B23K26/1476

LASER PROCESSING HEAD AND LASER PROCESSING MACHINE
20220226930 · 2022-07-21 ·

A laser processing head includes a tubular main body, and a gas supply part disposed in the main body and allowing an assist gas supplied from outside to flow into an internal space of the main body. The gas supply part includes a first gas supply hole extending along a first axis on a plane orthogonal to an axis of a tube of the main body and opening at an inner circumferential surface of the main body, a second gas supply hole forming a predetermined angle relative to the first axis around the axis extending along a second axis on the plane orthogonal to the axis and opening at the inner circumferential surface, and a flow path forming ring facing the inner circumferential surface with a predetermined interval, and forming a cylindrical space extending along the axis between the flow path forming ring and the inner circumferential surface.

SURFACE PROCESSING DEVICE AND METHOD, AND THREE-DIMENSIONAL DEPOSITION DEVICE

A surface processing device, a surface processing method, and a three-dimensional deposition device are provided. Included are: a powder passage serving as a powder supply unit, which supplies a powder toward a working surface of an object to be processed; and a laser path serving as a light irradiation unit, which irradiates the powder before reaching the object to be processed with a light beam. An irradiation position of the light beam and an injection position of the powder on the working surface are offset.

LASER ASSISTED METAL ADHESION TO INDIUM TIN OXIDE ON GLASS, QUARTZ, SAPPHIRE AND SINGLE CRYSTAL SILICON WAFER SUBSTRATES FOR HEATED PLATFORMS FOR CELL CULTURING
20210380919 · 2021-12-09 ·

A method for directly bonding a metal to a transparent substrate includes providing a substrate; placing a metal foil directly on a face of the substrate; irradiating a portion of the metal foil with a laser beam so that metal corresponding to the portion melts and bonds directly to the substrate and forms a metal pad; and pumping a gas above the portion to prevent oxidation of the melted metal.

PROCESSING APPARATUS, PROCESSING METHOD AND PROCESSING SYSTEM

A processing apparatus is a processing apparatus that irradiates a surface of an object with processing light to process an object and is provided with: a light irradiation apparatus that emits first processing light to form a first irradiation area on the surface and emits second processing light to form a second irradiation area, at least a part of which overlaps with the first irradiation area, on the surface, and has a change member that is configured to change a state of an overlap between the first and second irradiation areas.

Large scale additive machine

The present disclosure generally relates to additive manufacturing systems and methods on a large-scale format. One aspect involves a build unit that can be moved around in three dimensions by a positioning system, building separate portions of a large object. The build unit has an energy directing device that directs, e.g., laser or e-beam irradiation onto a powder layer. In the case of laser irradiation, the build volume may have a gasflow device that provides laminar gas flow to a laminar flow zone above the layer of powder. This allows for efficient removal of the smoke, condensates, and other impurities produced by irradiating the powder (the “gas plume”) without excessively disturbing the powder layer. The build unit may also have a recoater that allows it to selectively deposit particular quantities of powder in specific locations over a work surface to build large, high quality, high precision objects.

MATERIAL DEPOSITION UNIT WITH MULTIPLE MATERIAL FOCAL ZONES, AND METHOD FOR BUILD-UP WELDING

A material deposition unit includes a radiation unit configured to emit electromagnetic radiation in a directed manner onto a workpiece along a beam axis extending in a beam direction and, and a powder discharge device having multiple powder discharge units configured to discharge powder in a directed form onto the workpiece. The powder discharge device includes at least a first powder discharge unit and a second powder discharge unit. The first powder discharge unit has a plurality of first powder-outlet openings with a first material focal zone. The second powder discharge unit has a plurality of second powder-outlet openings with a second material focal zone. The first material focal zone and the second material focal zone being spaced apart from one another in the beam direction.

Tight-Contact Jig for Secondary Battery Tab Laser Welding and Welding Method

Disclosed are a tight-contact jig for secondary battery tab laser welding including an upper tight-contact jig including a ring-shaped spray portion capable of performing surface spray in order to inhibit deterioration in weld quality due to reaction with hydrogen or oxygen in air at the time of laser welding for forming an electrode terminal and to inhibit the occurrence of short circuit due to deposition of spatter generated at the time of welding and a welding method.

Manufacturing Method of Welded Pipe and Manufacturing Device of Welded Pipe

Disclosed is a manufacturing method of a welded pipe, which includes: bending a stainless steel strip while conveying the stainless steel strip in one direction to thereby form a pipe; and welding a butting part of the formed pipe.

METHOD AND ARRANGEMENT FOR BUILDING METALLIC OBJECTS BY SOLID FREEFORM FABRICATION

Provided are a systems and methods for manufacturing objects by solid freeform fabrication, especially titanium and titanium alloy objects, wherein the deposition rate is increased by using two separate heat sources, one heat source for heating the deposition area on the base material and one heat source for heating and melting a metallic material, such as a metal wire or a powdered metallic material.

Laser treatment device rectifier device and laser treatment device
11355364 · 2022-06-07 · ·

A laser treatment device performing treatment by irradiating a target object having a plate surface with laser light, including: a light-transmitting region transmitting laser light emitted onto the target object; a rectifier that has a rectifier surface separated from the target object and extending along the plate surface of the target object and outward from the end of the light-transmitting region; a gas supply unit that feeds a gas to a gap between one side of the rectifier surface and the light-transmitting region, in a position separated from the light-transmitting region; and a gas exhaust unit that exhausts, on the other side that is on the other side of the light-transmitting region from the one side, the gas present in a gap between the rectifier surface and the target object from the gap, in a position separated from the light-transmitting region, thereby generating a stable local gas atmosphere.