The disclosure relates to methods and systems for deep welding a workpiece, a surface of the workpiece being irradiated by a first laser beam and a second laser beam. In a workpiece surface plane (OE) a first beam width B1 of the first laser beam is larger than a second beam width B2 of the second laser beam and in at least the workpiece surface plane (OE) the second laser beam lies inside the first laser beam. The intensity of the first laser beam alone is sufficient to produce a keyhole in the workpiece. The keyhole produced in the workpiece has a width KB in the workpiece surface plane (OE), KB substantially equaling B1, and B2≤0.75*KB. The methods and systems provide good seam quality, high penetration depth, and high welding speed.

A joining apparatus includes a pressor that cause the first joint target portion and the second joint target portion to butt against each other, a workpiece moving organizer that moves the first workpiece and the second workpiece along an extending direction of the first joint target portion and the second target portion, a separator that temporarily separates the first joint target portion and the second joint target portion from each other by deforming a part of a butting site between the first joint target portion and the second joint target portion; and a laser irradiator that irradiates a site at which the first joint target portion and the second joint target portion separated from each other approach each other again, with laser light on a downstream side of the separator in a moving direction of the first workpiece and the second workpiece.

A method of manufacturing a fabricated object includes forming the fabricated object by laminating metal powder, the fabricated object including an opening portion that communicates with a hollow internal space, mounting a plug in the opening portion, and welding the plug mounted in the opening portion to the fabricated object.

Anchoring devices for affixing an implanted lead at a target location in a patient are provided herein. Such anchoring devices include a helical body having a plurality of tines extending laterally outward from the lead when deployed that engage tissue to inhibit axial movement of the implanted lead. The plurality of tines are biased towards the laterally extended deployed configuration and fold inward towards the lead to a delivery configuration to facilitate delivery of the lead through a sheath. The tines may be angled in a proximal direction or in both proximal and distal directions and may include various features to assist in visualization and delivery of the lead.

Anchoring devices for affixing an implanted lead at a target location in a patient are provided herein. Such anchoring devices include a helical body having a plurality of tines extending laterally outward from the lead when deployed that engage tissue to inhibit axial movement of the implanted lead. The plurality of tines are biased towards the laterally extended deployed configuration and fold inward towards the lead to a delivery configuration to facilitate delivery of the lead through a sheath. The tines may be angled in a proximal direction or in both proximal and distal directions and may include various features to assist in visualization and delivery of the lead.

Laser welding device (1000) includes: laser oscillator (100); optical fiber (300) that transmits a laser beam (LB) generated in laser oscillator (100); laser beam emitting head (400) that is attached to the emission end of optical fiber (300) and emits laser beam (LB) toward workpiece (600); manipulator (500) with laser beam emitting head (400) attached thereto; and controller (200) that controls laser beam emitting head (400) so as to cause laser beam (LB) to be scanned three-dimensionally on the surface of workpiece (600). Controller (200) controls laser beam emitting head (400) so as to change a focal position of laser beam (LB) in accordance with a shape of a welded portion in workpiece (600).

A semiconductor device, including a semiconductor element, and a first wiring member and a second wiring member bonded to each other and being electrically connected to the semiconductor element. The first wiring member has an irradiation area for receiving irradiation of a laser beam. The semiconductor device also includes a protection member disposed on an area of the second wiring member opposite the irradiation area of the first wiring member, the protection member having a melting point higher than a melting point of at least one of the first wiring member and the second wiring member including the area on which the protection member is disposed.

Angled, single laser weld and a method of forming an angled, single laser weld including arranging a first and second faying surfaces of a first and second component adjacently to form an interface between the components; irradiating at least one of the first and second components at the interface with a laser, wherein the first faying surface defines a plane formed at an angle alpha in the range of +1-5 degrees to 60 degrees from an axis A perpendicular to the first front surface and the second faying surface matches the first faying surface; and forming a junction at the interface with an hourglass shaped weld.

Alloy compositions, structures, and production methods for an appropriate slit cut surface shape improve productivity by increasing welding speed and stabilizing quality during high speed welding in Ti-containing Fe—Ni—Cr alloy production. The Ti-containing Fe—Ni—Cr alloy contains, hereinafter in weight %, C: 0.001 to 0.03%, Si: 0.05 to 1.25%, Mn: 0.10 to 2.00%, P: 0.001 to 0.030%, S: 0.0001 to 0.0030%, Ni: 15 to 50%, Cr: 17 to 25%, Al: 0.10 to 0.80%, Ti: 0.10 to 1.5%, N: 0.003 to 0.025%, 0: 0.0002 to 0.007%, Fe as a remainder, and inevitable impurities, and when the number and size of titanium nitrides contained in material are evaluated in a freely selected field of view of 5 mm2, the titanium nitrides having sizes of not more than 15 μm are not less than 99.3% of total of the titanium nitrides.

Provided are a battery module housing welding method capable of solving a problem that a battery cell accommodated therein is damaged due to heat that occurs during welding, and a battery module manufactured thereby, and according to the battery module housing welding method of the present invention, a gap portion formed during assembling of a battery module housing is welded by lasers with different powers and sizes a plurality of times, thereby preventing damage to a battery cell due to high temperatures during welding of the housing.