form of a wire (28) which is preheated under vacuum conditions before reaching the machining point.

A combined machining apparatus and a laser spectroscopic device thereof are provided. The machining vehicle has a machining platform, a machining device and a laser spectroscopic device. The time of a workpiece machined by the composite machine can be effectively reduced by producing a plurality of laser beams to the workpiece from the laser spectroscopic device, and by selectively assembling a tool head or a feeding head onto the machining device.

A pressing system for a laser joining system for pressing together parts to be joined (storage cell, base plate) in the area of a joining point, includes a receptacle for accommodating the parts to be joined, a pressing element for locally pressing together the parts to be joined, in the area of the joining point, and a positioning system for the relative positioning of the pressing element and the receptacle and for pressing together the parts to be joined, during the joining process. The positioning system includes a parallel positioning device for the relative positioning of the receptacle and the pressing element in parallel to a plane (E), and an oblique positioning device for the relative positioning of the pressing element and the receptacle obliquely, in particular transversely, with respect to the plane (E) and for pressing together the parts to be joined, during the joining process.

An apparatus for manufacturing an object includes a first assembly including a laser for laser-based additive manufacturing of a powder material for forming the object, and a second assembly coacting with the first assembly for cooling at least a portion of said object during said additive manufacturing. An apparatus for manufacturing an object may also include a first assembly including a laser for laser-based ablation of a material structure for forming the object, and a second assembly coacting with the first assembly for cooling at least a portion of said material structure during said ablation manufacturing. Related methods are also provided.