A welded assembly includes a first sheet and a second sheet. The second sheet is disposed over a portion of the first sheet and defines an overlap portion between the first and second sheets. A weld fastening the second sheet to the first sheet in the overlap area connects the second sheet to the first sheet for distributing stress uniformly across a welded portion of the overlap area.

A welded assembly includes a first sheet and a second sheet. The second sheet is disposed over a portion of the first sheet and defines an overlap portion between the first and second sheets. A weld fastening the second sheet to the first sheet in the overlap area connects the second sheet to the first sheet for distributing stress uniformly across a welded portion of the overlap area.

Embodiments of the present disclosure relate to a battery module. According to an embodiment of the present disclosure, there is provided a battery module including a plurality of battery cells each including at least one electrode tab, and a bus bar in contact with the electrode tabs to electrically connect the plurality of battery cells, wherein the bus bar includes a plate in which a plurality of holes are formed, and the electrode tabs are inserted into at least a portion of the plurality of holes to electrically connect the plurality of battery cells.

Embodiments of the present disclosure relate to a battery module. According to an embodiment of the present disclosure, there is provided a battery module including a plurality of battery cells each including at least one electrode tab, and a bus bar in contact with the electrode tabs to electrically connect the plurality of battery cells, wherein the bus bar includes a plate in which a plurality of holes are formed, and the electrode tabs are inserted into at least a portion of the plurality of holes to electrically connect the plurality of battery cells.

A semiconductor device includes: a housing; a substrate inside the housing; first and second semiconductor circuits on the substrate; and first and second planar terminals electrically connected to the first and second semiconductor circuits, respectively, the first and second planar terminals stacked on top of each other, wherein each of the first and second planar terminals extends away from the housing.

A semiconductor device includes: a housing; a substrate inside the housing; first and second semiconductor circuits on the substrate; and first and second planar terminals electrically connected to the first and second semiconductor circuits, respectively, the first and second planar terminals stacked on top of each other, wherein each of the first and second planar terminals extends away from the housing.

A method for joining two joining partners includes applying a coating to at least one of the two joining partners so as to be arranged between the two joining partners before joining and joining the at least two joining partners to one another using ultrashort laser pulses of a laser beam of an ultrashort pulse laser. At least one joining partner is substantially transparent to the ultrashort laser pulses of the ultrashort pulse laser, and the coating comprises physical properties similar to at least one joining partner and/or a chemical constituent similar to at least one joining partner.

A method for joining two joining partners includes applying a coating to at least one of the two joining partners so as to be arranged between the two joining partners before joining and joining the at least two joining partners to one another using ultrashort laser pulses of a laser beam of an ultrashort pulse laser. At least one joining partner is substantially transparent to the ultrashort laser pulses of the ultrashort pulse laser, and the coating comprises physical properties similar to at least one joining partner and/or a chemical constituent similar to at least one joining partner.

An apparatus for thermally joining thermoplastic fiber composite components includes a pressurization arrangement for jointly covering, at least in a region of a joining zone, thermoplastic fiber composite components to be joined and applying pressure to the thermoplastic fiber composite components to press the thermoplastic fiber composite components against one another, at least in the joining zone, the pressurization arrangement being flexible, at least in some section or sections. A welding device is configured for welding the fiber composite components in the joining zone during pressurization. The pressurization arrangement and welding device are configured to weld the thermoplastic fiber composite components in a pressurized state in the joining zone. The pressurization arrangement is configured to maintain pressurization independently of the welding device until the joining zone solidifies. A cover is also disclosed for a pressurization device for thermally joining thermoplastic fiber composite components.

A method for working a first component and a second component comprises the following steps: providing the first component, which comprises a thermally sprayed electrically conductive layer, providing the second component, which has a longitudinally extended strip of copper, which at least in a first region has a thickness transversely to the longitudinal direction of more than 0.1 millimeter, arranging the strip and the layer one on top of the other, so that the first region of the strip and the layer have a contact region in common with one another, emitting a laser beam onto the contact region and forming a welded connection, which connects the strip and the layer to one another.